Michael Edwin Garner

US Patent:

6770966, Aug 3, 2004

Filed:

Jul 31, 2001

Appl. No.:

09/920275

Inventors:

Gregory M. Chrysler - Chandler AZ
Abhay A. Watwe - Chandler AZ
Sairam Agraharam - Phoenix AZ
Kramadhati V. Ravi - Atherton CA
Michael C. Garner - Pleasanton CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 2310

US Classification:

257706

Abstract:

Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

US Patent:

6921706, Jul 26, 2005

Filed:

Feb 6, 2004

Appl. No.:

10/773879

Inventors:

Gregory M. Chrysler - Chandler AZ, US
Abhay A. Watwe - Chandler AZ, US
Sairam Agraharam - Phoenix AZ, US
Kramadhati V. Ravi - Atherton CA, US
Michael C. Garner - Pleasanton CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L021/46
H01L021/78
H01L021/301

US Classification:

438460, 438113

Abstract:

Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

US Patent:

7170098, Jan 30, 2007

Filed:

Feb 3, 2005

Appl. No.:

11/050902

Inventors:

Gregory M. Chrysler - Chandler AZ, US
Abhay A. Watwe - Chandler AZ, US
Sairam Agraharam - Phoenix AZ, US
Kramadhati V. Ravi - Atherton CA, US
Michael C. Garner - Pleasanton CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 31/0312

US Classification:

257 77, 257103, 257713, 257678, 257E21122, 257E21568

Abstract:

Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

US Patent:

7432532, Oct 7, 2008

Filed:

Jul 31, 2006

Appl. No.:

11/496934

Inventors:

Gregory M. Chrysler - Chandler AZ, US
Abhay A. Watwe - Chandler AZ, US
Sairam Agraharam - Phoenix AZ, US
Kramadhati V Ravi - Atherton CA, US
Michael C. Garner - Pleasanton CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 21/00

US Classification:

257 77, 257103, 257678, 257713, 257E21222, 257E21568, 257E23111

Abstract:

Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

US Patent:

20210110371, Apr 15, 2021

Filed:

Dec 21, 2020

Appl. No.:

17/129347

Inventors:

- Bentonville AR, US
Michael A. Garner - Centerton AR, US

International Classification:

G06Q 20/20
G06K 9/32
G06K 9/00
G06N 20/00
G06F 16/535
G06K 9/62
G06N 5/04
G06Q 10/08
G06Q 20/12
G06Q 20/42
G06Q 30/06

Abstract:

In some embodiments, systems and methods are provided to recognize retail products in a physical retail store through a portable device that comprises a decision control circuit configured to: process each frame of the subset of frames by multiple modeling techniques each relative to a corresponding image attribute and obtain a corresponding product identification probability; determine corresponding aggregated identification probabilities of the first product based on the product identification probabilities; collectively evaluate the aggregated identification probabilities and identify when a predefined relationship with a collective threshold probability exists; and cause an image of the first product to be displayed in response to identifying that one or more of the aggregated identification probabilities having the predefined relationship with the collective threshold probability.

US Patent:

20200273013, Aug 27, 2020

Filed:

Feb 25, 2020

Appl. No.:

16/800290

Inventors:

- Bentonville AR, US
Michael A. Garner - Centerton AR, US

International Classification:

G06Q 20/20
G06K 9/00
G06K 9/32

Abstract:

In some embodiments, systems and methods are provided to recognize retail products in a physical retail store through a portable device that comprises a decision control circuit configured to: process each frame of the subset of frames by multiple modeling techniques each relative to a corresponding image attribute and obtain a corresponding product identification probability; determine corresponding aggregated identification probabilities of the first product based on the product identification probabilities; collectively evaluate the aggregated identification probabilities and identify when a predefined relationship with a collective threshold probability exists; and cause an image of the first product to be displayed in response to identifying that one or more of the aggregated identification probabilities having the predefined relationship with the collective threshold probability.