Michael A Previti

US Patent:

20070020810, Jan 25, 2007

Filed:

Jun 16, 2006

Appl. No.:

11/455226

Inventors:

Brian Eisenach - Alpharetta GA, US
Michael Previti - Alpharetta GA, US
Mark Wilson - Cumming GA, US
Avin Dhoble - Alpharetta GA, US

Assignee:

Cookson Singapore Pte Ltd. - Singapore

International Classification:

H01L 21/00
H01L 23/48
H01L 29/40
H01L 23/52
B32B 33/00
B32B 9/00

US Classification:

438118000, 428040100

Abstract:

A process for mounting a wafer on a substrate includes applying a pre-applied die attach on a backside of the wafer with a composition having a thermoplastic portion and a thermoset portion. The composition has a predetermined cure temperature. The process further includes heating the wafer to a temperature sufficient to remove solvents from the thermoplastic portion of the composition below the cure temperature, mounting the wafer on the substrate, and heating the wafer and the substrate to a temperature above the cure temperature to cure the thermoset portion of the pre-applied die attach composition. A composition for performing the process is further disclosed.

US Patent:

20060042076, Mar 2, 2006

Filed:

Aug 24, 2004

Appl. No.:

10/925306

Inventors:

Michael Previti - Alpharetta GA, US

International Classification:

H01P 11/00

US Classification:

029825000, 029600000, 343713000, 343704000

Abstract:

A composition for forming an electrically conductive bus, which comprises a polymer and conductive filler particles. A composition for forming an electrically conductive bus, comprising silver-based flakes within a polymer adhesive carrier such as polyurethane for forming a conductive bus for vehicle glass. A method for forming a glass laminate structure such as a windshield, with an electrically conductive bus for delivering current to a conductor for resistive heating of the structure.