Mary Ann Kulp

US Patent:

20020058469, May 16, 2002

Filed:

Feb 2, 2001

Appl. No.:

09/775972

Inventors:

Barry Pinheiro - Media PA, US
Steven Naugler - Hockessin DE, US
Mary Kulp - Macungie PA, US

International Classification:

B24D011/00

US Classification:

451/526000

Abstract:

This invention relates to polishing pads and a method for making the polishing pad surface readily machineable thereby facilitating permanent alteration of the polishing pad surface to create an advantageous micro-texture. The advantageous micro-texture is statistically uniform and provides a polishing pad with improved break-in preconditioning time. Polishing pads of this invention find application to the polishing/planarization of substrates such as glass, dielectric/metal composites and substrates containing copper, silicon, silicon dioxide, platinum, and tungsten typically encountered in integrated circuit fabrication.

US Patent:

61144886, Sep 5, 2000

Filed:

Mar 2, 1999

Appl. No.:

9/260293

Inventors:

Mary Joanne Kulp - Macungie PA
Edwin Lee McInnis - Lincoln University PA

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C08G 1810

US Classification:

528 49

Abstract:

A method for the rotational casting of a polyurethane elastomer onto a rotating substrate which comprises mixing a polyurethane prepolymer, an amine curative and optionally a polyol in a mixing head and depositing the mixture onto the rotating substrate, the amine curative comprising: (a) 2-45 wt % aminobenzoate polyol having molecular weight of 200-3,000, (b) 55-98 wt % aromatic polyamine, and (c) 0 to

US Patent:

20150059254, Mar 5, 2015

Filed:

Sep 4, 2013

Appl. No.:

14/017998

Inventors:

- Midland MI, US
- Newark DE, US
James Murnane - Norristown PA, US
David B. James - Newark DE, US
Mary Jo Kulp - Newark DE, US

International Classification:

B24B 37/24

US Classification:

51298

Abstract:

The invention provides a polishing pad suitable for planarizing semiconductor, optical and magnetic substrates. The polishing pad includes a cast polyurethane polymeric material formed from a prepolymer reaction of a polypropylene glycol and a toluene diisocyanate to form an isocyanate-terminated reaction product. The toluene diisocyanate has less than 5 weight percent aliphatic isocyanate; and the isocyanate-terminated reaction product having 5.55 to 5.85 weight percent unreacted NCO. The isocyanate-terminated reaction product being cured with a 4,4′-methylene-bis(3-chloro-2,6-diethylaniline) curative agent. The non-porous cured product having a tan delta of 0.04 to 0.10, a Young's modulus of 140 to 240 MPa and a Shore D hardness of 44 to 56.