Mary S Kulp

US Patent:

7074115, Jul 11, 2006

Filed:

Sep 10, 2004

Appl. No.:

10/937914

Inventors:

David B. James - Newark DE, US
Mary Jo Kulp - Newark DE, US

Assignee:

Rohm and Haas Electronic Materials CMP Holdings, Inc. - Wilmington DE

International Classification:

B24B 1/00

US Classification:

451 41, 451285, 451287, 451526, 451533

Abstract:

A polishing pad is useful planarizing semiconductor substrates. The polishing pad comprises a polymeric material having a porosity of at least 0. 1 volume percent, a KEL energy loss factor at 40 C. and 1 rad/sec of 385 to 750 1/Pa and a modulus E′ at 40 C. and 1 rad/sec of 100 to 400 MPa.

US Patent:

7169030, Jan 30, 2007

Filed:

May 25, 2006

Appl. No.:

11/442076

Inventors:

Mary Jo Kulp - Newark DE, US

Assignee:

Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE

International Classification:

B24D 11/00

US Classification:

451527, 451526

Abstract:

The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polymeric matrix having a top polishing surface; and the top polishing surface has polymeric polishing asperities or forms polymeric polishing asperities upon conditioning with an abrasive. The polymeric polishing asperities extend from the polymeric matrix and represent the portion of the top polishing surface that can contact a substrate during polishing. The polymeric polishing asperities are from a polymeric material having a bulk ultimate tensile strength of at least 6,500 psi (44. 8 MPa) and a bulk tear strength of at least 250 lb/in. (4. 5×10g/mm).

US Patent:

7371160, May 13, 2008

Filed:

Dec 21, 2006

Appl. No.:

11/644478

Inventors:

Carlos A. Cruz - Holland PA, US
David B. James - Newark DE, US
Mary Jo Kulp - Newark DE, US

Assignee:

Rohm and Haas Electronic Materials CMP Holdings Inc. - Newark DE

International Classification:

B24B 11/00

US Classification:

451526, 51307

Abstract:

The chemical mechanical polishing pad is suitable for polishing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polymeric matrix with an elastomeric polymer distributed within the polymeric matrix. The polymeric matrix has a glass transition above room temperature; and the elastomeric polymer has an average length of at least 0. 1 μm in at least one direction, represents 1 to 45 volume percent of polishing pad and has a glass transition temperature below room temperature. The polishing pad has an increased diamond conditioner cut rate in comparison to a polishing pad formed from the polymeric matrix without the elastomeric polymer.

US Patent:

7414080, Aug 19, 2008

Filed:

Jan 13, 2005

Appl. No.:

11/036285

Inventors:

Mary Jo Kulp - Newark DE, US

Assignee:

Materials CMP Holdings, Inc. - Newark DE

International Classification:

C08G 18/10

US Classification:

521159, 451526, 451540, 521137, 521163, 521167, 521170, 521172, 521173, 521174, 521176

Abstract:

The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a cast polyurethane polymeric material formed with an isocyanate-terminated reaction product formed from a prepolymer reaction of a prepolymer polyol and a polyfunctional isocyanate. The isocyanate-terminated section product has 4. 5 to 8. 7 weight percent unreacted NCO; and the isocyanate-terminated reaction product is cured with a curative agent selected from the group comprising curative polyamines, curative polyols, curative alcoholamines and mixtures thereof. The polishing pad contains at least 0. 1 volume percent filler or porosity.

US Patent:

7435364, Oct 14, 2008

Filed:

Apr 4, 2006

Appl. No.:

11/398265

Inventors:

David B. James - Newark DE, US
Mary Jo Kulp - Newark DE, US
John V. H. Roberts - Newark DE, US

Assignee:

Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE

International Classification:

B29C 44/06

US Classification:

264 454

Abstract:

The present invention provides a method of forming a chemical mechanical polishing pad comprising providing a polymeric matrix with fluid-filled unexpanded microspheres, curing the polymeric matrix and heating the polymeric matrix and the microspheres to expand the microspheres.

US Patent:

7438636, Oct 21, 2008

Filed:

Dec 21, 2006

Appl. No.:

11/644493

Inventors:

Mary Jo Kulp - Newark DE, US
David B. James - Newark DE, US
Robert F. Antrim - Chalfont PA, US

Assignee:

Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE

International Classification:

B24D 11/00

US Classification:

451539, 51298, 51307

Abstract:

A chemical mechanical polishing pad is suitable for polishing at least one of semiconductor, optical and magnetic substrates. The polishing pad has a high modulus component forming a continuous polymeric matrix and an impact modifier within the continuous polymeric matrix. The high modulus component has a modulus of at least 100 MPa. The impact modifier includes a low modulus component having a modulus of at least one order of magnitude less than the high modulus component that increases the impact resistance of the polishing pad.

US Patent:

7445847, Nov 4, 2008

Filed:

May 25, 2006

Appl. No.:

11/442077

Inventors:

Mary Jo Kulp - Newark DE, US

Assignee:

Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE

International Classification:

B32B 27/00
B24D 11/00

US Classification:

4284231, 451526, 451527

Abstract:

The invention provides a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polymeric matrix having a top polishing surface. The top polishing surface has polymeric polishing asperities or forms polymeric polishing asperities upon conditioning with an abrasive. The polymeric polishing asperities are from a polymeric material having at least 45 weight percent hard segment and a bulk ultimate tensile strength of at least 6,500 psi (44. 8 MPa). And the polymeric matrix has a two phase structure, a hard phase and a soft phase with an average area of the hard phase to average area of the soft phase ratio of less than 1. 6.

US Patent:

7569268, Aug 4, 2009

Filed:

Jan 29, 2007

Appl. No.:

11/699775

Inventors:

T. Todd Crkvenac - Hockessin DE, US
Clyde A. Fawcett - Claymont DE, US
Mary Jo Kulp - Newark DE, US
Andrew Scott Lawing - Phoenix AZ, US
Kenneth A. Prygon - Bear DE, US

Assignee:

Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE

International Classification:

B32B 3/26
B24D 11/00

US Classification:

4283148, 4283155, 4283157, 4283179, 451526, 451527

Abstract:

The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad has an ultimate tensile strength of at least 3,000 psi (20. 7 MPa) and polymeric matrix containing closed cell pores. The closed cell pores have an average diameter of 1 to 50 μm and represent 1 to 40 volume percent of the polishing pad. The pad texture has an exponential decay constant, τ, of 1 to 10 μm as a result of the natural porosity of the polymeric matrix and a surface texture developed by implementing periodic or continuous conditioning with an abrasive. The surface texture has a characteristic half height half width, Wthat is less than or equal to the value of τ.