Michael Lee Grove

US Patent:

7617160, Nov 10, 2009

Filed:

Feb 5, 2003

Appl. No.:

10/361099

Inventors:

Michael Grove - Redwood City CA, US
Deborah Grove - Redwood City CA, US
Larry Van der Veen - San Carlos CA, US
Alexei Strots - San Jose CA, US

International Classification:

G06Q 90/00

US Classification:

705500

Abstract:

A method and apparatus for building relationship opportunities for event participants with similar interests before, during and after the event are disclosed. The method includes creating a profile of a first user registered for an event, the profile includes terms indicative of preferences and characteristics of the first user. The method also includes receiving an inquiry from the first user for at least one match based on at least one keyword and providing a list of matches to the user in response to the inquiry, wherein the match is a second user sharing similar interests with the first user.

US Patent:

57961646, Aug 18, 1998

Filed:

Mar 25, 1996

Appl. No.:

8/621563

Inventors:

Mark T. McGraw - Saratoga CA
Bradley L. Griswold - San Jose CA
Chung W. Ho - Monte Sereno CA
Michael I. Grove - Redwood City CA
William C. Robinette - Los Altos CA

Assignee:

MicroModule Systems, Inc. - Cupertino CA

International Classification:

H01L 2334
H01L 2302
H01L 2328

US Classification:

257723

Abstract:

A thin MCM packaging structure and technique is provided in which a thin film decal interconnect circuit is fabricated on a thin aluminum wafer. The thin-film decal interconnect employs Au metallurgy for bonding and comprises a bond pad/ground plane layer, topside pads, and one or more routing layers. The top routing layer also acts as the pad layer along the edge of the interconnect structure. The underside of the decal interconnect structure is provided with metal pads for attachment to conventional aluminum or gold I/O pads on one surface of the integrated circuit die. A thermosonic bonding system is used to bond the die pads to the pads. The aluminum wafer is selectively removed forming one or more cavities to hold one or more die to be mounted on the MCM structure. The die are oriented with their pads in contact with contact pads on the thin-film decal interconnect to which they are bonded and the cavities are filled with a liquid encapsulant and cured. A leadframe has inner bond leads electrically bonded to bonding pads of the thin film multilayer interconnect circuit disposed about a periphery thereof and a multi-layer laminate board is mechanically bonded over the thin film multilayer interconnect circuit and over the inner bond leads of the lead frame and has a first layer including conductive pads extending outward from about an inner periphery thereof, and a second layer including apertures aligned with outwardly extending portions of the conductive pads.

Address:

5643 Indigo St, Houston, TX 77096

VIN:

4TM1DDH217B001001

Make:

Toyota

Model:

Tacoma XtraCab V6 Manual

Year:

2007