Maik O Hach

US Patent:

8263918, Sep 11, 2012

Filed:

Jul 16, 2010

Appl. No.:

12/804231

Inventors:

Maik Hach - Cape Girardeau MO, US

Assignee:

Nordenia USA Inc. - Jackson MO

International Classification:

H05B 6/80
B65D 81/34

US Classification:

219730, 219725, 219727, 219728, 219729, 219731, 219732, 219759, 229242, 229903, 426107

Abstract:

A microwave packaging made of a flexible, heat-sealable laminate has a grid structure made of electrically non-conductive cells that do not absorb microwaves, and an electrically conductive metal grid that separates the cells from one another. The metal grid has a layer thickness of at least 1 μm, and the cells each have a size between 100 mmand 1200 mm. The proportion of the non-conductive area formed by the cells amounts to at least 50% of the total area. A liquid-tight outer film follows a first side of the metal grid directly or by way of at least one connecting layer, and a moisture-absorbent layer follows a second side of the metal grid directly or by way of at least one intermediate layer, and has a polymer base substance and extends essentially over the entire area of the laminate. The microwave packaging is formed from the laminate by heat-sealing.

US Patent:

20120318787, Dec 20, 2012

Filed:

Jun 17, 2011

Appl. No.:

13/163389

Inventors:

Maik Hach - Cape Girardeau MO, US

International Classification:

H05B 6/80

US Classification:

219725

Abstract:

A system and apparatus for a flexible package are provided. The flexible package includes a first sealing layer, a first outer layer, and a first grid layer. The first grid layer includes a plurality of intersecting grid members formed of an electroconductive material surrounding a plurality of spaced apertures. The flexible package also includes a second sealing layer, a second outer layer, and a second grid layer. The second grid layer includes a plurality of intersecting grid members formed of an electroconductive material surrounding a plurality of spaced apertures. The grid members of the first grid layer are spaced apart from the grid members of the second grid layer such that electrical discharge between the first grid layer and the second grid layer is prevented when the flexible package is exposed to electromagnetic radiation in a microwave range.

US Patent:

20130105471, May 2, 2013

Filed:

Oct 27, 2011

Appl. No.:

13/283376

Inventors:

Maik Hach - Cape Girardeau MO, US

International Classification:

H05B 6/80

US Classification:

219730

Abstract:

A system and apparatus for a flexible microwave package system is provided. The flexible microwave package system includes a front panel having a first sealing edge and an opposite second sealing edge and formed of at least a first outer layer adjacent an exterior of the flexible package. The system also includes a back panel having a first sealing edge and an opposite second sealing edge and formed of a perforated layer adjacent an interior of the flexible microwave package, an outer layer adjacent an exterior of the flexible package, and an absorbent layer extending from the first sealing edge to the second sealing edge between the perforated layer and the outer layer. The absorbent layer includes a layer of a nonwoven material. Adjacent edges of the front panel and the back panel are sealed together. Each layer contacts an adjacent layer without an intervening metallic layer.