Martin J Rapp

US Patent:

20040020674, Feb 5, 2004

Filed:

Jun 13, 2003

Appl. No.:

10/461930

Inventors:

Jeff McFadden - Blairstown NJ, US
Martin Rapp - Grover MO, US

Assignee:

LAIRD TECHNOLOGIES, INC. - DELAWARE WATER GAP PA

International Classification:

H02G003/00

US Classification:

174/0350MS

Abstract:

Electrically conductive materials can be used to shield EMI, whereas energy-absorptive materials can be used to suppress EMI. Disclosed are systems and processes for combining electrically conductive and absorptive materials to improve EMI shielding effectiveness. In one embodiment, an absorptive material is combined with the conducting material forming a composite. In another embodiment, absorptive material is combined with electrically conductive material and selectively applied to a substrate, such as a plastic enclosure, to suppress EMI incident upon the substrate, thereby reducing the susceptibility of electronics contained within across a broad frequency range.