Michael Lynn Matthews

US Patent:

20140042212, Feb 13, 2014

Filed:

Dec 31, 2012

Appl. No.:

13/732308

Inventors:

Peter A. Matturri - Del Mar CA, US
Kenneth C. Holcomb - San Diego CA, US
Michael C. Matthews - Encinitas CA, US

Assignee:

Ormet Circuits, Inc. - San Diego CA

International Classification:

B23K 35/02
B23K 1/20

US Classification:

2282481, 75255, 75252, 75338

Abstract:

Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties.

US Patent:

62676296, Jul 31, 2001

Filed:

May 26, 1999

Appl. No.:

9/318716

Inventors:

Cam T. Nguyen - San Diego CA
Darrin J. Marthens - Poway CA
Michael G. Matthews - Poway CA
David J. Saltzman - San Diego CA

Assignee:

Qualcomm Incorporated - San Diego CA

International Classification:

H01R 1122
H01R 1311

US Classification:

439857

Abstract:

A method of clipping and a clip configured to retain a cover onto a circuit board. The clip comprises a base plate having right and left sides. The base plate is configured to be fixed to the circuit board. The clip further comprises at least two right walls connected to and extending upwardly away from the base plate. Each of the right walls has a right upper portion. The clip further comprises at least two left walls connected to and extending upwardly away from the base. Each of the left walls has a left upper The right and left walls are spring biased inwardly so that at least a portion of the right and left upper portions overlap. In another embodiment, the right wall includes at least one opening and the left wall includes a middle segment extending towards the opening of the right wall.

US Patent:

20200180233, Jun 11, 2020

Filed:

Feb 14, 2020

Appl. No.:

16/791134

Inventors:

- San Diego CA, US
Peter A. MATTURRI - Del Mar CA, US
Michael C. MATTHEWS - Encinitas CA, US

International Classification:

B29C 65/48
B32B 37/12
B29C 65/50

Abstract:

An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.

US Patent:

20180358318, Dec 13, 2018

Filed:

Apr 27, 2016

Appl. No.:

15/562772

Inventors:

- San Diego CA, US
Eunsook Barber - San Diego CA, US
Michael Matthews - San Diego CA, US

International Classification:

H01L 23/00
B23K 35/02
B23K 1/00
B23K 35/30
B23K 35/36
B23K 35/362

Abstract:

A semiconductor die attach composition with greater than 60% metal volume after thermal reaction having: (a) 80-99 wt % of a mixture of metal particles comprising 30-70 wt % of a lead-free low melting point (LMP) particle composition comprising at least one LMP metal Y that melts below a temperature T, and 25-70 wt % of a high melting point (HMP) particle composition comprising at least one metallic element M that is reactive with the at least one LMP metal Y at a process temperature T, wherein the ratio of wt % of M to wt % of Y is at least 1.0; (b) 0-30 wt % of a metal powder additive A; and (c) a fluxing vehicle having a volatile portion, and not more than 50 wt % of a non-volatile portion.

US Patent:

20140120356, May 1, 2014

Filed:

Mar 15, 2013

Appl. No.:

13/843555

Inventors:

ORMET CIRCUITS, INC. - , US
Peter A. Matturri - Del Mar CA, US
Michael C. Matthews - Encinitas CA, US

Assignee:

ORMET CIRCUITS, INC. - San Diego CA

International Classification:

C09J 9/02
C09J 5/06

US Classification:

428457, 252512, 156 60

Abstract:

An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.