Mark E Schultz

US Patent:

20180124949, May 3, 2018

Filed:

Nov 6, 2017

Appl. No.:

15/803945

Inventors:

- Armonk NY, US
Kevin M. O'CONNELL - Rochester MN, US
Mark D. SCHULTZ - Ossining NY, US
Shurong TIAN - Mount Kisco NY, US

International Classification:

H05K 7/20
H01L 23/473
H01L 23/427

Abstract:

A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.