Mark Richard Boone

US Patent:

6626931, Sep 30, 2003

Filed:

Dec 26, 2000

Appl. No.:

09/748598

Inventors:

Juan G. Milla - Mesa AZ
Mark R. Boone - Mesa AZ

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

A61N 100

US Classification:

607 1, 607 5, 607 9, 607 36, 361764

Abstract:

An implantable medical device having reduced volume includes a high voltage die mounted to a substrate and assembled into a device body. The die is flip chip mounted, reducing the size of the substrate and of the device. A high voltage implantable medical device such as an implantable cardio defibrillation device or a hybrid device has a high voltage flip chip die mounted to a substrate containing implantable medical device circuitry to operate with the high voltage flip chip.

US Patent:

6670217, Dec 30, 2003

Filed:

Apr 29, 2002

Appl. No.:

10/135911

Inventors:

Juan G. Milla - Mesa AZ
Mark R. Boone - Gilbert AZ

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

H01L 2144

US Classification:

438107, 438109

Abstract:

Methods are provided for forming a die package. The method comprises stiffening a flexible substrate to provide a first flexibility of the flexible substrate, forming a mounting element on a first side of the flexible substrate, and mounting a first side of a die on a second side of the flexible substrate. In addition, the method comprises adjusting the stiffening to provide a second flexibility of the flexible substrate that is greater than the first flexibility, and positioning the flexible substrate to couple a contact of the flexible substrate with a second side of the die.

US Patent:

6836022, Dec 28, 2004

Filed:

Feb 13, 2003

Appl. No.:

10/365765

Inventors:

Mark R. Boone - Gilbert AZ
Andreas A. Fenner - Chandler AZ
Juan G. Milla - Mesa AZ
Lary R. Larson - Gold Canyon AZ

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

H01L 2348

US Classification:

257778, 257659, 257738

Abstract:

A flip-chip package comprises a substrate having at least one layer and a component flip-chip mounted to the substrate, the component having a field termination ring. The flip-chip package further comprises a shield plane interposed between the at least one layer of substrate and the field termination ring.

US Patent:

7477943, Jan 13, 2009

Filed:

Nov 26, 2003

Appl. No.:

10/723016

Inventors:

Ralph B. Danzl - Tempe AZ, US
Mark R. Boone - Gilbert AZ, US
Paul F. Gerrish - Phoenix AZ, US
Michael F. Mattes - Chandler AZ, US
Tyler Mueller - Phoenix AZ, US
Jeff Van Wagoner - Gilbert AZ, US

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

A61N 1/39

US Classification:

607 5, 607 36

Abstract:

Methods and apparatus are provided for manufacturing a medical device. An implantable medical device includes a semiconductor substrate, an epitaxial layer, and a power transistor. The epitaxial layer overlies the semiconductor substrate. The power transistor is formed in the epitaxial layer and includes a first electrode, a control electrode, and a second electrode. The power transistor has a voltage breakdown greater than 100 volts. The current flow of the power transistor is vertical through the epitaxial layer to the semiconductor substrate. A backside contact couples to the first electrode of the power transistor. A method of manufacturing a medical device includes a power transistor formed in an epitaxial layer overlying a semiconductor substrate. A deep trench is etched through the epitaxial layer exposing the semiconductor substrate. A first electrode contact region couples to an exposed area of the semiconductor substrate in the deep trench.

US Patent:

8532785, Sep 10, 2013

Filed:

Sep 26, 2012

Appl. No.:

13/626977

Inventors:

Lonny V. Cabelka - San Clemente CA, US
Mark R. Boone - Gilbert AZ, US
Marshall J. Rasmussen - Mesa AZ, US

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

A61N 1/00

US Classification:

607 59

Abstract:

Recent advancements in power electronics technology have provided opportunities for enhancements to circuits of implantable medical devices. The enhancements have contributed to increasing circuit miniaturization and an increased efficiency in the operation of the implantable medical devices. The therapy delivery circuits and techniques of the disclosure facilitate generation of a therapy stimulation waveform that may be shaped based on the patient's physiological response to the stimulation waveform. The generated therapy stimulation waveforms include a stepped leading-edge that may be shaped having a varying slope and varying amplitudes associated with each of the segments of the slope. Unlike the truncated exponential waveform delivered by the conventional therapy delivery circuit which is based on the behavior of the output capacitors (i. e. , i=C(dV/dt)), the stimulation waveform of the present disclosure may be dynamically shaped as a function of an individual patient's response. The dynamically shaped therapy stimulation waveforms facilitate achieving lower capture thresholds which reduces the device's supply consumption thereby increasing longevity of the device and facilitate a reduction of tissue damage.

US Patent:

20130334680, Dec 19, 2013

Filed:

Jun 15, 2012

Appl. No.:

13/524253

Inventors:

Mark R. Boone - Gilbert AZ, US
Mohsen Askarinya - Chandler AZ, US
Randolph E. Crutchfield - Scottsdale AZ, US
Erik J. Herrmann - Mesa AZ, US
Mark S. Ricotta - Tempe AZ, US
Lejun Wang - Chandler AZ, US

International Classification:

H01L 23/498
H01L 21/56

US Classification:

257737, 438114, 257E23068, 257E21499

Abstract:

A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips.

US Patent:

20130335927, Dec 19, 2013

Filed:

Jun 15, 2012

Appl. No.:

13/524222

Inventors:

Mark R. Boone - Gilbert AZ, US

International Classification:

H05K 1/18
H01F 5/00

US Classification:

361748, 336200

Abstract:

A planar transformer assembly, for use in charging capacitors of an ICD, includes windings arranged to minimize voltage across intervening dielectric layers. Each secondary winding of a preferred plurality of secondary windings is arranged relative to a primary winding, in a hierarchical fashion, such that the DC voltage, with respect to ground, of a first secondary winding, of the plurality of secondary windings, is lower than that of a second secondary winding, with respect to ground, wherein the first secondary winding is in closest proximity to the primary winding. The primary winding and each secondary winding are preferably formed on a corresponding plurality of dielectric layers.

US Patent:

20130335937, Dec 19, 2013

Filed:

Jun 15, 2012

Appl. No.:

13/524368

Inventors:

Mohsen Askarinya - Chandler AZ, US
Mark R. Boone - Gilbert AZ, US
Andreas A. Fenner - Chandler AZ, US
Lejun Wang - Chandler AZ, US
Kenneth Heames - Mesa AZ, US

International Classification:

H05K 1/18

US Classification:

361764

Abstract:

A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.