Michael Eric Huff

US Patent:

6622558, Sep 23, 2003

Filed:

Nov 30, 2000

Appl. No.:

09/726257

Inventors:

Michael A. Huff - Fairfax VA
William L. Benard - Reston VA
Frederick J. Lisy - Euclid OH
Troy S. Prince - Cleveland OH

Assignee:

Orbital Research Inc. - Cleveland OH

International Classification:

G01B 530

US Classification:

734321, 73760, 73768, 73774, 73795

Abstract:

A method and sensor for detecting strain using shape memory alloys is disclosed. The sensor comprises a substrate material, a flexible diaphragm provided on the substrate material and a thin film SMA material deposited on the flexible diaphragm. The thin film SMA material is capable of undergoing a phase transformation in response to a physical stimulus being applied thereto. During such a phase transformation, a change occurs in the electrical resistance of the thin film SMA material. By measuring the value of the electrical resistance of the thin film SMA material immediately before and after the thin film SMA material undergoes a phase transformation, the difference in the value of the electrical resistance can be determined and utilized to determine the magnitude of the physical stimulus that was applied to the thin film SMA material causing it to undergo a phase transformation.

US Patent:

6815739, Nov 9, 2004

Filed:

May 20, 2002

Appl. No.:

10/147907

Inventors:

Michael A. Huff - Oakton VA
Mehmet Ozgur - Reston VA

Assignee:

Corporation for National Research Initiatives - Reston VA

International Classification:

H01L 2980

US Classification:

257275, 257415, 257798, 438455, 438456

Abstract:

A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (âMEMSâ) and low-temperature co-fired ceramic (âLTCCâ) technology and a method of fabricating such phased-array antenna system and other types of radio frequency (RF) devices are disclosed. Each antenna or other type of device includes at least two multilayer ceramic modules and a MEMS device fabricated on one of the modules. Once fabrication of the MEMS device is completed, the two ceramic modules are bonded together, hermetically sealing the MEMS device, as well as allowing electrical connections between all device layers. The bottom ceramic module has also cavities at the backside for mounting integrated circuits. The internal layers are formed using conducting, resistive and high-k dielectric pastes available in standard LTCC fabrication and low-loss dielectric LTCC tape materials.

US Patent:

6909589, Jun 21, 2005

Filed:

Nov 20, 2003

Appl. No.:

10/716866

Inventors:

Michael A. Huff - Oakton VA, US

Assignee:

Corporation for National Research Initiatives - Reston VA

International Classification:

H01G007/00
H01G007/06

US Classification:

361281, 361278

Abstract:

A variable capacitor device using MEMS or micromachining techniques wherein thin-films of materials are deposited, patterned and etched to form movable micromechanical elements on the surface of a substrate composed of either semiconductor, glass, metal, or ceramic material. In one embodiment of the present invention to achieve higher frequency performance as well as other benefits, the substrate is comprised of Low-Temperature Co-Fired Ceramics (LTCC). The variable capacitor is an electrostatically actuated micromechanical device and if fabricated on a LTCC multi-layered substrate material has continuous electrical connections through the layers. The same LTCC substrate material can also be used to enclose the device by selectively removing a portion of the upper substrate so as to form a cavity. The two substrates are then bonded together to enclose and protect the variable capacitor. An integrated circuit can be incorporation onto the multi-level substrate structure to enable a electronic closed-loop controlled variable capacitor module.

US Patent:

7012327, Mar 14, 2006

Filed:

Apr 30, 2004

Appl. No.:

10/835590

Inventors:

Michael A. Huff - Oakton VA, US
Mehmet Ozgur - Reston VA, US

Assignee:

Corporation for National Research Initiatives - Reston VA

International Classification:

H01L 29/80

US Classification:

257686, 257428

Abstract:

A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”) technology and a method of fabricating such phased-array antenna system and other types of radio frequency (RF) devices are disclosed. Each antenna or other type of device includes at least two multilayer ceramic modules and a MEMS device fabricated on one of the modules. Once fabrication of the MEMS device is completed, the two ceramic modules are bonded together, hermetically sealing the MEMS device, as well as allowing electrical connections between all device layers. The bottom ceramic module has also cavities at the backside for mounting integrated circuits. The internal layers are formed using conducting, resistive and high-k dielectric pastes available in standard LTCC fabrication and low-loss dielectric LTCC tape materials.

US Patent:

7017419, Mar 28, 2006

Filed:

Aug 31, 2004

Appl. No.:

10/929446

Inventors:

Michael Pedersen - Bethesda MD, US
Mehmet Ozgur - Reston VA, US
Michael A. Huff - Oakton VA, US

Assignee:

Corporation for National Research Initiatives - Reston VA

International Classification:

G01L 9/12

US Classification:

73718

Abstract:

A micro-mechanical pressure transducer is disclosed in which a capacitive transducer structure is integrated with an inductor coil to form a LC tank circuit, resonance frequency of which may be detected remotely by imposing an electromagnetic field on the transducer. The capacitive transducer structure comprises a conductive movable diaphragm, a fixed counter electrode, and a predetermined air gap between said diaphragm and electrode. The diaphragm deflects in response to an applied pressure differential, leading to a change of capacitance in the structure and hence a shift of resonance frequency of the LC tank circuit. The resonance frequency of the LC circuit can be remotely detected by measuring and determining the corresponding peak in electromagnetic impedance of the transducer.

US Patent:

7024936, Apr 11, 2006

Filed:

Jun 17, 2003

Appl. No.:

10/462811

Inventors:

Michael Pedersen - Bethesda MD, US
Mehmet Ozgur - Reston VA, US
Michael A. Huff - Oakton VA, US

Assignee:

Corporation for National Research Initiatives - Reston VA

International Classification:

G01L 9/12

US Classification:

73718, 73724

Abstract:

A micro-mechanical pressure transducer is disclosed in which a capacitive transducer structure is integrated with an inductor coil to form a LC tank circuit, resonance frequency of which may be detected remotely by imposing an electromagnetic field on the transducer. The capacitive transducer structure comprises a conductive movable diaphragm, a fixed counter electrode, and a predetermined air gap between said diaphragm and electrode. The diaphragm deflects in response to an applied pressure differential, leading to a change of capacitance in the structure and hence a shift of resonance frequency of the LC tank circuit. The resonance frequency of the LC circuit can be remotely detected by measuring and determining the corresponding peak in electromagnetic impedance of the transducer.

US Patent:

7045440, May 16, 2006

Filed:

Sep 17, 2003

Appl. No.:

10/663986

Inventors:

Michael A. Huff - Oakton VA, US
Mehmet Ozgur - Reston VA, US

Assignee:

Corporation for National Research Initiatives - Reston VA

International Classification:

H01L 21/46
H01L 21/50

US Classification:

438456, 438107, 438126, 257703, 257724, 333250, 333258, 333262, 343700

Abstract:

A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”) technology and a method of fabricating such phased-array antenna system and other types of radio frequency (RF) devices are disclosed. Each antenna or other type of device includes at least two multilayer ceramic modules and a MEMS device fabricated on one of the modules. Once fabrication of the MEMS device is completed, the two ceramic modules are bonded together, hermetically sealing the MEMS device, as well as allowing electrical connections between all device layers. The bottom ceramic module has also cavities at the backside for mounting integrated circuits. The internal layers are formed using conducting, resistive and high-k dielectric pastes available in standard LTCC fabrication and low-loss dielectric LTCC tape materials.

US Patent:

7052926, May 30, 2006

Filed:

Dec 20, 2004

Appl. No.:

11/015721

Inventors:

Michael A. Huff - Oakton VA, US

Assignee:

Corporation for National Research Initiatives - Reston VA

International Classification:

H01L 21/00

US Classification:

438 48, 438 50, 438 52, 438 53

Abstract:

A method of fabricating a high-aspect ratio micro-mechanical device or system with dimensions that can vary from nanometers to millimeters is disclosed. According to the method, a tool master with a high-aspect ratio, submicron lateral resolution and vertical dimensions substantially corresponding to the vertical dimensions of the device or system is formed. The tool master and a substrate sized for the device or system are heated to a temperature at which the substrate becomes compliant. The heated tool master and substrate are then pressed together so as to imprint the shape and form of the tool master into the substrate. The temperature of the tool master and substrate are then lowered, whereupon the tool master and substrate are separated and cooled to ambient temperature. The tool master can have a plurality of duplications to form a plurality of devices or systems. The substrate is composed of a laminate comprised of a sacrificial layer and a structural layer.