Michael T Brady

US Patent:

52497330, Oct 5, 1993

Filed:

Jul 16, 1992

Appl. No.:

7/915492

Inventors:

Michael F. Brady - Morrisville PA
Rajan D. Deshmukh - Yardley PA

Assignee:

AT&T Bell Laboratories - Murray Hill NJ

International Classification:

B23K 100
B23K 3538

US Classification:

22818022

Abstract:

A solder self-alignment process for aligning a semiconductor chip (13) with, and bonding the chip to, a substrate (12) is preformed in an atmosphere rich in gaseous formic acid, at least during the melting step. It is preferred that the formic acid atmosphere be maintained during the self-alignment step and the step of cooling and hardening the solder elements (23). With this feature, one can completely avoid the use of any solid or liquid fluxes and avoid the consequences of such use. Nonetheless, the molten solder elements (23) dependably bond to the bonding surfaces and vertically align themselves.

US Patent:

57575037, May 26, 1998

Filed:

Dec 26, 1995

Appl. No.:

8/579617

Inventors:

Michael Francis Brady - Morrisville PA
Hung Ngoc Nguyen - Bensalem PA

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

G01B 1100

US Classification:

356400

Abstract:

A method and apparatus measures a deviation in alignment between two components of a product wherein each component is characterized by a respective pattern and wherein each pattern comprises respective elements. The centroid of each element in each respective pattern is indicated, and based on the centroid indications, the center of each respective pattern is indicated. The deviation in alignment between the two components is determined as a function of the indicated position of the centers of the respective patterns, and positioning of the components is controlled as a function of the indicated position of the centers of the respective patterns.

US Patent:

61199214, Sep 19, 2000

Filed:

Feb 19, 1999

Appl. No.:

9/252729

Inventors:

Michael Francis Brady - Morrisville PA
Mindaugas Fernand Dautartas - Alburtis PA
James F. Dormer - Limekiln PA
Sailesh Mansinh Merchant - Orlando FL
Casimir Roman Nijander - Lawrenceville NJ
John William Osenbach - Kutztown PA

Assignee:

Lucent Technologies - Murray Hill NJ

International Classification:

B23K 3100
B23K10140
G02B 1318

US Classification:

2281241

Abstract:

The invention is a method and resulting device which provides a strong bond between a silicon substrate and an oxide component mounted within a cavity in the substrate. A layer of titanium, for example, is deposited on the walls of the cavity, followed by deposition of a layer of aluminum. The structure is preferably annealed to form titanium silicide and titanium-aluminum interface layers. The component is then bonded to the aluminum layer.

US Patent:

62657577, Jul 24, 2001

Filed:

Nov 9, 1999

Appl. No.:

9/435640

Inventors:

Michael F. Brady - Morrisville PA
Casimir R. Nijander - Lawrenceville NJ
John W. Osenbach - Kutztown PA
Michael G. Palin - Wyomissing Hills PA
Aleksandra Yudina - Kutztown PA

Assignee:

Agere Systems Guardian Corp. - Miami Lakes FL

International Classification:

H01L 2906

US Classification:

257623

Abstract:

A method for creating attached features while controlling the depth profile between the features is presented. First the features are formed with a separating barrier between the features. The separating barrier is then etched in a second step with an orientation dependent etchant to attach the two feature. This method can be used to create attached features of relative similar sizes or attached features of disparate sizes.

US Patent:

51067862, Apr 21, 1992

Filed:

Oct 23, 1989

Appl. No.:

7/425134

Inventors:

Michael F. Brady - Morrisville PA
Aubrey L. Helms - Pennington NJ

Assignee:

AT&T Bell Laboratories - Murray Hill NJ

International Classification:

H01L 2100
H01L 2102
H01L 2188

US Classification:

437229

Abstract:

An antireflection coating (21) for use in integrated circuit processing consists of a film of tungsten silicide (WSi. sub. 45) or tungsten silicon nitride (WSiN). These coatings are preferably made by sputtering, with the tungsten silicon nitride coating being made by sputtering in a nitrogen-containing atmosphere.

US Patent:

60344059, Mar 7, 2000

Filed:

Jul 22, 1997

Appl. No.:

8/899291

Inventors:

Michael Francis Brady - Morrisville PA
Mindaugas Fernand Dautartas - Alburtis PA
James F. Dormer - Limekiln PA
Sailesh Mansinh Merchant - Orlando FL
Casimir Roman Nijander - Lawrenceville NJ
John William Osenbach - Kutztown PA

Assignee:

Lucent Technologies, Inc. - Murray Hill NJ

International Classification:

H01L 310232
H01L 3100
G02B 632

US Classification:

257432

Abstract:

The invention is a method and resulting device which provides a strong bond between a silicon substrate and an oxide component mounted within a cavity in the substrate. A layer of titanium, for example, is deposited on the walls of the cavity, followed by deposition of a layer of aluminum. The structure is preferably annealed to form titanium silicide and titanium-aluminum interface layers. The component is then bonded to the aluminum layer.

US Patent:

50666150, Nov 19, 1991

Filed:

Aug 6, 1990

Appl. No.:

7/562874

Inventors:

Michael F. Brady - Morrisville PA
John K. Dorey - Fairless Hills PA
Aubrey L. Helms - Sunnyvale CA

Assignee:

AT&T Bell Laboratories - Murray Hill NJ

International Classification:

H01L 2100
H01L 2102
H01L 2188

US Classification:

437229

Abstract:

An antireflection coating (21) for use in integrated circuit processing consists of a film of x-silicon-nitride, where x is a metal from the group consisting of titanium, vanadium, chromium, zirconium, niobium, molybdenum, hafnium, tantalum and tungsten. These coatings are preferably made by sputtering, with the x silicon nitride coating being made by sputtering in a nitrogen-containing atmosphere.

US Patent:

61061611, Aug 22, 2000

Filed:

Sep 15, 1998

Appl. No.:

9/153386

Inventors:

Nagesh R. Basavanhally - Trenton NJ
Michael F. Brady - Morrisville PA

Assignee:

Lucent Technologies, Inc. - Murray Hill NJ

International Classification:

G02B 636

US Classification:

385 88

Abstract:

Compliant, resilient mounting means are provided for minimizing stress on the platform of an optical sub-assembly package caused by temperature change and the like so as to maintain good alignment between the laser beam emitted from a laser chip mounted on the platform and the lens of an optical fiber also mounted on the platform. The resilient means comprise resilient solder bumps of the order of 625 microns thick interposed between the platform and the base to provide a resilient connection between the platform and the base, thereby maintaining good alignment between the laser beam and the lens by reducing the stresses on the optical sub-assembly platform that tend to be caused by temperature changes or the mounting of the package to a rigid, external platform, as by bolting.