Mark L Pierson

US Patent:

58893210, Mar 30, 1999

Filed:

Jun 17, 1997

Appl. No.:

8/877538

Inventors:

Thomas M. Culnane - Lanesboro PA
Michael A. Gaynes - Vestal NY
Ramesh R. Kodnani - Binghamton NY
Mark V. Pierson - Binghamton NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2348

US Classification:

257701

Abstract:

A stiffener (34 or 52 or 72) includes a pathway which allows gases and fluids, such as air, to be vented from the interface between surface bonding regions (35 or 60 or 74) of the stiffener and an adhesive (38 or 56 or 80) on a flexible substrate (36 or 54 or 78). The pathway may take the form of a porous material used for the stiffener or one or more bore holes (58 or 59 or 70) formed in the stiffener. The stiffener may also include an internal cavity (76) for promoting venting of fluids and gases. By venting fluid and gases from the adhesive/stiffener interface, better adhesion between the stiffener and flexible substrate is achieved.

US Patent:

58625887, Jan 26, 1999

Filed:

Aug 14, 1995

Appl. No.:

8/514703

Inventors:

Craig G. Heim - Kirkwood NY
Russell H. Lewis - Fort Collins CO
Mark V. Pierson - Binghamton NY
Karl J. Puttlitz - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 334
H05K 1304

US Classification:

29840

Abstract:

A method for producing interconnect structures and circuit boards including placing an area array component having connection bumps on the corresponding metal contacts on a substrate disposed on a backing plate, providing heat curable joining material in communication with the bumps and contacts, contacting a gas nozzle directly to a portion of the substrate surrounding the component to press the substrate between the nozzle and the backing plate to restrain the substrate from wrapping, heating the component, the joining material and the substrate proximate the metal contacts while maintaining the nozzle on the substrate to cure the joining material, and cooling the component, the joining material and the substrate. Selected components can also be replaced utilizing the gas nozzle for restraining the substrate from wrapping.

US Patent:

61791962, Jan 30, 2001

Filed:

Feb 7, 2000

Appl. No.:

9/499863

Inventors:

Craig G. Heim - Kirkwood NY
Russell H. Lewis - Fort Collins CO
Mark V. Pierson - Binghamton NY
Karl J. Puttlitz - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 100
B23K 500
B23K 3700
B23K 120
B23K 1002

US Classification:

228 61

Abstract:

Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.

US Patent:

60681756, May 30, 2000

Filed:

Sep 29, 1998

Appl. No.:

9/162739

Inventors:

Craig G. Heim - Kirkwood NY
Russell H. Lewis - Fort Collins CO
Mark V. Pierson - Binghamton NY
Karl J. Puttlitz - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 3702
B23K 100
B23K 500
B23K 3100
B23K 3102

US Classification:

228 45

Abstract:

Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.