Michael D Pickering

US Patent:

6811040, Nov 2, 2004

Filed:

Jul 9, 2002

Appl. No.:

10/191192

Inventors:

Thomas Payne - Charlton MA
Jitendra S. Goela - Andover MA
Lee E. Burns - Winchester MA
Michael A. Pickering - Dracut MA

Assignee:

Rohm and Haas Company - Philadelphia PA

International Classification:

A47G 1908

US Classification:

211 4118, 211183, 206832

Abstract:

A wafer holding apparatus composed of a plurality of rods joined at opposite ends by endplates. Each rod at each end is secured to the endplates by a mechanical dovetail joint. The dovetail joint secures the rods to the endplates without the need for sealing or coating agents. Also, auxiliary mechanical components such as nuts and bolts to secure the joint components need not be employed to secure the joint. Each rod has multiple grooves or slits for placing multiple semiconductor wafers that are to be processed in processing chambers. The wafer holding apparatus is oxidation resistant, chemical resistant and thermal shock resistant.