Michael E West

US Patent:

7220490, May 22, 2007

Filed:

Jul 16, 2004

Appl. No.:

10/892863

Inventors:

Thomas E. Dueber - Wilmington DE, US
Michael W. West - Wilmington DE, US
Brian C. Auman - Pickerington OH, US
Robert V. Kasowski - West Chester PA, US

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

B32B 9/04

US Classification:

428447, 525431

Abstract:

The low modulus polyimide adhesive compositions of the present invention contain a low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-retardant filler, and optionally an adhesion promoter. The adhesive can be applied upon (or incorporated into) flexible circuits using a relatively low lamination temperature, generally no higher than 200, 190, 180, 175, 170, 165, 160, 155, or 150 C. The adhesive is generally resistant to unwanted curl even in cases where the adhesive polyimide and the base film polyimide have a coefficient of linear thermal expansions (measured between 50 C. and 250 C. ) that differ by more than 10, 15, 20 25, or 30 ppm/ C.

US Patent:

20040058276, Mar 25, 2004

Filed:

Oct 15, 2002

Appl. No.:

10/271370

Inventors:

Thomas Dueber - Wilmington DE, US
Michael West - Wilmington DE, US

International Classification:

G03F007/032

US Classification:

430/280100, 430/284100, 430/285100, 430/905000, 430/270100

Abstract:

A flexible, aqueous processible, photoimagable coverlay compositions, having advantageous adhesion and release properties and resistance to (unwanted) haloing. The coverlay compositions of the present invention comprise an acrylic, low Tg, graft copolymer binder component, having an alkali resistant backbone-segment and a pendant arm segment comprising hydrophilic moieties. Optionally, the coverlay further comprises a thiophene-type adhesion promoter to further improve adhesion properties.

US Patent:

20060110678, May 25, 2006

Filed:

Nov 23, 2004

Appl. No.:

10/997701

Inventors:

Thomas Dueber - Wilmington DE, US
Michael West - Wilmington DE, US
Brian Auman - Pickerington OH, US

International Classification:

G03C 1/76

US Classification:

430270100

Abstract:

The invention relates to low-temperature curable photosensitive compositions containing a polyamic acid, which compositions are developable in aqueous alkaline solutions and are curable, at a temperature of at least 160 C. and up to 200 C., to low modulus polyimides suitable for use in electronic circuitry applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage.

US Patent:

20060110679, May 25, 2006

Filed:

Nov 10, 2005

Appl. No.:

11/271267

Inventors:

Thomas Dueber - Wilmington DE, US
Michael West - Wilmington DE, US
Brian Auman - Pickerington OH, US

International Classification:

G03C 1/76

US Classification:

430270100

Abstract:

The invention relates to low-temperature curable photosensitive compositions containing a polyamic acid, which compositions are developable in aqueous alkaline solutions and are curable, at a temperature of at least 160 C. and up to 200 C., to low modulus polyimides suitable for use in electronic circuitry applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage.

US Patent:

51459833, Sep 8, 1992

Filed:

May 3, 1991

Appl. No.:

7/695157

Inventors:

Michael West - Wilmington DE

Assignee:

E. I. Du Pont de Nemours and Company - Wilmington DE

International Classification:

C07D23360

US Classification:

548341

Abstract:

A process for the production of N-acylimidazoles by the reaction of a carboxylic anhydride with carbonyl-diimidazole is disclosed. The products are useful as chemical intermediates.