Michael J Ellsworth

US Patent:

7385817, Jun 10, 2008

Filed:

Oct 12, 2007

Appl. No.:

11/871334

Inventors:

Levi A. Campbell - Poughkeepsie NY, US
Richard C. Chu - Hopewell Junction NY, US
Michael J. Ellsworth - Lagrangeville NY, US
Madhusudan K. Iyengar - Woodstock NY, US
Roger R. Schmidt - Pougkeepsie NY, US
Robert E. Simons - Pouhkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 7/20
F28F 7/00

US Classification:

361699, 165 804, 361702

Abstract:

Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.

US Patent:

7593227, Sep 22, 2009

Filed:

Nov 15, 2007

Appl. No.:

11/940471

Inventors:

Levi A. Campbell - New Paltz NY, US
Richard C. Chu - Hopewell Junction NY, US
Michael J. Ellsworth - Lagrangeville NY, US
Madhusudan K. Iyengar - Rhineback NY, US
Donald W. Porter - Highland NY, US
Roger R. Schmidt - Poughkeepsie NY, US
Robert E. Simons - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 7/20

US Classification:

361699, 361696, 251250, 622592

Abstract:

An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of a coolant supply or return line providing liquid coolant to the electronics subsystem. The actuation member is coupled to the isolation valve to automatically translate a linear motion, resulting from insertion of the electronics subsystem into the operational position within the electronics housing, into a rotational motion to open the isolation valve and allow coolant to pass. The actuation mechanism, which operates to automatically close the isolation valve when the liquid cooled electronics subsystem is withdrawn from the operational position, can be employed in combination with a compression valve coupling, with one fitting of the compression valve coupling being disposed serially in fluid communication with the isolation valve.

US Patent:

7665325, Feb 23, 2010

Filed:

Sep 12, 2006

Appl. No.:

11/530992

Inventors:

Levi A. Campbell - Poughkeepsie NY, US
Richard C. Chu - Hopewell Junction NY, US
Michael J. Ellsworth - Lagrangeville NY, US
Madhusudan K. Iyengar - Woodstock NY, US
Roger R. Schmidt - Poughkeepsie NY, US
Robert E. Simons - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

F25D 11/00
F25B 45/00
H05K 7/20

US Classification:

62430, 62149, 361695

Abstract:

A multi-fluid cooling system and method for cooling an electronic device are provided which employ freeze protection when in a shipping state. The cooling system includes a coolant loop having an expansion tank containing first and second fluids, which are immiscible and of different densities, and the second fluid freezes at a lower temperature than the first. The coolant loop further includes a first valve for facilitating coupling of the first fluid into the coolant loop and a second valve for facilitating coupling of the second fluid into the coolant loop, the first and second valves being independently controllable. Control logic electronically controls actuation of the first and second valves to automatically pass the first fluid through the coolant loop when the system is in an operational state and to automatically maintain the second fluid in the coolant loop when the system is in a shipping state.

US Patent:

7841385, Nov 30, 2010

Filed:

Jun 26, 2006

Appl. No.:

11/426431

Inventors:

Levi A. Campbell - Poughkeepsie NY, US
Richard C. Chu - Hopewell Junction NY, US
Michael J. Ellsworth - Lagrangeville NY, US
Madhusudan K. Iyengar - Woodstock NY, US
Roger R. Schmidt - Poughkeepsie NY, US
Robert E. Simons - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

F28F 7/00
F04F 1/18

US Classification:

165 804, 16510433

Abstract:

A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.

US Patent:

20020062855, May 30, 2002

Filed:

Nov 30, 2000

Appl. No.:

09/726900

Inventors:

Richard Chu - Poughkeepsie NY, US
Michael Ellsworth - Lagrangeville NY, US
Robert Simons - Poughkeepsie NY, US

International Classification:

H01L035/28
H01L035/02

US Classification:

136/230000, 136/242000, 136/203000

Abstract:

An electronic module is provided having an integrated thermoelectric cooling assembly disposed therein coupled to the module's electronic device. The thermoelectric assembly includes one or more thermoelectric stages and a thermal space transformer, for example, disposed between a first thermoelectric stage and a second thermoelectric stage. The electronic device is mounted to a substrate with the thermoelectric assembly disposed in thermal contact with the electronic device and a thermally conductive cap is positioned over the thermoelectric assembly, and is also in thermal contact with the thermoelectric assembly. Power to the thermoelectric assembly can be provided using electrically conductive springs disposed between one or more stages of the assembly and pads on an upper surface of the substrate, which electrically connect to power planes disposed within the substrate.

US Patent:

20020063327, May 30, 2002

Filed:

Nov 30, 2000

Appl. No.:

09/726909

Inventors:

Richard Chu - Poughkeepsie NY, US
Michael Ellsworth - Lagrangeville NY, US
Robert Simons - Poughkeepsie NY, US

International Classification:

H01L021/48
H01L035/34
H01L035/28
B23K026/14
H01L023/10
H01L031/00
B23K026/38
H01L021/44

US Classification:

257/706000, 136/201000, 136/203000, 136/293000, 219/121690, 438/122000, 438/125000, 257/707000, 257/712000, 257/713000, 257/718000, 438/117000, 257/719000

Abstract:

An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.

US Patent:

20020079088, Jun 27, 2002

Filed:

Dec 21, 2000

Appl. No.:

09/742919

Inventors:

Dereje Agonafer - Grand Prairie TX, US
Richard Chu - Poughkeepsie NY, US
Michael Ellsworth - Lagrangeville NY, US
Robert Simons - Poughkeepsie NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

F28F007/00

US Classification:

165/080400

Abstract:

Cavity plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a cavity plate having one or more blind holes formed therein and one or more jet nozzles each configured to reside within a respective blind hole of the cavity plate. A lower surface of the blind hole and/or jet nozzle is curved to facilitate the flow of fluid from the blind hole after impinging upon the lower surface of the blind hole. Various jet nozzle configurations are also provided which employ pedestals or radially extending fins. Further, the radially extending fins may interdigitate with inwardly extending fins on the inner sidewall of a respective blind hole in the cavity plate. Methods of fabricating the cavity plate and jet nozzle assemblies are also presented.

US Patent:

20020079117, Jun 27, 2002

Filed:

Dec 27, 2000

Appl. No.:

09/748829

Inventors:

Jeffrey Coffin - Pleasant Valley NY, US
Michael Ellsworth - Lagrangeville NY, US
Lewis Goldmann - Bedford NY, US
John Torok - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H02G003/08

US Classification:

174/052100

Abstract:

A capping structure and capping method are presented for an electronics package having a substrate and one or more electronics devices disposed on the substrate. The capping structure includes a capping plate sized to cover the electronics device(s) disposed on the substrate, and two or more force transfer pins. The force transfer pins are disposed between the capping plate and the substrate so that when a force is applied to the capping plate or the substrate, the force is transferred therebetween via the force transfer pins. Various capping plate and pin configurations are presented.

Address:

5 Scott Ln, Lagrangeville, NY 12540

Phone:

(845)2267374

VIN:

5J6RE48709L061968

Make:

HONDA

Model:

CR-V

Year:

2009