Michael A Palmer

Address:

7014 Andtree Blvd, San Antonio, TX 78250

VIN:

1G6DP577X70132483

Make:

CADILLAC

Model:

CTS

Year:

2007

US Patent:

54428602, Aug 22, 1995

Filed:

Jul 15, 1993

Appl. No.:

8/092395

Inventors:

Michael R. Palmer - Suffern NY

International Classification:

F41G 154

US Classification:

33233

Abstract:

A device for aiding in the cross-hair alignment of the reticle of a gun-mounted telescopic sight wherein the gun includes at least one mounting boss for securing the telescopic sight. The device includes a card having a viewing surface and a contact edge and at least one reference line located on the viewing surface and also aligned "true" with the contact edge. The contact edge of the card is adapted to be positioned in an abutting relationship with the mounting boss of the gun, independent of the telescopic sight so that the reference line on the card automatically aligns with the barrel axis and so that the viewing surface of the card lies adjacent to the reticle. The relative position of the card abutted onto the mounting boss allows the sighting hairline of the reticle to be compared with the reference line and properly adjusted.

US Patent:

48322555, May 23, 1989

Filed:

Jul 25, 1988

Appl. No.:

7/223818

Inventors:

Harry R. Bickford - Ossining NY
Kurt R. Grebe - Beacon NY
Caroline A. Kovac - Ridgefield CT
Michael J. Palmer - Walden NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 300
H01L 2158

US Classification:

228254

Abstract:

This invention employs a carrier upon which a thin conductive film has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask is disposed on the conductive film, with the mask having openings which expose selected areas of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas of a circuit carrier, such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse. In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer. Subsequently, tool means which registers with the areas to be soldered, presses the base layer/solder combination against the areas to be coated with solder, thereby causing the solder to adhere to the underlying circuit configuration.

US Patent:

49395700, Jul 3, 1990

Filed:

Jul 25, 1988

Appl. No.:

7/223580

Inventors:

Harry R. Bickford - Ossining NY
Lawrence S. Mok - Yorktown Heights NY
Michael J. Palmer - Walden NY

Assignee:

International Business Machines, Corp. - Armonk NY

International Classification:

H01L 2302
H01L 2312
H01L 2348
H01L 2944

US Classification:

357 81

Abstract:

A TAB package is described which includes a flexible dielectric film with an outer edge, back and front faces and an aperture therein. The front face, as is conventional, is provided with a plurality of beam leads, which leads extend into the aperture and connect to a semiconductor chip. Thermally conductive body means is provided which has a well formed therein, the well defined by a lip comprising the outer rim of the body means. The back face of the semiconductor chip is thermally connected to the thermally conductive body means and the flexible dielectric film is formed to conform to the surface of the well and to extend over its rim whereby the beam leads also conform to the well and rim structure. The beam leads are thereby made available for electrical connection in the vicinity of the rim. Means are also provided for attaching the outer edge of the film to the thermally conductive body means so as to enable flexure of the film in the event of differential expansion or contraction at connection points.

US Patent:

48623229, Aug 29, 1989

Filed:

May 2, 1988

Appl. No.:

7/188805

Inventors:

Harry R. Bickford - Ossining NY
Mark F. Bregman - Ridgefield CT
Paul A. Moskowitz - Yorktown Heights NY
Michael J. Palmer - Walden NY
Timothy C. Reiley - Los Gatos CA
Paige A. Poore - Durham NC
Caroline A. Kovac - Ridgefield CT

International Classification:

H05K 720

US Classification:

361386

Abstract:

An integrated circuit device package in which integrated circuit devices are mounted with active faces placed facing each other to form a double-device structure. Input/output terminals on the active faces of each device can be electrically interconnected by placing an interconnection means between the chips to electrically interconnect input/output terminals on the active faces of the first and second device. Beam leads, each having an inner and outer lead bond site, project outwardly from between the devices where each of the inner lead bond site is solderlessly bonded between conducting patterns on each device bonded. A series of double-device structures can be formed on a tape having a plurality of sets of beam lead patterns thereon. Each beam lead of each set having an inner and outer lead bond site, projects outwardly from between the double-device structure, the inner lead bond site being solderlessly bonded between conducting patterns on each device.

US Patent:

51204185, Jun 9, 1992

Filed:

Mar 4, 1991

Appl. No.:

7/664388

Inventors:

Sung K. Kang - Chappaqua NY
Michael J. Palmer - Walden NY
Timothy C. Reiley - Los Gatos CA
Robert D. Topa - Binghamton NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C25D 1700
C25D 1712

US Classification:

204224R

Abstract:

A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0. 03 to 0. 05 mA/sq. cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separatre independently powered anodes, is provided.

US Patent:

51482614, Sep 15, 1992

Filed:

Jan 28, 1991

Appl. No.:

7/646413

Inventors:

Sung K. Kang - Chappaqua NY
Michael J. Palmer - Walden NY
Timothy C. Reiley - Los Gatos CA
Robert D. Topa - Binghamton NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2354

US Classification:

357 67

Abstract:

A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0. 03 to 0. 05 mA/sq. mm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

US Patent:

52425690, Sep 7, 1993

Filed:

Mar 4, 1991

Appl. No.:

7/664399

Inventors:

Sung K. Kang - Chappaqua NY
Michael J. Palmer - Walden NY
Timothy C. Reiley - Los Gatos CA
Robert D. Topa - Binghamton NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C25D 502

US Classification:

205 95

Abstract:

A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0. 03 to 0. 05 mA/sq. mm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

US Patent:

52054616, Apr 27, 1993

Filed:

May 16, 1990

Appl. No.:

7/524408

Inventors:

Harry R. Bickford - Ossining NY
Raymond R. Horton - Dover Plains NY
Ismail C. Noyan - Peekskill NY
Michael J. Palmer - Walden NY
John C. Zyzo - Waterbury CT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 112

US Classification:

228 20

Abstract:

Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound. Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.