Michael S Rasmussen

US Patent:

6802727, Oct 12, 2004

Filed:

Dec 6, 2001

Appl. No.:

10/010976

Inventors:

Gregory Jay Geilow - Eyota MN
Michael Lee Graham - Rochester MN
Lavern Richard Markham - Oronoco MN
Michael Robert Rasmussen - Mazeppa MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 1362

US Classification:

439160, 439372, 439296

Abstract:

This device is advantageous for connecting an electronic circuit card to a test system to inspect the assembled electronic circuit card without damage to the mating connector thereon. A toggle actuated pressing member supports an electrical connector and a flex cable which, in turn, is connected to an electronic device. The pressing member or slide member may be moved toward a mating electrical connector attached to an electronic circuit card, aligned with the connector on the slide member, and forced into a connected condition therewith. The controlled action of the slide block and the connector supported thereon effect connection of the connectors without creating stresses that may damage the electronic circuit card or the connector thereon. A connector supported by the slide block is disconnected by moving the slide block away from the electronic circuit card and, by permitting spring-biased foot blocks to hold the electronic circuit card against movement until after disengagement occurs.

US Patent:

7255577, Aug 14, 2007

Filed:

Apr 14, 2005

Appl. No.:

11/106008

Inventors:

Michael Lee Graham - Rochester MN, US
Mark Ward Hansen - Byron MN, US
Michael Robert Rasmussen - Mazeppa MN, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 12/00

US Classification:

439 761, 439946

Abstract:

A protective cover for a dual inline memory module (DIMM) circuit card includes a pair of cover members for substantially containing the DIMM circuit card. The cover members are secured to opposite sides of the DIMM circuit card. The pair of cover members defines a socket-receiving channel between respective printed-circuit-board (PCB) mating faces of the cover members. The cover members includes a plurality of positioning features engaging the DIMM circuit card for positioning a portion of the DIMM circuit card within the socket-receiving channel.

US Patent:

8289712, Oct 16, 2012

Filed:

Jun 21, 2010

Appl. No.:

12/819753

Inventors:

Maurice F Holahan - Lake City MN, US
Eric Vance Kline - Rochester MN, US
Paul N Krystek - Highland NY, US
Michael R Rasmussen - Mazeppa MN, US
Arvind K Sinha - Rochester MN, US
Stephen M Zins - Oronoco MN, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 7/20

US Classification:

361710, 361709, 361715, 361718

Abstract:

A thermal flow material-free thermally conductive interface between a mounted integrated circuit device and a heat sink that comprises a mounted integrated circuit device, a heat sink vertically disposed over the device, a vertically compressible thermally conductive member unattachably disposed between the device and the heat sink, and an unattached frame member horizontally enclosing the compressible member.

US Patent:

8432034, Apr 30, 2013

Filed:

May 25, 2011

Appl. No.:

13/115545

Inventors:

Eric Vance Kline - Rochester MN, US
Michael Robert Rasmussen - Mazeppa MN, US
Arvind Kumar Sinha - Rochester MN, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23/48
H01L 21/00

US Classification:

257738, 257774, 257779, 257E23021, 257E23069, 438108

Abstract:

An embodiment is directed to an IC mounting assembly that comprises an IC device having a first planar surface, wherein multiple electrically conductive first terminals are located at the first surface. The assembly further comprises an IC device mounting platform having a second planar surface in closely spaced relationship with the first surface, wherein multiple electrically conductive second terminals are located at the second surface, each second terminal corresponding to one of the first terminals. A solder element extends between each first terminal and its corresponding second terminal, and a constraining element is fixably joined to the second surface, wherein the constraining element has a CTE which is selectively less than the CTE of the mounting platform at the second surface. The constraining element is provided with a number of holes or apertures, and each hole is traversed by a solder element that extends between a first terminal and its corresponding second terminal.

US Patent:

20110303403, Dec 15, 2011

Filed:

Jun 11, 2010

Appl. No.:

12/814175

Inventors:

Maurice F. Holahan - Lake City MN, US
Eric V. Kline - Rochester MN, US
Paul N. Krystek - Highland NY, US
Michael R. Rasmussen - Mazeppa MN, US
Arvind K. Sinha - Rochester MN, US
Stephen M. Zins - Oronoco MN, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

F28F 21/00
B21D 53/02

US Classification:

165180, 2989003

Abstract:

An embodiment of the invention comprises a method for constructing a heat exchanger for cooling one or more semiconductor components. The method comprises the step of providing first and second planar sheets of specified thermally conductive metal foil, wherein each of the sheets has and exterior side and an interior side. The method further comprises forming one or more thermal contact nodes (TCNs) in the first sheet, wherein each TCN extends outward from the exterior side of the first sheet, and comprises a planar contact member and one or more side sections, the side sections respectively including resilient components that enable the contact member of the TCN to move toward and away from the exterior side of the first sheet, and the side sections and contact member of a TCN collectively forming a coolant chamber. Channel segments are configured along the interior side of the first sheet, wherein each channel extends between the coolant chambers and two TCNs, or between the coolant chamber of a TCN and an input port or output port, selectively. The method further comprises joining the interior side of the second sheet to the interior side of the first sheet, in order to form a sealed flow path that includes each channel segment, and enables liquid coolant to flow into and out of the coolant chamber of each TCN.

US Patent:

20120138269, Jun 7, 2012

Filed:

Dec 3, 2010

Appl. No.:

12/959477

Inventors:

Maurice F. Holahan - Lake City MN, US
Eric V. Kline - Rochester MN, US
Paul N. Krystek - Highland NY, US
Michael R. Rasmussen - Mazeppa MN, US
Arvind K. Sinha - Rochester MN, US
Stephen M. Zins - Oronocco MN, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

F28D 15/00

US Classification:

16510419

Abstract:

A method and system for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.

US Patent:

20120312510, Dec 13, 2012

Filed:

Jun 10, 2011

Appl. No.:

13/157522

Inventors:

Eric A. Eckberg - Rochester MN, US
Eric V. Kline - Rochester MN, US
Paul N. Krystek - Highland NY, US
Michael R. Rasmussen - Mazeppa MN, US
Stephen M. Zins - Oronoco MN, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

F28D 15/00

US Classification:

16510433, 16510419

Abstract:

An embodiment of the invention is directed to coolant flow control apparatus, in association with a liquid flow through heat exchanger situated to cool one or more electronic or other device. The apparatus comprises a first input channel for carrying liquid coolant to a first input of the heat exchanger, and further comprises a flow control device positioned along a flow path that includes the first input channel. The flow control device is provided with a gating element supported for selected movement across the flow path, in order to selectively vary the amount of coolant moving through the flow path. The apparatus further include an actuator located in the flow control device that comprises a metal component which is directly tied to the gating element, wherein the metal component changes its shape in response to specified changes in coolant temperature, and a given change in the shape of the metal component acts to selectively move the gating element with respect to the flow path.

US Patent:

20130060813, Mar 7, 2013

Filed:

Sep 1, 2011

Appl. No.:

13/224231

Inventors:

Eric Alan Eckberg - Rochester MN, US
Eric Vance Kline - Rochester MN, US
Paul N. Krystek - Highland NY, US
Nathan Carl Mandelko - Chatfield MN, US
Michael Robert Rasmussen - Mazeppa MN, US
Arvind Kumar Sinha - Rochester MN, US
Stephen M. Zins - Oronoco MN, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

G06F 17/30

US Classification:

707783, 707E17005

Abstract:

A method, programmed medium and system are disclosed which provide increased secure tracking of materials and products through the use of a unique coding scheme. The coding scheme contains a unique security code identifier issued by a sole certification agency, and includes a non-coded scheme for public information, and a coded scheme for private information regarding the sourcing and development of materials and products. The disclosure provides for full tracking of a product throughout the supply chain by only certified participants. The disclosed system allows for increased secure tracking of materials and products, and allows for access to greater amounts of information at various stages of manufacture and/or assembly regarding a given material or product.