Michael C Todd

US Patent:

6882058, Apr 19, 2005

Filed:

Nov 5, 2002

Appl. No.:

10/289506

Inventors:

Bruce C. B. Chan - Chino Hills CA, US
Michael G. Todd - Anaheim Hills CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

H01L023/28

US Classification:

257787, 257788, 438118, 438 6, 525533, 524322

Abstract:

In accordance with the present invention, it has been discovered that the addition of organic acids provides improved performance properties to curable compositions, e. g. , improved flux compatibility, improved flow properties, improved voiding properties, and the like. Accordingly, there are provided curable compositions having improved performance properties, methods for the preparation thereof, and methods employing same. Also provided are novel articles prepared using invention compositions.

US Patent:

7582510, Sep 1, 2009

Filed:

Nov 9, 2004

Appl. No.:

10/595736

Inventors:

Michael G. Todd - Anaheim Hills CA, US
James T. Huneke - Irvine CA, US
Lawrence N. Crane - Huntington Beach CA, US
Gordon C. Fischer - Trabuco Canyon CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

H01L 21/44
H01L 21/48
H01L 21/50

US Classification:

438106, 438108, 438127

Abstract:

Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.

US Patent:

20070261883, Nov 15, 2007

Filed:

Apr 12, 2005

Appl. No.:

10/599875

Inventors:

Bruce Chan - Chino Hills CA, US
Michael Todd - Anaheim Hills CA, US
Maurice Edwards - Hacienda Heights CA, US

International Classification:

H05K 1/02
B29C 65/00

US Classification:

174259000, 156598000, 156060000

Abstract:

In accordance with the present invention, it has been discovered that the addition of one or more cationic catalyst(s), such as onium salts as defined herein, provides improved flux compatibility of underfill formulations in the presence of flux, flux residues and/or reaction products thereof. Accordingly, there are provided methods for improving the flux compatibility of underfill formulations in the presence of flux, flux residues and/or reaction products thereof. In accordance with another embodiment of the present invention, there are provided methods for improving HAST performance of underfill formulations, especially in the presence of flux, flux residues and/or reaction products thereof. In accordance with another embodiment of the present invention, there are provided methods for preparing underfill formulations having improved flux compatibility, especially in the presence of flux, flux residues and/or reaction products thereof. In yet another embodiment of the present invention, there are provided methods for adhesively attaching and/or encapsulating electronic components, especially in the presence of flux, flux residues and/or reaction products thereof. In a further embodiment of the present invention, there are provided articles produced by the above-described processes.

US Patent:

20080051524, Feb 28, 2008

Filed:

Aug 28, 2006

Appl. No.:

11/467610

Inventors:

Qing Ji - El Monte CA, US
Qiaohong Huang - Mission Viejo CA, US
Renzhe Zhao - Chino Hills CA, US
Michael Todd - Anaheim Hills CA, US

International Classification:

C08L 63/00
C08L 83/04
H01L 21/56
B32B 27/38

US Classification:

525476, 428413, 438127

Abstract:

This invention relates to epoxy-based compositions useful as adhesives and sealants, and more particularly to underfill sealant, compositions with improved impact resistance.

US Patent:

20100140542, Jun 10, 2010

Filed:

Dec 18, 2009

Appl. No.:

12/641569

Inventors:

Qing Ji - Chino Hills CA, US
Puwei Liu - San Marcos CA, US
My N. Nguyen - Poway CA, US
Michael Todd - Anaheim Hills CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

C09K 3/00

US Classification:

25218223

Abstract:

A composition of matter in liquid form at a temperature of 50 C. or less comprising a monofunctional benzoxazine compound embraced by the structurewhere R is a member selected from Calkyl, Calkenyl, each of which being optionally substituted or interrupted by one or more O, N, S, C═O, COO, and NHC═O, and Caryl,

US Patent:

61971456, Mar 6, 2001

Filed:

Aug 17, 1998

Appl. No.:

9/134729

Inventors:

Michael George Todd - Anaheim Hills CA
Rexanne M. Coyner - Farmington Hills MI
Andrew Zachary Glovatsky - Livonia MI
Daniel Phillip Dailey - West Bloomfield MI
Robert Edward Belke - West Bloomfield MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

H05K 300

US Classification:

156245

Abstract:

A method of attaching a flexible plastic film having electronic circuit traces to a rigid plastic substrate. The film and substrate are made from different incompatible plastic materials that do not bond to one another and have different CTE. The use of different or incompatible materials is useful where the properties of the backing structure and film are selected to achieve different results. For example, the flexible film may be selected from a material that provides a high melting point to withstand soldering while the backing material is selected from a low-cost and light weight plastic material that has a lower melting point. The film has conductive traces on at least one surface thereof and a backing surface. A heat activated adhesive is applied to the backing surface. The film is placed within an open injection mold and the mold is closed.

US Patent:

43335624, Jun 8, 1982

Filed:

Feb 2, 1981

Appl. No.:

6/230315

Inventors:

Michael A. Todd - Hacienda Heights CA

International Classification:

A45C 1100
B65D 8300

US Classification:

206 37

Abstract:

A body member has a cavity with an opening adapted and constructed to receive a plug member in sealed engagement therewith, the plug member having a chamber which opens into the cavity when the plug member is engaged in the opening of the cavity, the chamber in the plug member being constructed and adapted to receive and hold a substantial portion of the length of a roll of paper containing written information such that when the plug is secured in the opening in the cavity of the body member the chamber and its contents are enclosed without restriction and protected by the body member and when the plug member is removed from the body member the chamber and its contents are exposed and readily accessible for removal and examination of the contents.