Mark A Kostinovsky from 1515 Hyde Park Blvd #9, Houston, TX 77006, age 63, Phone: (713)8740737

Oilfield Tools Comprising Modified-Soldered Electronic Components And Methods Of Manufacturing Same
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US Patent:

20100012708, Jan 21, 2010
Filed:

Jul 16, 2008
Appl. No.:

12/173914
Inventors:

Rejanah Steward - Richmond TX, US
Glen Schilling - Richmond TX, US
Manuel Marya - Stafford TX, US
Nitin Vaidya - Missouri City TX, US
Anthony Collins - Houston TX, US
Mark Kostinovsky - Houston TX, US
Assignee:

Schlumberger Technology Corporation - Sugar Land TX
International Classification:

B23K 31/02
B23K 35/34
B23K 1/20
US Classification:

228209, 148 24, 228101, 228260, 228256
Abstract:

Oilfield tools, assemblies and methods of manufacturing same are described comprising a modified-soldered electronic component, wherein the modified-solder includes a high-melting metal matrix and from about 0.1 to about 20 weight percent, based on total weight of the modified solder, of a strength-reinforcing additive dispersed in the metal matrix, the additive comprising a polyhedral oligomeric silsesquioxane. Methods of using the oilfield tools and assemblies in oilfield operations are also described.

Additive Manufactured 3D Electronic Substrate
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US Patent:

20200120813, Apr 16, 2020
Filed:

Oct 10, 2018
Appl. No.:

16/156750
Inventors:

- Sugar Land TX, US
Mark Kostinovsky - Houston TX, US
Man To - Saint Nom La Breteche, FR
International Classification:

H05K 3/46
H05K 3/12
H05K 3/34
H05K 1/02
H05K 1/18
H05K 1/11
Abstract:

A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.

Tin-Antimony-Based High Temperature Solder For Downhole Components
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US Patent:

20160311065, Oct 27, 2016
Filed:

Dec 12, 2014
Appl. No.:

15/104179
Inventors:

- Sugar Land TX, US
Mark Kostinovsky - Houston TX, US
Chandradip Pravinbhai Patel - Stafford TX, US
International Classification:

B23K 35/26
B23K 35/02
E21B 47/12
E21B 17/00
E21B 47/00
B23K 1/00
C22C 13/02
Abstract:

A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the down-hole tool comprises a first component, a second component, and a solder electrically and mechanically coupling the first and second components, wherein the solder comprises or consists of: from 9.6 to 10.2 weight % of antimony; from 0.01 to 0.25 weight % of manganese; and tin.

Soldered Components For Downhole Use
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US Patent:

20150184467, Jul 2, 2015
Filed:

Mar 12, 2015
Appl. No.:

14/656198
Inventors:

- Sugar Land TX, US
Mark Alex Kostinovsky - Houston TX, US
Francis Dupouy - Stonehouse, GB
Glen Dell Schilling - Richmond TX, US
Gilles Iafrate - Clamart Cedex, FR
F. Patrick McCluskey - Ellicott City MD, US
International Classification:

E21B 17/02
B23K 1/20
B23K 1/00
Abstract:

The disclosure describes soldering a first component () to a second component () for use in a downhole circuit, device and/or tool. The first component () includes an electrically conductive contact region () finished with a metallic finish layer (). The soldering includes disposing a layer of manganese () adjacent to the metallic finish layer (), and applying solder () to the layer of manganese (). The solder () used in the soldering of the two components is a mixture of copper, silver and tin.

High Temperature Solder For Downhole Components
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US Patent:

20140290931, Oct 2, 2014
Filed:

Mar 31, 2014
Appl. No.:

14/231009
Inventors:

- College Park MD, US
- Sugar Land TX, US
F. Patrick McCluskey - Ellicott City MD, US
Mark Kostinovsky - Houston TX, US
Glen Schilling - Richmond TX, US
Assignee:

University of Maryland, College Park - College Park MD
SCHLUMBERGER TECHNOLOGY CORPORATION - Sugar Land TX
International Classification:

B23K 35/26
E21B 43/00
US Classification:

166 66, 420560
Abstract:

A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises a first component, a second component, and a solder electrically and mechanically coupling the first and second components, wherein the solder comprises or consists of: from 0.001 to 1.0 weight % of copper; from 2.5 to 4.0 weight % of silver; from 0.01 to 0.25 weight % of manganese; and tin.

Mark A Kostinovsky