Cummins Engine Corp Columbus, IN Jan 2012 to Jan 2014 Senior sensor engineerWerner Enterprises
2009 to 2012 Truck DriverDelphi Electronics and Safety Kokomo, IN 1985 to 2008 Product designerRCA Indianapolis, IN Apr 1980 to Nov 1983 Manufacturing Methods EngineerMEEDCO, Inc Kokomo, IN Jan 1973 to Apr 1978 Chief Engineer
Education:
Univ. of N Dakota. 1968 BS in Mechanical EngineeringPurdue and Indiana University Kokomo, IN MBA (Not Completed) in Business
Frank Wilder - Indianapolis IN, US Loren Rasmussen - Kokomo IN, US
International Classification:
F16H009/00 F16H007/14 F16H063/00
US Classification:
474/114000, 474/070000, 474/125000
Abstract:
An electric machine for a vehicle comprising a shaft, a first one-way-clutch between the shaft and a driving member; and a second one-way-clutch between the shaft and a driven member is provided. The shaft is rotatably received within the electric machine. The first one-way-clutch transmits a first torque from the shaft to the driving member, but does not transmit a second torque from the driving member to the shaft. The second one-way-clutch transmits the second torque from the driven member to the shaft, but does not transmit the first torque from the shaft to the driven member.
Electronics Assembly And Electronics Package Carrier Therefor
Ralph Taylor - Noblesville IN, US Thomas Degenkolb - Noblesville IN, US Loren Rasmussen - Kokomo IN, US
International Classification:
H05K 7/20
US Classification:
361699000, 361719000
Abstract:
An electronics assembly is provided having a carrier that provides a controlled height variability between electronics packages and a heat sink device. The electronics assembly includes a substrate and electronics packages connected to the substrate. The assembly also includes a heat sink device positioned in thermal communication with a first side of the electronics packages. The assembly further includes a carrier disposed between the substrate and the heat sink device. The carrier has a resilient wall that biases the electronics packages towards the heat sink device such that a controlled bond line is provided between the first side of the electronics packages and the heat sink device.