Mark G Kirschner

US Patent:

6468155, Oct 22, 2002

Filed:

May 8, 2001

Appl. No.:

09/851270

Inventors:

David F. Zucker - New York NY
Leigh Zarelli - New York NY
R. Montrose Graham - New York NY
Mark L. Kirschner - Maplewood NJ
Sarah F. Davies - Wilmington DE
V. Maximillian Garcia - New Haven CT
Eric Berlin - Maplewood NJ
William B. Feehan - Princeton Junction NJ
Richard Mass - New York NY
Derek J. Murphy - South Orange NJ

Assignee:

Skillgames, Inc. - New York NY

International Classification:

A63F 1300

US Classification:

463 23, 463 29, 463 42

Abstract:

Systems and methods are provided to facilitate games of skill for prizes played via a communication network. According to one embodiment, a potential game to be played at a remote player device via a communication network is determined. The potential game is evaluated to estimate an amount of player skill required to play the potential game, the evaluation being performed based on a sample of player performance information. The potential game is also evaluated to determine an ability of an automated game playing device to play the potential game. The potential game is modified if (i) the amount of player skill required is unacceptable or (ii) the ability of the automated game playing device is unacceptable.

US Patent:

54395569, Aug 8, 1995

Filed:

Nov 1, 1993

Appl. No.:

8/143590

Inventors:

Rustam H. Sethna - New Brunswick NJ
Mark J. Kirschner - Morristown NJ
Richard W. Potthoff - Scotch Plains NJ

Assignee:

The BOC Group, Inc. - New Providence NJ

International Classification:

D21C 1104

US Classification:

162 3011

Abstract:

A method of producing oxidized white liquor from white liquor in which sodium sulfide is oxidized to sodium sulfate. In accordance with the method, an oxygen containing gas is contacted with the white liquor at a temperature of at least 110. degree. C. and such that the total pressure of oxygen and water vapor is no less than 9. 2 atmospheres during the contacting.

US Patent:

52308464, Jul 27, 1993

Filed:

Sep 5, 1991

Appl. No.:

7/754347

Inventors:

Satish S. Tamhankar - Scotch Plains NJ
Mark J. Kirschner - Morristown NJ

Assignee:

The BOC Group, Inc. - New Providence NJ

International Classification:

C04B 3700

US Classification:

264 61

Abstract:

A method for heat processing of multilayered ceramic articles containing internal conductive metal patterns that have been formed from multiple ceramic green sheets individually coated with inks or pastes containing conductor metal/metal oxide material, and thereafter assembled in registry with each other and laminated. The heat treating method to convert the laminate to the final ceramic article includes a first heating stage under conditions to promote burn-out of the organic polymeric binder present, a second stage performed under conditions to reduce the metallic conductor, and a third stage to sinter the multilayered composite to form the final ceramic article. The invention is characterized by the presence of moisture in an amount of from about 0. 5% to about 3% of the gaseous atmosphere in at least the sintering stage, and preferably at both the binder burnout stage and the sintering stage. Multilayered articles heat treated under these conditions exhibit a combination of improved properties, including little or no staining in combination with improved conductivity and dielectric properties.

US Patent:

53024125, Apr 12, 1994

Filed:

May 14, 1992

Appl. No.:

7/883794

Inventors:

Satish S. Tamhankar - Scotch Plains NJ
Mark J. Kirschner - Morristown NJ

Assignee:

The BOC Group, Inc. - Murray Hill NJ

International Classification:

B05D 100

US Classification:

427102

Abstract:

The present invention provides an improved method for firing thick film inks in hybrid circuits which comprises firing different copper compatible thick film materials in a single firing atmosphere. The method comprises the steps of providing a paste suitable for application to a ceramic substrate, applying the paste to the substrate by a conventional technique such as screen printing, drying the substrate, and firing the substrate at an elevated temperature in an ambient comprising an inert gas and carbon dioxide to form the electrical component. In another embodiment, the substrate is fired in an ambient comprising only carbon dioxide.

US Patent:

59721650, Oct 26, 1999

Filed:

Jan 17, 1997

Appl. No.:

8/785262

Inventors:

Rustam H. Sethna - New Brunswick NJ
Mark J. Kirschner - Morristown NJ

Assignee:

The BOC Group, Inc. - New Providence NJ

International Classification:

D21C 1104

US Classification:

162 3011

Abstract:

White liquor produced from black liquor is partially or completed oxidized. The white liquor contains dregs that are utilized as a carbon based catalyst. Dregs are produced by separating the dregs from green liquor an intermediate product between the black liquor and the oxidized white liquor. After formation of the oxidized white liquor, the dregs are separated therefrom to form a waste dreg stream which can be recycled so that part of the dregs present within the dregs containing white liquor stream to be oxidized is contributed by the waste dreg stream.

US Patent:

52425355, Sep 7, 1993

Filed:

Sep 29, 1992

Appl. No.:

7/953442

Inventors:

Edward Chang - New Providence NJ
Richard Paciej - Lansdale PA
Mark J. Kirschner - Morristown NJ

Assignee:

The BOC Group, Inc. - New Providence NJ

International Classification:

B44C 122
C23F 100

US Classification:

156634

Abstract:

A method of forming a copper circuit pattern on a ceramic substrate. In accordance with the method, first and second layers of copper oxide and copper are applied to the ceramic substrate. Selected regions of the copper are then masked so that unmasked regions are formed on the copper in a configuration of the copper circuit pattern. Masked regions are formed on the copper adjacent the unmasked regions, where copper cannot be plated. The unmasked regions of the copper are plated in a neutral pH solution by a reverse pulse plating process. The masking is then removed and the copper and copper oxide layers are etched so that the copper and copper oxide is removed from the unmasked regions. Thereafter, the remaining copper is direct bonded to the substrate.