Michael A Day

Address:

3836 Mockingbird Ln, Dallas, TX 75205

VIN:

JN1CV6AP8AM400320

Make:

INFINITI

Model:

G37 SEDAN

Year:

2010

Address:

3801 Country Oak Ct, Plano, TX 75093

Phone:

(972)4060959

VIN:

JTJBT20X980160654

Make:

LEXUS

Model:

GX 470

Year:

2008

US Patent:

6452789, Sep 17, 2002

Filed:

Apr 29, 2000

Appl. No.:

09/562593

Inventors:

Lisa Heid Pallotti - Plano TX
Eric C. Peterson - McKinney TX
Christian L Belady - McKinney TX
Terrel L. Morris - Garland TX
Michael C. Day - Allen TX

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

G06F 1200

US Classification:

361683, 361727, 361788, 395401, 174158 R

Abstract:

The inventive system uses a backplane to interconnect a plurality of modular cell boards. Each cell board comprises a plurality of processors, a processor controller chip, a memory subsystem, and a power subsystem. The processor controller chip manages communications between components on the cell board. A mechanical subassembly provides support for the cell board, as well as ventilation passages for cooling. Controller chips are connected to one side of the backplane, while the cell boards are connected to the other side. The controller chips manage cell board to cell board communications, and communications between the backplane and the computer system. The cell boards are arranged in back to back pairs, with the outer most cell boards having their components extend beyond the height of the backplane. This allows for an increase of spacing between the front to front interface of adjacent cell boards.

US Patent:

6596948, Jul 22, 2003

Filed:

Apr 28, 2000

Appl. No.:

09/560794

Inventors:

Stuart C. Haden - Lucas TX
Shaun L. Harris - McKinney TX
Michael C. Day - Allen TX
Lisa Heid Pallotti - Plano TX

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01R 1204

US Classification:

174262, 174260, 174255

Abstract:

A high performance processor assembly is electrically connected to a power supply so as to minimize voltage variations associated with the supply of power to the processor assembly. The processor assembly is fabricated on a multilayered printed circuit board. Power is supplied to components on the printed circuit board by way of parallel and split power planes. The parallel and split power planes reduce inductance and increase capacitance associated therewith. The reduced inductance reduces voltage variations caused by load transient currents. Capacitors are electrically connected to the power planes by way of multiple vias to further reduce inductance.

US Patent:

6818835, Nov 16, 2004

Filed:

Apr 22, 2003

Appl. No.:

10/420572

Inventors:

Stuart C. Haden - Lucas TX
Shaun L. Harris - McKinney TX
Michael C. Day - Allen TX
Christian L Belady - McKinney TX
Lisa Heid Pallotti - Plano TX
Paul T. Artman - Dallas TX
Eric C. Peterson - McKinney TX

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 103

US Classification:

174255, 174261

Abstract:

A circuit comprising multiple circuit boards is disclosed herein. An embodiment of the circuit may comprise first and second printed circuit boards. The first printed circuit board may comprise first and second conductive planes. The first conductive plane has a first shape and the second conductive plane has a second shape, wherein the first shape is substantially similar to the second shape. The first conductive plane is located adjacent the second conductive plane, wherein the first conductive plane is parallel to and aligned with the second conductive plane. The second printed circuit board is connected to the first printed circuit board.

US Patent:

7212424, May 1, 2007

Filed:

Mar 21, 2005

Appl. No.:

11/085693

Inventors:

Brian M. Johnson - Allen TX, US
John Nerl - Londonderry NH, US
Michael C. Day - Allen TX, US
Vicki L. Smith - NW Province, CM
Richard A. Schumacher - Dallas TX, US
Rajakrishnan Radjassamy - Plano TX, US
June E. Goodwin - Plano TX, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

G11C 5/06

US Classification:

365 63, 36523008, 361764, 716 15

Abstract:

One memory module includes a printed circuit board comprising an upper row of memory integrated circuits, a lower row of memory integrated circuits, and a first addressing register and a second addressing register, the first addressing register and a second addressing register each having at least one of address and control input routing primarily provided in a first layer, the first addressing register coupled to the upper row of memory integrated circuits and the second addressing register coupled to the lower row of memory integrated circuits.

US Patent:

7475175, Jan 6, 2009

Filed:

Mar 15, 2004

Appl. No.:

10/800837

Inventors:

David A. Klein - Carrollton TX, US
Christian L. Belady - McKinney TX, US
Shaun L. Harris - McKinney TX, US
Michael C. Day - Allen TX, US
Jeffrey P. Christenson - Plano TX, US
Brent A. Boudreaux - Highland Village TX, US
Stuart C. Haden - Allen TX, US
Eric Peterson - McKinney TX, US
Jeffrey N. Metcalf - Frisco TX, US
James S. Wells - Windsor CO, US
Gary W. Williams - Rowlett TX, US
Paul A. Wirtzberger - Greenville TX, US
Roy M. Zeighami - McKinney TX, US
Greg Huff - Plano TX, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01L 23/34
H01L 23/12
H05K 7/20
G06F 13/00

US Classification:

710100, 257706, 257711, 361702, 361707, 361719

Abstract:

An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

US Patent:

7545651, Jun 9, 2009

Filed:

Apr 18, 2005

Appl. No.:

11/108245

Inventors:

June E. Goodwin - Plano TX, US
Michael C. Day - Allen TX, US
Brian M. Johnson - Allen TX, US
John A. Nerl - Londonderry NH, US
Richard A. Schumacher - Dallas TX, US
Vicki L. Smith - N.W. Province, CM

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 1/18

US Classification:

361764, 361763, 361782, 361803, 365 51

Abstract:

A memory module according to one implementation includes a support substrate, plural memory devices mounted on the support substrate, and pins having a predetermined arrangement on the support substrate, the pins comprising signal pins connected to the memory devices, power pins, and ground pins. In the predetermined arrangement of pins, each signal pin uses a ground pin as a reference, and each power pin is adjacent a ground pin for reduced impedance between the power pin and ground pin. In some implementations, some of the signal pins are associated with redundant pins.

US Patent:

8118692, Feb 21, 2012

Filed:

Mar 12, 2010

Appl. No.:

12/661258

Inventors:

Michael L. Day - Garland TX, US
Dylan L. Day - Garland TX, US

International Classification:

A63B 69/00

US Classification:

473453, 473422, 473451

Abstract:

It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1. 27(b).

US Patent:

20200354117, Nov 12, 2020

Filed:

May 11, 2020

Appl. No.:

16/871385

Inventors:

- Plano IL, US
Clark McCUNE - Roanoke TX, US
Emily STOKES - Columbus OH, US
Neil KWIATOWSKI - Queens NY, US
Mason UMHOLTZ - Sunnyvale CA, US
Michael DAY - New York NY, US
Charles PARADISE - Brooklyn NY, US
Gregory HOWE - Boston MA, US
James KRAUSE - Astoria NY, US

International Classification:

B65D 43/22
B65D 51/24
B65D 43/16

Abstract:

A storage solution that provides substantial advantages over existing storage solutions. The storage solution can include a latch system, a rack system or a display system, any one or more of which can be included with a utility box.