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Mark L Wisniewski

age ~66

from Mentor, OH

Also known as:
  • Mark Wishiewski

Mark Wisniewski Phones & Addresses

  • Mentor, OH
  • Canton, IL
  • Essex, MD
  • Buffalo, NY
  • Saint Paul, MN
  • Greenfield, WI
  • Independence, OH
  • Willowick, OH

Medicine Doctors

Mark Wisniewski Photo 1

Mark Lloyd Wisniewski

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Specialties:
Anesthesiology
Pediatric Anesthesiology
Education:
Eastern Virginia Medical School (1991)

Us Patents

  • Thermal Transfer Laminate

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  • US Patent:
    6461722, Oct 8, 2002
  • Filed:
    Oct 30, 2000
  • Appl. No.:
    09/702355
  • Inventors:
    Mark D. Kittel - Berea OH
    Richard L. Sandt - Brunswick OH
    Charles K. Herrmann - Cleveland Heights OH
    Mark Wisniewski - Mentor OH
  • Assignee:
    Avery Dennnison Corporation - Pasadena CA
  • International Classification:
    B32B 2714
  • US Classification:
    428195, 428204, 428207, 428211, 428913, 428914
  • Abstract:
    This invention relates to a thermal transfer laminate, comprising: a facestock comprising a first layer having an upper surface and a lower surface, and a heat-activatable adhesive layer underlying the lower surface of said first layer; an adhesion-promoting layer overlying the upper surface of said first layer; an abrasion-resistant transparent coating layer overlying said adhesion-promoting layer; and another adhesive layer overlying said abrasion-resistant coating layer. In one embodiment, an ink or graphics layer overlies the upper surface of the first layer of the facestock and provides a pictorial design and/or print message. In one embodiment, the laminate is adhered to a carrier sheet. In one embodiment, the laminate is adhered to a substrate such as an automotive interior surface.
  • In-Mold Labels And Uses Thereof

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  • US Patent:
    6726969, Apr 27, 2004
  • Filed:
    Jan 28, 1997
  • Appl. No.:
    08/789292
  • Inventors:
    Ramabhadran Balaji - Painesville OH
    Mark Wisniewski - Mentor OH
  • Assignee:
    Avery Dennison Corporation - Pasadena CA
  • International Classification:
    B29D 2200
  • US Classification:
    428 357
  • Abstract:
    This invention relates to an in-mold label comprising a core layer with a first and second surface and a heat seal layer on the first surface of the core layer, wherein the heat seal layer comprises a polyolefin, having a peak melt temperature of less than about 110Â C. and where less than about 25% of the polyolefin melts at a temperature of less than 50Â C. as measured by differential scanning calorimetry. The label may also contain a skin layer on the second surface of the core layer. The invention also relates to plastic substrates bonded to the label. In another aspect, the present invention also relates to a process for in-mold labeling and a process for preparing an in-mold label. The labels and processes provide reduced amounts of one or more of the following: blisters, both before and after bonding, shrinkage, bagginess and gage bands.
  • Multilayered Thermoplastic Film And Sign Cutting Method Using The Same

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  • US Patent:
    6770360, Aug 3, 2004
  • Filed:
    Jun 11, 1999
  • Appl. No.:
    09/332273
  • Inventors:
    Bernard S. Mientus - Painesville OH
    Kushalkumar M. Baid - Mentor OH
    Mark Wisniewski - Mentor OH
    Wayne L. Bilodeau - Mentor OH
  • Assignee:
    Avery Dennison Corporation - Pasadena CA
  • International Classification:
    B32B 3300
  • US Classification:
    428354, 428 401, 428 417, 428343, 428520, 428522, 428523
  • Abstract:
    This invention relates to a multilayered thermoplastic film comprising: a thermoplastic core layer having a first side and a second side, the core layer comprising: a polyolefin having a density in the range of about 0. 89 to about 0. 97 grams per cubic centimeter; a second polymeric material selected from ionomers derived from sodium, lithium or zinc and an ethylene/methacrylic acid copolymer, and a combination thereof, and a light stabilizer; an abrasion and scuff resistant clear first thermoplastic skin layer overlying the first side of the core layer, and a clear second thermoplastic skin layer overlying the second side of the core layer, both skins containing light stabilizer. The composition of the core layer is different from the composition of the skin layers, and the core layer and the skin layers are characterized by the absence of PVC.
  • In-Mold Labels And Users Thereof

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  • US Patent:
    7700188, Apr 20, 2010
  • Filed:
    Nov 14, 2003
  • Appl. No.:
    10/714197
  • Inventors:
    Ramabhadran Balaji - Painesville OH, US
    Mark Wisniewski - Mentor OH, US
  • Assignee:
    Avery Dennison Corporation - Pasadena CA
  • International Classification:
    B29D 22/00
    B29D 23/00
    B32B 1/08
  • US Classification:
    428349, 428516, 428 357, 428327, 428337, 428339, 264509
  • Abstract:
    This invention relates to an in-mold label comprising a core layer with a first and second surface and a heat seal layer on the first surface of the core layer, wherein the heat seal layer comprises a polyolefin, having a peak melt temperature of less than about 110 C. and where less than about 25% of the polyolefin melts at a temperature of less than 50 C. as measured by differential scanning calorimetry. The label may also contain a skin layer on the second surface of the core layer. The invention also relates to plastic substrates bonded to the label. In another aspect, the present invention also relates to a process for in-mold labeling and a process for preparing an in-mold label. The labels and processes provide reduced amounts of one or more of the following: blisters, both before and after bonding, shrinkage, bagginess and gage bands.
  • Thermal Interface Material With Thin Transfer Film Or Metallization

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  • US Patent:
    8445102, May 21, 2013
  • Filed:
    Sep 4, 2008
  • Appl. No.:
    12/204228
  • Inventors:
    Jason L. Strader - Cleveland OH, US
    Mark Wisniewski - Mentor OH, US
    Karen Bruzda - Cleveland OH, US
    Michael D. Craig - Painesville OH, US
  • Assignee:
    Laird Technologies, Inc. - Earth City MO
  • International Classification:
    B32B 15/08
    B32B 37/10
    B32B 38/10
  • US Classification:
    428336, 428457, 156233, 2641731, 427294, 42742801
  • Abstract:
    According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0. 0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.
  • Thermal Interface Material With Thin Transfer Film Or Metallization

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  • US Patent:
    8545987, Oct 1, 2013
  • Filed:
    Nov 12, 2007
  • Appl. No.:
    11/938588
  • Inventors:
    Jason Strader - Cleveland OH, US
    Mark Wisniewski - Mentor OH, US
  • Assignee:
    Laird Technologies, Inc. - Earth City MO
  • International Classification:
    B32B 15/06
    B32B 15/08
    B32B 7/06
    B32B 27/20
    H01L 23/34
    H01L 23/36
  • US Classification:
    428457, 428 418, 428446, 428447, 428448, 428450, 257701, 257706, 257707, 257720, 36167946, 36167954, 36167961, 361704, 361705, 361707, 361712, 361713, 165185
  • Abstract:
    According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0. 0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.
  • Method Of Making Microneedles

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  • US Patent:
    8551391, Oct 8, 2013
  • Filed:
    Feb 3, 2005
  • Appl. No.:
    11/050116
  • Inventors:
    Philip Yi Zhi Chu - Monrovia CA, US
    Hsiao Ken Chuang - Arcadia CA, US
    Kejian (Kevin) Huang - Buffalo Grove IL, US
    Michael Lang - Chagrin Falls OH, US
    Reza Mehrabi - Tujunga CA, US
    Ronald F. Sieloff - Chardon OH, US
    Karen L. Spilizewski - Euclid OH, US
    Mark Wisniewski - Mentor OH, US
  • Assignee:
    Avery Dennison Corporation - Pasadena CA
  • International Classification:
    H05B 1/02
  • US Classification:
    264481, 264492, 2642978, 264319, 425407, 425348 R
  • Abstract:
    A method of making a microneedle array structure () comprising a plurality of simultaneously formed microneedles (), each microneedle () having a protrusion () and a passageway () extending therethrough. The method comprises the steps of pressing an embossable sheet material between a complimentary tools and radiantly heating the sheet material using radiant energy from a radiant energy source. One tool is relatively-radiantly-transparent, and another tool and/or the sheet material is relatively-radiantly-absorptive.
  • Directionally Peelable Closures And Articles Using The Same

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  • US Patent:
    20020023924, Feb 28, 2002
  • Filed:
    Sep 30, 1999
  • Appl. No.:
    09/408634
  • Inventors:
    MARK WISNIEWSKI - MENTOR OH, US
    MELVIN S. FREEDMAN - BEACHWOOD OH, US
  • International Classification:
    B65D041/00
    B65D033/20
    B65D027/16
  • US Classification:
    220/359100, 220/359300, 220/359400, 229/245000, 229/123100, 229/080500, 383/095000, 383/086000
  • Abstract:
    This invention relates a closure with a directionally peelable opening feature for articles comprising first and second layer of different polymeric films, wherein each layer has an upper and lower surface, the upper surface of the first layer is peelably attached to the lower surface of the second layer at a separation interface, provided that when the closure is used to secure an article, at least one portion of the surface and of the upper surface of the first layer or the lower surface of the second layer is not attached to the container. The invention also relates to a container sealed with the directionally peelable closure. The closure provides a means for providing a strong sealing closure that is directionally peelable requiring little effort. In another aspect the invention provides a means for using a container more than once. In another aspect the invention provides a non-destructible opening feature for the container. This allows the container to be reused multiple times reducing overall packaging costs and providing environmental benefits. Key to this invention is that the incremental cost of achieving this reusability feature over the cost of a one use container is low. This is important because the cost of adding this feature to all packages must be balanced against the savings in total packaging costs when a consumer uses the container a second time. It is important to note that consumer second use of containers is voluntary and will not be %. The lower this incremental cost is the lower the % of voluntary package reuse by consumers can be. Historically in the U.S. overnight couriers have provided these envelopes, boxes, etc. free of charge to their customers. In another aspect the invention is self contained relative to its easy open feature. The tight registration of the pressure sensitive coating is accomplished when the tape is manufactured. As a result of this the registration for dispensing the tape onto the box or envelope is not critical. Additionally, the number of tapes being dispensed is reduced because the tear tape is eliminated. This makes it more commercially feasible to dispense the tape in line with other manufacturing operations in container manufacturing. In another aspect, the invention provides tamper evident and non resealable closure for packages. The inherently separable interface used in this invention cannot be reclosed once it is opened. The individual film layers can be pigmented etc. to further provide visible tamper evidency.

Isbn (Books And Publications)

Writing and Revising Your Fiction

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Author
Mark S. Wisniewski

ISBN #
0871161745

Resumes

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Mark Wisniewski

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Location:
Mentor, OH
Industry:
Electrical/Electronic Manufacturing
Work:
Laird Performance Materials Nov 2015 - Nov 2015
Product Director

Honeywell Nov 2014 - Aug 2015
Global General Manager - Media Product Line

Laird Jan 2012 - Jan 2014
Senior Vice President and General Manager

Laird 2007 - 2012
Global Product Director For Thermal Interface Materials

Avery Dennison 2002 - 2006
Product Development Manager
Education:
Case Western Reserve University 1990
Master of Business Administration, Masters, Business Administration, Business
Ohio University Heritage College of Osteopathic Medicine 1984
Case Western Reserve University 1983
Bachelors, Bachelor of Science
Ohio University Heritage College of Osteopathic Medicine
Case Western Reserve University
Skills:
Product Development
Manufacturing
Product Management
Process Engineering
Operations Management
Business Development
Cross Functional Team Leadership
New Business Development
Polymers
Product Launch
Plastics
Manufacturing Operations
Six Sigma
Manufacturing Operations Management
Project Management
Thermal Management
Continuous Improvement
Coatings
Lean Manufacturing
Adhesives
Spc
Design of Experiments
Engineering
Electronics
Materials
Extrusion Coating
Plant Management
Leadership
Team Leadership
Strategic Leadership
Leadership Development
Team Management
Organizational Leadership
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Mark Wisniewski

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Mark Wisniewski

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Mark Wisniewski Photo 5

Mark Wisniewski

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Mark Wisniewski

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Mark Wisniewski

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Mark Wisniewski Photo 8

Mark Wisniewski

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Location:
United States
Mark Wisniewski Photo 9

Mark Wisniewski Mentor, OH

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Work:
LAIRD PLC

2012 to 2014
Senior Vice President and General Manager Thermal BU / Thermal Materials BU
LAIRD PLC
Cleveland, OH
2007 to 2014
LAIRD PLC

2007 to 2011
Global Product Director
INNOVEX CORPORATION
Eastlake, OH
2006 to 2007
Director of Operations
AVERY DENNISON CORPORATION

2002 to 2006
Product Development Manager
AVERY DENNISON CORPORATION
Cleveland, OH
1994 to 2006
Corporate Strategy and New Business Development
AVERY DENNISON CORPORATION

1997 to 2002
Business Development Manager
AVERY DENNISON CORPORATION

1994 to 1997
Painesville Plant Manager
AMERICAN NATIONAL CAN COMPANY

1993 to 1994
Department Supervisor
AMERICAN NATIONAL CAN COMPANY
Cleveland, OH
1984 to 1994
AMERICAN NATIONAL CAN COMPANY

1990 to 1993
Department Supervisor
AMERICAN NATIONAL CAN COMPANY

1987 to 1990
Department Supervisor
AMERICAN NATIONAL CAN COMPANY

1984 to 1987
Process Engineer/Engineering Manager
Education:
Case Western Reserve University
Cleveland, OH
1990
Master of Business Administration
Ohio University
Athens, OH
1984
Graduate studies
Case Western Reserve University
Cleveland, OH
1983
B.S. in Chemical Engineering

Youtube

Electronica China event with Mark Wisniewski

Laird Performance Materials' Mark Wisniewski explores the company's la...

  • Duration:
    2m 3s

Managing Fixed Income in 2020 with Mark Wisni...

Evan and John interview two fixed income fund manager from Ninepoint P...

  • Duration:
    34m 19s

WATCH ME GO, Modern Novels and Racetrack Insp...

WATCH ME GO author Mark Wisniewski talks about his acclaimed new novel...

  • Duration:
    42m 23s

Posen's Mark Wisniewski sprints for 34-yard t...

HERE'S A POSEN VIKINGS PLAY. HANDOFF GOES TO MARK WISNIEWSKI AND THE G...

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    20s

The 5th Down's week 2 Top 5 Plays: Mark Wisni...

Posen --- Vikings Mark Wisniewski made a big play on third and two in ...

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    27s

Brother Martin's Mark Wisniewski talks win ov...

Brother Martin shook off yesterday's loss to Destrehan for a 3-2 win v...

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    45s

Myspace

Mark Wisniewski Photo 10

mark wisniewski

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Locality:
DOTHAN, Alabama
Gender:
Male
Birthday:
1938
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Mark Wisniewski

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Locality:
Sterling Heights, Michigan
Gender:
Male
Birthday:
1941
Mark Wisniewski Photo 12

Mark Wisniewski

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Gender:
Male
Birthday:
1951

Plaxo

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Mr. Mark Wisniewski

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Charlotte, NCCommunications and Organizational Professional with experience in the financial services, non-profit, and higher education sectors.
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Mark Wisniewski

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VP, Information Technology at INSPIRIS
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mark wisniewski

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Plainfield

Flickr

Facebook

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Mark Wisniewski

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Mark Wisniewski Photo 25

Mark Wisniewski

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Mark Wisniewski

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Mark Wisniewski

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Mark Wisniewski

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Mark Wisniewski

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Mark Wisniewski

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Mark Wisniewski

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Googleplus

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Mark Wisniewski

Work:
Ogden Renewable Energy - Director (2012)
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Mark Wisniewski

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Mark Wisniewski

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Mark Wisniewski

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Mark Wisniewski

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Mark Wisniewski

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Mark Wisniewski

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Mark Wisniewski

Classmates

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Mark Wisniewski

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Schools:
Our Lady of Mt. Carmel High School Baltimore MD 1977-1981
Community:
Kim Dietrich, Crystal Fonte
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Mark Wisniewski

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Schools:
Saint Helen School Fresno CA 1957-1961, San Joaquin Memorial High School Fresno CA 1961-1965
Community:
Jeff Urrutia, Janice Evans
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Mark Wisniewski

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Schools:
Mansfield High School Mansfield MA 1965-1969
Community:
Doug Faber
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Mark Wisniewski

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Schools:
St. Stanislaus High School Detroit MI 1966-1970
Community:
Jennifer Podwysocki, Kathie Scalzo, Thaddeus Sliwinski, Carol Stachowski, Rosemary Zoladz
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Mark Wisniewski

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Schools:
De La Salle High School Warren MI 1979-1983
Community:
Kenneth Roncelli, Paul Fracassa
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Mark Wisniewski

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Schools:
Edwin Aldrin Elementary School Schaumburg IL 1971-1976, Robert Frost Junior High School Schaumburg IL 1976-1978
Community:
Michelle Bishop, Erin Maureen, Julie Barnes, Michele Prangle, Brad Anderson
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Mark Wisniewski

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Schools:
Saint Pauls School Jersey City NJ 1963-1970, Holy Spirit School Union NJ 1970-1972
Community:
Mark Cram, Brent Smith, Blaise Ziemian, William Doyle
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Mark Wisniewski

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Schools:
Bishop Kenny High School Jacksonville FL 1994-1998
Community:
Mary Gonzalez, Nikki Hatch, Woodrow David, Scott Mccorkle

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