Michael Timothy Knight

US Patent:

53991044, Mar 21, 1995

Filed:

Sep 28, 1992

Appl. No.:

7/951906

Inventors:

Richard J. Middlehurst - Fremont CA
Michael K. Knight - Fremont CA

Assignee:

McKenzie Socket Technology, Inc. - Fremont CA

International Classification:

H01R 13648

US Classification:

439608

Abstract:

A socket and a method for making a socket for securing an integrated circuit package to a supporting structure. The integrated circuit package has a plurality of leads positioned in a geometric pattern and each lead has a predetermined impedance. The socket comprises a substrate or body having a first and second surface opposed to each other and formed of an insulative material. The socket further comprises a plurality signal path members extending from at least the first surface to the second surface. Each signal path member includes a first and second end. One end of each signal path member includes a means positioned to secure a lead of an integrated circuit package and the other end is adapted to be coupled to a conductor on a printed circuit board. A metal pattern or ground plane mesh is defined on at least a surface of the substrate, and coated through holes are defined in the substrate at a predetermined distance such that the impedance of at least one signal path is controlled to match the anticipated impedance of the lead. Further, radio-frequency interference with at least one signal path is suppressed.

US Patent:

55271898, Jun 18, 1996

Filed:

Jun 20, 1995

Appl. No.:

8/492865

Inventors:

Richard J. Middlehurst - Fremont CA
Michael K. Knight - Fremont CA

Assignee:

Berg Technology, Inc. - Reno NV

International Classification:

H01R 13648

US Classification:

439608

Abstract:

A socket and a method for making a socket for securing an integrated circuit package to a supporting structure. The integrated circuit package has a plurality of leads positioned in a geometric pattern and each lead has a predetermined impedance. The socket comprises a substrate or body having a first and second surface opposed to each other and formed of an insulative material. The socket further comprises a plurality signal path members extending from at least the first surface to the second surface. Each signal path includes a first and second end. One end of each signal path member includes a means positioned to secure a lead of an integrated circuit package and the other end is adapted to be coupled to a conductor on a printed circuit board. A metal pattern or ground plane mesh is defined on at least a surface of the substrate, and coated through holes are defined in the substrate at a predetermined distance such that the impedance of at least one signal path is controlled to match the anticipated impedance of the lead. Further, radio-frequency interference with at least one signal path is suppressed.