Mark S Frater

US Patent:

6355360, Mar 12, 2002

Filed:

Oct 5, 2000

Appl. No.:

09/684166

Inventors:

Mark S. Frater - Stockton CA

Assignee:

R.E. Service Company, Inc. - Lodi CA

International Classification:

B32B 1500

US Classification:

428607, 428606, 428612, 428626, 428652, 428677, 428687, 428198, 428201, 428926

Abstract:

A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasably bonded with resistance welds and adhesive to at least one surface of the substrate layer.

US Patent:

6783860, Aug 31, 2004

Filed:

Aug 30, 2001

Appl. No.:

09/945125

Inventors:

Mark S. Frater - Lodi CA

Assignee:

R. E. Service Company, Inc. - Lodi CA

International Classification:

B32B 2738

US Classification:

428416, 428413, 428414, 428418, 4282974, 4282977, 428332

Abstract:

A laminated entry and exit material for drilling planar sheets such as printed circuit boards having a metal foil layer bonded to a fibrous core layer with an adhesive containing a particulate lubricant such as graphite or polyethylene glycol and cold or hot pressed. A second metal layer is preferably bonded to the fibrous core layer. The core of one embodiment of the exit material includes a particulate lubricant such as graphite or polyethylene glycol incorporated in the core at the time of manufacture of the core. The circuit board is placed between the entry and exit materials. Drill friction and heat are reduced by the lubricants and the heat sink provided by the foil thereby extending the service life of a drill.

US Patent:

61299901, Oct 10, 2000

Filed:

Nov 17, 1998

Appl. No.:

9/193461

Inventors:

Mark S. Frater - Stockton CA

Assignee:

R. E. Service Company, Inc. - Lodi CA

International Classification:

B32B 1501

US Classification:

428607

Abstract:

A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasibly bonded to at least one surface of the substrate layer.

US Patent:

61299987, Oct 10, 2000

Filed:

Apr 10, 1998

Appl. No.:

9/058262

Inventors:

Mark S. Frater - Stockton CA

Assignee:

R.E. Service Company, Inc. - Lodi CA

International Classification:

B32B 1520

US Classification:

428677

Abstract:

A sheet laminate for use in a press lay-up between printed circuit board panels having a steel alloy substrate layer and a copper foil layer disposed on at least one surface of the substrate layer. The foil layer is attached onto the surface of the substrate layer by a plurality of occurrences of adhesive material disposed along the boundary of the foil layer such that gaps are defined between occurrences of the adhesive material.

US Patent:

61270512, Oct 3, 2000

Filed:

Oct 29, 1998

Appl. No.:

9/182956

Inventors:

Mark S. Frater - Stockton CA

Assignee:

R. E. Service Company, Inc. - Lodi CA

International Classification:

B32B 1520

US Classification:

428677

Abstract:

A sheet laminate for use in a press lay-up between printed circuit board panels having a metal substrate layer and a copper foil layer disposed on at least one surface of the substrate layer. The foil layer is attached onto the surface of the substrate layer by a plurality of metal-to-metal bonds disposed along the boundary of the foil layer such that gaps are defined between the bonds.

US Patent:

62354043, May 22, 2001

Filed:

Jul 20, 2000

Appl. No.:

9/620109

Inventors:

Mark S. Frater - Stockton CA

Assignee:

R.E. Service Company, Inc. - Lodi CA

International Classification:

B32B 1501

US Classification:

428607

Abstract:

A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasibly bonded to at least one surface of the substrate layer.

US Patent:

61300004, Oct 10, 2000

Filed:

Dec 11, 1998

Appl. No.:

9/210349

Inventors:

Mark S. Frater - Stockton CA

Assignee:

R. E. Service Company, Inc. - Lodi CA

International Classification:

B32B 3300

US Classification:

428687

Abstract:

A corrosion resistant sheet alloy separator sheet for use in a press lay-up between printed circuit board panels.