Michael A Olla

US Patent:

7413688, Aug 19, 2008

Filed:

Sep 17, 2001

Appl. No.:

09/954717

Inventors:

Kenneth Noddings - Austin TX, US
Daniel Marshall Andrews - Austin TX, US
Michael Anthony Olla - Austin TX, US
Thomas Alan Bishop - Austin TX, US

International Classification:

B29D 11/00
G02B 6/26
G02B 6/42

US Classification:

264 125, 264 126, 264261

Abstract:

A method of forming a waveguide or an optical assembly includes molding a waveguide material, optionally in alignment with one or more optical components. The one or more optical components are aligned in a precision mold that is also used to form the waveguide. A cladding and encapsulation material can also be molded. The molded materials can be used to hold the components together in alignment in a single assembly. A connector structure can be molded as part of the assembly or can be prefabricated and incorporated into the molded assembly to facilitate connecting the assembly to other components without requiring active alignment or polishing of optical fiber ends.

US Patent:

8021058, Sep 20, 2011

Filed:

Aug 18, 2008

Appl. No.:

12/193596

Inventors:

Kenneth Noddings - Manhattan Beach CA, US
Daniel Marshall Andrews - Austin TX, US
Thomas Alan Bishop - Austin TX, US
Michael Anthony Olla - Austin TX, US

International Classification:

G02B 6/36
B29D 11/00

US Classification:

385 94, 385 39, 385 49, 385 73, 385 76, 385 78, 385 83, 385 88, 385 92, 264 125, 264 126

Abstract:

A method of forming a waveguide or an optical assembly includes molding a waveguide material, optionally in alignment with one or more optical components. The one or more optical components are aligned in a precision mold that is also used to form the waveguide. A cladding and encapsulation material can also be molded. The molded materials can be used to hold the components together in alignment in a single assembly. A connector structure can be molded as part of the assembly or can be prefabricated and incorporated into the molded assembly to facilitate connecting the assembly to other components without requiring active alignment or polishing of optical fiber ends.

US Patent:

52653218, Nov 30, 1993

Filed:

Sep 22, 1992

Appl. No.:

7/949182

Inventors:

Richard D. Nelson - Austin TX
Michael A. Olla - Austin TX
Seyed H. Hashemi - Austin TX
Thomas P. Dolbear - Austin TX

Assignee:

Microelectronics And Computer Technology Corporation - Austin TX

International Classification:

H05K 720

US Classification:

29841

Abstract:

An integrated circuit structure and method of making in which the circuit has a plurality of metal heat exchanger elements spaced from each other with their first ends secured to the structure. The first ends may be adhesively secured to an integrated circuit chip or the underlying substrate, and the heat exchanger may be hermetically attached. The method uses a compliant removable support block for attaching the plurality of individual heat exchanger elements to integrated circuit structures having variations in their elevation.

US Patent:

51712903, Dec 15, 1992

Filed:

Sep 3, 1991

Appl. No.:

7/754472

Inventors:

Michael A. Olla - Austin TX
Howard A. Moore - Austin TX
Daniel M. Andrews - Austin TX

Assignee:

Microelectronics And Computer Technology Corporation - Austin TX

International Classification:

H01R 909

US Classification:

439 71

Abstract:

A testing and burn in socket compatible with the high density test pads located at small pitches devices on a TAB tape. A TAB tape carrier for supporting the TAB tape and a test circuit board having contact pads for electrical communication with the test pads. An alignment fixture positioned between the tape carrier and circuit board and including an opening in alignment between the test pads and the contact pads. A metal in elastomer matrix is positioned in the opening for providing electrical communication between the test pads and the contact pads. A block may be positoned in the openings and contain a plurality of straight parallel electrically conductive pins aligned with the matrix for high frequency tests.

US Patent:

50655043, Nov 19, 1991

Filed:

Nov 5, 1990

Appl. No.:

7/608769

Inventors:

Michael A. Olla - Austin TX

Assignee:

Microelectronics and Computer Technology Corporation - Austin TX

International Classification:

H01R 4300
B23P 2500

US Classification:

29827

Abstract:

Slide forming tape-automated-bonded leads extending from an integrated circuit chip with a support ring on the leads between the outer periphery of the chip and the outer lead ends. After the leads are formed the support ring remains attached to the vertical portion of the leads opposite the chip. The present invention is well suited for minimizing and footprint on relatively long TAB leads which fan out and require a support ring to maintain proper lead pitch.

US Patent:

53447956, Sep 6, 1994

Filed:

Sep 22, 1992

Appl. No.:

7/949189

Inventors:

Seyed H. Hashemi - Austin TX
Michael A. Olla - Austin TX
Thomas P. Dolbear - Austin TX
Richard D. Nelson - Austin TX

Assignee:

Microelectronics And Computer Technology Corporation - Austin TX

International Classification:

H01L 2156
H01L 2158
H01L 2160

US Classification:

437214

Abstract:

A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the integrated circuit and the other end is exposed to the environment beyond the housing portion. The process of making includes molding a heat exchanger into a thermosetting or thermoplastic package utilizing a preformed heat exchanger having a dissolvable or removable material which serves as a seal block during the molding operation. A plurality of thermally conductive heat exchanger elements are provided for providing the desired thermal performance while reducing the thermal stresses in the package.

US Patent:

55748147, Nov 12, 1996

Filed:

Jan 31, 1995

Appl. No.:

8/381168

Inventors:

Kenneth C. Noddings - Austin TX
Robert C. Gardner - Boston MA
Thomas J. Hirsch - Austin TX
Charles L. Spooner - Austin TX
Michael A. Olla - Austin TX
Jason J. Yu - Austin TX

Assignee:

Microelectronics and Computer Technology Corporation - Austin TX

International Classification:

G02B 636

US Classification:

385 90

Abstract:

An assembly of an optical interconnect module adaptable for mating with an optical connector having at least one optical fiber and an alignment pin. A method of assembly includes the steps of (1) mounting an optical device onto a connector body, wherein the connector body is a portion of the optical interconnect module, and wherein the optical device is operable for transmitting or receiving optical signals to/from the optical fiber, (2) inputting a relative position between the alignment pin and an end of the optical fiber, (3) and forming a slot in the connector body by using the measured relative position between the alignment pin and the end of the optical fiber, wherein a relative position between the slot and the optical transceiver mirrors the relative position between the alignment pin and the end of the optical fiber so that the optical device and the end of the optical fiber are substantially aligned to permit transmission of the optical signals when the optical connector and the optical interconnect module are mated, wherein the slot is adaptable for receiving the alignment pin.

US Patent:

50579037, Oct 15, 1991

Filed:

Nov 8, 1990

Appl. No.:

7/611391

Inventors:

Michael A. Olla - Austin TX

Assignee:

Microelectronics and Computer Technology Corporation - Austin TX

International Classification:

H01L 1100
H01L 2330

US Classification:

357 72

Abstract:

An encapsulated integrated circuit which includes an integrated circuit die having a plurality of electric leads extending from the die. A thermal heat sink is positioned adjacent the die. The heat sink includes a thermoplastic material having a plurality of thermoconductive particles molded therein. A non-electrically conductive plastic material is sealably connected to the heat sink and encloses the die and seals around the leads. The heat sink plastic material is filled approximately 50 percent with metal particles, preferably in the form of powder. The particles may be from a group consisting of copper, aluminum, iron, carbon, aluminum nitride, silicon carbide, and boron nitride. The heat sink and the non-conductive plastic material have coacting interlocking interfaces.