Jeffrey ODell - Deephaven MN Thomas Verburgt - Eden Prairie MN Mark Harless - New Hope MN Cory Watkins - Ramsey MN
Assignee:
August Technology Corp. - Bloomington MN
International Classification:
G06K 900
US Classification:
382149, 25055939
Abstract:
An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection, for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
Automated Wafer Defect Inspection System And A Process Of Performing Such Inspection
Jeffrey O'Dell - Deephaven MN, US Thomas Verburgt - Eden Prairie MN, US Mark Harless - New Hope MN, US Steve Herrmann - Chaska MN, US
Assignee:
August Technology Corp. - Bloomington MN
International Classification:
G06K009/00
US Classification:
382141, 382145, 382149, 348126, 348 86, 438 16
Abstract:
An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
Data Transfer Device With Data Frame Grabber With Switched Fabric Interface Wherein Data Is Distributed Across Network Over Virtual Lane
A frame grabber with switched fabric interface where in varying embodiments the fabric interface may be one of InfiniBand, Star Fabric, or PCI Express or the like.
Inspection Tool With A 3D Point Sensor To Develop A Focus Map
Norman L. Oberski - Chaska MN, US Mark R. Harless - Plymouth MN, US
Assignee:
Rudolph Technologies, Inc. - Flanders NJ
International Classification:
G01N 21/84 G01N 21/88 G01N 21/86 G01B 11/06
US Classification:
25055927, 25055919, 25055922, 356630, 382145
Abstract:
An inspection system, and process for use thereof, for inspecting semiconductors or like substrates. The inspection system includes an inspection device and an auxiliary sensor apart from the inspection device. The auxiliary sensor is used to collect height data and generate a map of a semiconductor or like substrate to aids in focusing the inspection device.
Cory Watkins - Chanhassen MN, US Mark Harless - Plymouth MN, US David Vaughnn - Edina MN, US Pat Simpkins - Edina MN, US Shaileshkumar Goyal - Rajasthan, IN Gerald Brown - Plano TX, US Brian Delsey - Frisco TX, US
A method and apparatus for dynamically focusing an imaging mechanism on a moving target surface having a variable geometry is herein disclosed. Apparatus for focusing an imaging mechanism may include an objective, a prism, or another optical device that forms part of an optical train of an imaging mechanism, a sensor for measuring a distance to the target surface, and a mechanism for modifying the depth of focus of the objective, prism or other optical device. Data from the sensor may be used to create a predictive model of the target surface. Data from the sensor is also used to fit or correlate the generated model to an exemplary target. Data from the correlated model is used to drive the mechanism for modifying the depth of focus of the objective, prism, or other optical device to maintain the surface of the exemplary target in focus.
Cory Watkins - Eden Prairie MN, US Mark Harless - Plymouth MN, US David Vaughnn - Edina MN, US Pat Simpkins - Edina MN, US Shaileshkumar Goyal - Rajasthan, IN Gerald Brown - Plano TX, US Brian Delsey - Frisco TX, US
A method and apparatus for dynamically focusing an imaging mechanism on a moving target surface having a variable geometry is herein disclosed. Apparatus for focusing an imaging mechanism may include an objective, a prism, or another optical device that forms part of an optical train of an imaging mechanism, a sensor for measuring a distance to the target surface, and a mechanism for modifying the depth of focus of the objective, prism or other optical device. Data from the sensor may be used to create a predictive model of the target surface. Data from the sensor is also used to fit or correlate the generated model to an exemplary target. Data from the correlated model is used to drive the mechanism for modifying the depth of focus of the objective, prism, or other optical device to maintain the surface of the exemplary target in focus.
Cory Watkins - Chanhassen MN, US Mark Harless - Plymouth MN, US Francy Abraham - Singapore, SG
Assignee:
Rudolph Technologies, Inc. - Flanders NJ
International Classification:
G06K 9/00 G01N 21/86
US Classification:
382145, 25055936
Abstract:
A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the images of the normal edge of the wafer and for analyzing the images of the top edge of the wafer and the images of the normal edge of the wafer for wafer edge defects.
Automated Wafer Defect Inspection System Using Backside Illumination
Mark Harless - Plymouth MN, US Jeremy Jenum - Plymouth MN, US Willard Charles Raymond - Plymouth MN, US
Assignee:
Rudolph Technologies, Inc. - Flanders NJ
International Classification:
H04N 9/47
US Classification:
348126, 348 76
Abstract:
A defect inspection system for the semiconductor and microelectronics industry. More particularly, the present invention relates to an automated defect inspection system for wafers or other semiconductor or electronic substrates of any kind or type that are transparent, translucent, opaque or otherwise capable of allowing at least some light to pass through.
Mark Harless 1986 graduate of William Byrd High School in Vinton, VA is on Classmates.com. See pictures, plan your class reunion and get caught up with Mark ...
Stephanie Tapley (1971-1974), Kristina Sawyer (1987-1993), Philip Ruiz (1992-1997), Kathy Smith (1962-1964), Patrick Smith (1965-1972), Mark Harless (1969-1970)