Mark D. Kittel - Berea OH Richard L. Sandt - Brunswick OH Charles K. Herrmann - Cleveland Heights OH Mark Wisniewski - Mentor OH
Assignee:
Avery Dennnison Corporation - Pasadena CA
International Classification:
B32B 2714
US Classification:
428195, 428204, 428207, 428211, 428913, 428914
Abstract:
This invention relates to a thermal transfer laminate, comprising: a facestock comprising a first layer having an upper surface and a lower surface, and a heat-activatable adhesive layer underlying the lower surface of said first layer; an adhesion-promoting layer overlying the upper surface of said first layer; an abrasion-resistant transparent coating layer overlying said adhesion-promoting layer; and another adhesive layer overlying said abrasion-resistant coating layer. In one embodiment, an ink or graphics layer overlies the upper surface of the first layer of the facestock and provides a pictorial design and/or print message. In one embodiment, the laminate is adhered to a carrier sheet. In one embodiment, the laminate is adhered to a substrate such as an automotive interior surface.
Thermal Interface Material With Thin Transfer Film Or Metallization
Jason L. Strader - Cleveland OH, US Mark Wisniewski - Mentor OH, US Karen Bruzda - Cleveland OH, US Michael D. Craig - Painesville OH, US
Assignee:
Laird Technologies, Inc. - Earth City MO
International Classification:
B32B 15/08 B32B 37/10 B32B 38/10
US Classification:
428336, 428457, 156233, 2641731, 427294, 42742801
Abstract:
According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0. 0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.
Thermal Interface Material With Thin Transfer Film Or Metallization
According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0. 0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.
Mark D. Kittel - Berea OH Richard L. Sandt - Brunswick OH Charles K. Herrmann - Cleveland Heights OH Mark Wisniewski - Mentor OH
Assignee:
Avery Dennison Corporation - Pasadena CA
International Classification:
B32B 712
US Classification:
428354
Abstract:
This invention relates to a thermal transfer laminate, comprising: a facestock comprising a first layer having an upper surface and a lower surface, and a heat-activatable adhesive layer underlying the lower surface of said first layer; an adhesion-promoting layer overlying the upper surface of said first layer; an abrasion-resistant transparent coating layer overlying said adhesion-promoting layer; and another adhesive layer overlying said abrasion-resistant coating layer. In one embodiment, an ink or graphics layer overlies the upper surface of the first layer of the facestock and provides a pictorial design and/or print message. In one embodiment, the laminate is adhered to a carrier sheet. In one embodiment, the laminate is adhered to a substrate such as an automotive interior surface.