Beverly-Hanks & Associates One Town Square Blvd., Suite 140 (828)6848999 (Office), (828)2793980 (Cell), (828)2740813 (Fax)
Description:
I am aBuncombe County native whose family roots proudly go back 7 generations in the mountains of Western North Carolina. My mountain upbringing has servedme well with an incredible work ethic, commitment to family, values, and faith. For yearsI haveworked alongsidemy husband of 26 years in the family business; Wright Family Custom Homes, where we designed, built, and sold new homes all over Western North Carolina, including Biltmore Lake and The Ramble Biltmore Forest.We have been honored with Gold Awards by the Asheville Homebuilders Association.Our dedication to honesty, integrity, and craftsmanship has setus apart as leaders in the industry.I worked as a Design Coordinator whereI designed and guided clients through the custom home construction process. I have personally overseen home construction from start to finish as a Job Superintendent, providing unsurpassed customer satisfaction skills and knowledge of homes and development. I am a National Homebuilders Associate and a member of the Asheville Homebuilders Association. Iwas honored with the Beverly-Hanks 2009 Rising Star Award! Very humbling but a true testament tomy work for this company and for the satisfaction ofmy customers! "I promise to provide you with the highest quality of professionalism and integrity in the real estate industry. Whether you are looking for that perfect property or you are preparing for that next move, my purpose is to serve you and serve you well! In my business, it is personal! I am Marilyn Wright and I am "Working Hard to Get You Home"
License Records
Marilyn L Wright
License #:
738 - Expired
Issued Date:
Aug 5, 1982
Renew Date:
Mar 31, 2002
Expiration Date:
Mar 31, 2002
Type:
Nail Technician
Marilyn Lee Wright
License #:
RN29450 - Expired
Category:
Nursing
Type:
Registered Nurse
Name / Title
Company / Classification
Phones & Addresses
Marilyn Denise Wright
Marilyn Wright MD Psychiatrist
270 International Cir, San Jose, CA 95119 (408)9726530
Marilyn H. Wright
MARILYN WRIGHT ENTERPRISES, LLC
Marilyn Wright
MASSILLON USBC WOMEN'S BOWLING ASSOCIATION
Marilyn Wright Treasurer
Charlotte Speech & Hearing Center Mfg Surgical Appliances/Supplies
Darin Chan - Campbell CA Douglas J. Bonser - Austin TX Marina V. Plat - San Jose CA Marilyn I. Wright - Austin TX Chih Yuh Yang - San Jose CA Lu You - San Jose CA Scott A. Bell - San Jose CA Philip A. Fisher - Foster City CA
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
H01L 214763
US Classification:
438645, 438706, 438639
Abstract:
A silicon oxide stress relief portion is provided between an amorphous carbon hardmask and a polysilicon layer to be etched to form a gate line. The stress relief portion relieves stress between the hardmask and the polysilicon, thereby reducing the risk of delamination of the hardmask prior to patterning of the polysilicon. The stress relief portion may be trimmed prior to patterning and used as an etch mask for patterning the polysilicon. The amorphous carbon hardmasked may be trimmed prior to patterning the stress relief portion to achieve a further reduction in gate line width.
Cvd Organic Polymer Film For Advanced Gate Patterning
Lu You - San Jose CA, US Marina V. Plat - San Jose CA, US Chih Yuh Yang - San Jose CA, US Scott A. Bell - San Jose CA, US Richard J. Huang - Cupertino CA, US Christopher F. Lyons - Fremont CA, US Mark S. Chang - Los Altos CA, US Marilyn I. Wright - Austin TX, US
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
H01L021/47 H01L031/0232
US Classification:
257437, 438636
Abstract:
A bottom anti-reflective coating comprising an organic polymer layer having substantially no nitrogen and a low compressive stress in relation to a polysilicon layer is employed as the lower layer of a bi-layer antireflective coating/hardmask structure to reduce deformation of a pattern to be formed in a patternable layer. The organic polymer layer is substantially transparent to visible radiation, enabling better detection of alignment marks during a semiconductor device fabrication process and improving overlay accuracy. The organic polymer layer provides excellent step coverage and may be advantageously used in the fabrication of structures such as FinFETs.
L-Shaped Spacer Incorporating Or Patterned Using Amorphous Carbon Or Cvd Organic Materials
Marilyn I. Wright - Sunnyvale CA, US Douglas J. Bonser - Austin TX, US Lu You - San Jose CA, US Kay Hellig - Dresden, DE
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
H01L029/72
US Classification:
438691, 438692, 438694, 257333, 257401
Abstract:
A multilayer L-shaped spacer is formed of a lower portion comprising a CVD organic material or amorphous carbon, and an upper portion comprised of a protective material. The upper portion is patterned using a photoresist mask. During that patterning, the underlying substrate is protected by a layer of CVD organic material or amorphous carbon. The CVD organic material or amorphous carbon is then patterned using the patterned protective material as a mask. The chemistry used to pattern the CVD organic material or amorphous carbon is relatively harmless to the underlying substrate. Alternatively, an L-shaped spacer is patterned without using a photoresist mask by forming an amorphous carbon spacer around a gate that is covered with a conformal layer of a conventional spacer material. The conventional spacer material is patterned using the amorphous carbon spacer as an etch mask. The amorphous carbon spacer is easily formed without the need for lithographic patterning, and therefore this method is preferable to methods using photoresist masks.
Antireflective Bi-Layer Hardmask Including A Densified Amorphous Carbon Layer
An amorphous carbon layer of an antireflective bi-layer hardmask is processed to increase its density prior to patterning of an underlying polysilicon layer using the bi-layer hardmask. The increased density of the layer increases its resistance to polysilicon etch chemistry, thus reducing the likelihood of patterning inaccuracies resulting from amorphous carbon depletion during polysilicon etch, and enabling the patterning of thicker polysilicon layers than can be reliably patterned without densification. The increased density also reduces stresses, thus reducing the likelihood of delamination. Densification may be performed by UV or e-beam irradiation after formation of an overlying protective layer. Densification may also be performed by annealing the amorphous carbon layer in situ prior to formation of the overlying protective layer. In the latter case, annealing reduces the amount of outgassing that occurs during formation of the protective layer, thus reducing the formation of pin holes.
Method For Patterning A Feature Using A Trimmed Hardmask
Marina V. Plat - San Jose CA, US Marilyn I. Wright - Sunnyvale CA, US Chih Yuh Yang - San Jose CA, US Douglas J. Bonser - Austin TX, US
Assignee:
Advanced Micro Devices - Sunnyvale CA
International Classification:
H01L021/336 H01L021/84 H01L021/3205 H01L021/302
US Classification:
438197, 438717, 438585, 438151
Abstract:
In the formation of a semiconductor device, one or more hardmasks are formed during a process for patterning a device feature. One or more of the hardmasks is subjected to an isotropic etch to trim the hardmask prior to patterning an underlying layer. The trimmed hardmask layer is preferably an amorphous carbon layer.
Semiconductor Device Having An Organic Anti-Reflective Coating (Arc) And Method Therefor
Douglas M. Reber - St. Ismier, FR Mark D. Hall - Austin TX, US Kurt H. Junker - Austin TX, US Kyle W. Patterson - Froges, FR Tab Allen Stephens - Austin TX, US Edward K. Theiss - Cedar Park TX, US Marilyn Irene Wright - Sunnyvale CA, US
Assignee:
Freescale Semiconductor, Inc. - Austin TX Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
H01L021/44
US Classification:
438669, 438671, 438725
Abstract:
In a making a semiconductor device, a patterning stack above a conductive material that is to be etched has a patterned photoresist layer that is used to pattern an underlying a tetraethyl-ortho-silicate (TEOS) layer. The TEOS layer is deposited at a lower temperature than is conventional. The low temperature TEOS layer is over an organic anti-reflective coating (ARC) that is over the conductive layer. The low temperature TEOS layer provides adhesion between the organic ARC and the photoresist, has low defectivity, operates as a hard mask, and serves as a phase shift layer that helps, in combination with the organic ARC, to reduce undesired reflection.
Capping Layer For Reducing Amorphous Carbon Contamination Of Photoresist In Semiconductor Device Manufacture; And Process For Making Same
In the fabrication of semiconductor devices using the PECVD process to deposit hardmask material such as amorphous carbon, structure and process are described for reducing migration of species from the amorphous carbon which can damage an overlying photoresist. In one embodiment useful to 248 nm and 193 nm photolithography exposure wavelengths, amorphous carbon is plasma-deposited on a substrate to pre-defined thickness and pre-defined optical properties. A SiON layer is combined with a silicon-rich oxide layer, a silicon-rich nitride layer or a TEOS layer to create a capping layer resistant to species-migration. Layers are formulated to pre-determined thicknesses, refractive indices and extinction coefficients. The capping stacks constitute an effective etch mask for the amorphous carbon; and the hardmask properties of the amorphous carbon are not compromised. The disclosure has immediate application to fabricating polysilicon gates.
Semiconductor Device Having An Organic Anti-Reflective Coating (Arc) And Method Therefor
Douglas M. Reber - St. Ismier, FR Mark D. Hall - Austin TX, US Kurt H. Junker - Austin TX, US Kyle W. Patterson - Froges, FR Tab Allen Stephens - Austin TX, US Edward K. Theiss - Cedar Park TX, US Marilyn Irene Wright - Sunnyvale CA, US
In a making a semiconductor device, a patterning stack above a conductive material that is to be etched has a patterned photoresist layer that is used to pattern an underlying a tetraethyl-ortho-silicate (TEOS) layer. The TEOS layer is deposited at a lower temperature than is conventional. The low temperature TEOS layer is over an organic anti-reflective coating (ARC) that is over the conductive layer. The low temperature TEOS layer provides adhesion between the organic ARC and the photoresist, has low defectivity, operates as a hard mask, and serves as a phase shift layer that helps, in combination with the organic ARC, to reduce undesired reflection.
Medicine Doctors
Dr. Marilyn D Wright, San Jose CA - MD (Doctor of Medicine)
Medical School Michigan State University Graduated: 1986 Medical School Spectrum Health Butterworth Camp Graduated: 1986 Medical School University Hi J a Burns School Med Graduated: 1986