Lubomyr T Romankiw

US Patent:

6430001, Aug 6, 2002

Filed:

Mar 16, 1995

Appl. No.:

08/405278

Inventors:

Timothy Joseph Chainer - Mahopac NY
Sol Krongelb - Katonah NY
Lubomyr Taras Romankiw - Briarcliff Manor NY
Edward John Yarmchuk - Somers NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G11B 1702

US Classification:

360 9908

Abstract:

An integrated data storage disk and disk drive assembly includes a rotatably supported magnetic disk for storing data. A rotor is fixedly joined to the disk for rotating the disk, and includes a plurality of rotor poles. A stator includes a plurality of stator poles positioned around the rotor for sequentially cooperating with respective ones of the rotor poles for rotating the rotor to rotate the disk. The disk and drive may be fabricated using lithographic and electroplating techniques, and a plurality of coaxial disks may be driven by a single disk drive in exemplary embodiments.

US Patent:

6461136, Oct 8, 2002

Filed:

Aug 26, 1999

Appl. No.:

09/383325

Inventors:

Peter A. Gruber - Mohegan Lake NY
Frederic Maurer - Valhalla NY
Lubomyr Taras Romankiw - Briarcliff Manor NY

Assignee:

International Business Machines Corp. - Armonk NY

International Classification:

H05K 310

US Classification:

425110, 118213, 118301

Abstract:

An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i. e. , as small as 10 m, and high aspect ratios, i. e.

US Patent:

6495005, Dec 17, 2002

Filed:

May 1, 2000

Appl. No.:

09/563442

Inventors:

Evan George Colgan - Chestnut Ridge NY
John Christopher Flake - Mohegan Lake NY
Lubomyr Taras Romankiw - Briarcliff Manor NY
Robert Luke Wisnieff - Ridgefield CT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C25D 1700

US Classification:

204224R, 204267, 20419615, 204269

Abstract:

An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.

US Patent:

6596624, Jul 22, 2003

Filed:

Jul 19, 2000

Appl. No.:

09/619745

Inventors:

Lubomyr Taras Romankiw - Briarcliff Manor NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 214763

US Classification:

438619, 438623, 438633

Abstract:

Disclosed is a multilayer integrated circuit structure joined to a chip carrier, and a process of making, in which the area normally occupied by a solid dielectric material in the IC is at least partially hollow. The hollow area can be filled with a gas, such as air, or placed under vacuum, minimizing the dielectric constant. Several embodiments and processing variants are disclosed. In one embodiment of the invention, the wiring layers, which are embedded in a temporary dielectric, alternate with via layers, also embedded in a temporary dielectric, in which the vias, besides establishing electrical communication between the wiring layers, also provide mechanical support for after the temporary dielectric is removed. Additional support is optionally provided by support structures though the interior levels and at the periphery of the chip. The temporary dielectric is removed subsequent to joining by dissolution or by ashing in an oxygen-containing plasma.

US Patent:

6708873, Mar 23, 2004

Filed:

Jul 8, 2002

Appl. No.:

10/191378

Inventors:

Peter A. Gruber - Mohegan Lake NY
Frederic Maurer - Valhalla NY
Lubomyr Taras Romankiw - Briarcliff Manor NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 3102

US Classification:

228256, 228 33, 2282481, 228260, 118 50, 118213, 222591, 427 97

Abstract:

An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i. e. , as small as 10 m, and high aspect ratios, i. e.

US Patent:

6844957, Jan 18, 2005

Filed:

Nov 29, 2001

Appl. No.:

09/996836

Inventors:

Keiji Matsumoto - Yokohama, JP
Lubomyr Taras Romankiw - Briarcliff Manor NY, US
Kuniaki Sueoka - Sagamihara, JP
Yoichi Taira - Tokyo, JP
Keizoh Takeda - Yamato, JP

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G02B 2600
G02F 11347

US Classification:

359296, 349 74

Abstract:

A structure and fabrication technology for a reflective, ambient light, low cost display is described incorporating a plurality of cells laid out side by side and stacked as many as three levels on top of each other. Each stack of three cells being driven by an array of TFT's positioned on the bottom layer. Each cell comprises a light transmitting front window, three levels of individual cells RGB (Red, Green, and Blue) stacked on top of each other, each level having its own individual electrode, each electrode being connected by vertical conducting via holes running through each transparent dielectric spacert and being connected to a individual TFT. The bottom panel having a reflective surface so as to provide maximum reflectivity of the ambient light. Placed under the reflective surface is an array of TFT's which provide the electrical impulses necessary to set each individual potential in each vertically stacked cell with respect to ground potential. A transmissive liquid crystal display can readily be fabricated by deleting the reflective surface.

US Patent:

6855240, Feb 15, 2005

Filed:

Jun 9, 2003

Appl. No.:

10/457194

Inventors:

Emanuel Israel Cooper - Scarsdale NY, US
Thomas Edward Dinan - San Jose CA, US
Lubomyr Taras Romankiw - New York NY, US
Hong Xu - Albany CA, US

Assignee:

Hitachi Global Storage Technologies Netherlands B.V. - Amsterdam

International Classification:

D25D003/56

US Classification:

205103, 205104, 205259, 205260

Abstract:

A cobalt-iron alloy film having saturation magnetization of at least about 2. 30 Telsa. The film alloy includes about 55 wt % to about 75 wt. % iron and the remainder cobalt. The film is made by a process in which the film is electrodeposited from an aqueous medium which includes one or more ferrous salts, one or more cobaltous salts, a buffer having a pKa of about 6 to about 8, at least one carboxylic acid having a pKa of between about 3. 5 and about 5. 5, an aromatic sulfinic acid or its salt and optionally, a halide salt and/or a surfactant. The alloy film is useful as a write head in magnetic recording.

US Patent:

7001498, Feb 21, 2006

Filed:

Oct 10, 2002

Appl. No.:

10/268633

Inventors:

Evan George Colgan - Chestnut Ridge NY, US
John Christopher Flake - Mohegan Lake NY, US
Lubomyr Taras Romankiw - Briarcliff Manor NY, US
Robert Luke Wisnieff - Ridgefield CT, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C25D 5/04

US Classification:

205133, 205117, 205118, 205122, 205123

Abstract:

An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.