Mary K Kulp

US Patent:

7371160, May 13, 2008

Filed:

Dec 21, 2006

Appl. No.:

11/644478

Inventors:

Carlos A. Cruz - Holland PA, US
David B. James - Newark DE, US
Mary Jo Kulp - Newark DE, US

Assignee:

Rohm and Haas Electronic Materials CMP Holdings Inc. - Newark DE

International Classification:

B24B 11/00

US Classification:

451526, 51307

Abstract:

The chemical mechanical polishing pad is suitable for polishing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polymeric matrix with an elastomeric polymer distributed within the polymeric matrix. The polymeric matrix has a glass transition above room temperature; and the elastomeric polymer has an average length of at least 0. 1 μm in at least one direction, represents 1 to 45 volume percent of polishing pad and has a glass transition temperature below room temperature. The polishing pad has an increased diamond conditioner cut rate in comparison to a polishing pad formed from the polymeric matrix without the elastomeric polymer.

US Patent:

8257545, Sep 4, 2012

Filed:

Sep 29, 2010

Appl. No.:

12/893656

Inventors:

Adam Loyack - Philadelphia PA, US
Alan Nakatani - Lansdale PA, US
Mary Jo Kulp - Newark DE, US
David G. Kelly - Ambler PA, US

Assignee:

Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE

International Classification:

B24D 11/00
B24B 49/12

US Classification:

15634513, 15634524, 451 6, 451527

Abstract:

A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a light stable polymeric endpoint detection window, comprising: a polyurethane reaction product of an aromatic polyamine containing amine moieties and an isocyanate terminated prepolymer polyol containing unreacted —NCO moieties; and, a light stabilizer component comprising at least one of a UV absorber and a hindered amine light stabilizer; wherein the aromatic polyamine and the isocyanate terminated prepolymer polyol are provided at an amine moiety to unreacted —NCO moiety stoichiometric ratio of

US Patent:

20020058469, May 16, 2002

Filed:

Feb 2, 2001

Appl. No.:

09/775972

Inventors:

Barry Pinheiro - Media PA, US
Steven Naugler - Hockessin DE, US
Mary Kulp - Macungie PA, US

International Classification:

B24D011/00

US Classification:

451/526000

Abstract:

This invention relates to polishing pads and a method for making the polishing pad surface readily machineable thereby facilitating permanent alteration of the polishing pad surface to create an advantageous micro-texture. The advantageous micro-texture is statistically uniform and provides a polishing pad with improved break-in preconditioning time. Polishing pads of this invention find application to the polishing/planarization of substrates such as glass, dielectric/metal composites and substrates containing copper, silicon, silicon dioxide, platinum, and tungsten typically encountered in integrated circuit fabrication.

US Patent:

20110177758, Jul 21, 2011

Filed:

Jan 15, 2010

Appl. No.:

12/657202

Inventors:

Adam Loyack - Philadelphia PA, US
Alan Nakatani - Lansdale PA, US
Mary Jo Kulp - Newark DE, US
David G. Kelly - Ambler PA, US

International Classification:

B24B 49/00
B24D 11/00

US Classification:

451 6, 451527

Abstract:

The polishing pad is useful for polishing at least one of magnetic, optical and semiconductor substrates. The polishing pad includes a polishing layer having a polyurethane window. The polyurethane window has a cross-linked structure formed with an aliphatic or cycloaliphatic isocyanate and a polyol in a prepolymer mixture. The prepolymer mixture is reacted with a chain extender having OH or NHgroups and having an OH or NHto unreacted NCO stoichiometry less than 95%. The polyurethane window has a time dependent strain less than or equal to 0.02% when measured with a constant axial tensile load of 1 kPa at a constant temperature of 60 C. at 140 minutes, a Shore D hardness of 45 to 90 and an optical double pass transmission of at least 15% at a wavelength of 400 nm for a sample thickness of 1.3 mm.

US Patent:

61144886, Sep 5, 2000

Filed:

Mar 2, 1999

Appl. No.:

9/260293

Inventors:

Mary Joanne Kulp - Macungie PA
Edwin Lee McInnis - Lincoln University PA

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C08G 1810

US Classification:

528 49

Abstract:

A method for the rotational casting of a polyurethane elastomer onto a rotating substrate which comprises mixing a polyurethane prepolymer, an amine curative and optionally a polyol in a mixing head and depositing the mixture onto the rotating substrate, the amine curative comprising: (a) 2-45 wt % aminobenzoate polyol having molecular weight of 200-3,000, (b) 55-98 wt % aromatic polyamine, and (c) 0 to

US Patent:

20150059254, Mar 5, 2015

Filed:

Sep 4, 2013

Appl. No.:

14/017998

Inventors:

- Midland MI, US
- Newark DE, US
James Murnane - Norristown PA, US
David B. James - Newark DE, US
Mary Jo Kulp - Newark DE, US

International Classification:

B24B 37/24

US Classification:

51298

Abstract:

The invention provides a polishing pad suitable for planarizing semiconductor, optical and magnetic substrates. The polishing pad includes a cast polyurethane polymeric material formed from a prepolymer reaction of a polypropylene glycol and a toluene diisocyanate to form an isocyanate-terminated reaction product. The toluene diisocyanate has less than 5 weight percent aliphatic isocyanate; and the isocyanate-terminated reaction product having 5.55 to 5.85 weight percent unreacted NCO. The isocyanate-terminated reaction product being cured with a 4,4′-methylene-bis(3-chloro-2,6-diethylaniline) curative agent. The non-porous cured product having a tan delta of 0.04 to 0.10, a Young's modulus of 140 to 240 MPa and a Shore D hardness of 44 to 56.