Michael A Beauchamp

US Patent:

20220209734, Jun 30, 2022

Filed:

Dec 30, 2020

Appl. No.:

17/137669

Inventors:

- Plano TX, US
Javier Haro Ramirez - Plano TX, US
Norman Dean Gray - Allen TX, US
Michael Joseph Beauchamp - McKinney TX, US

International Classification:

H03H 7/01

Abstract:

An electromagnetic interference filter (EIF) system/method configured to maximize filter performance associated with EIF interconnects is disclosed. The disclosed system eliminates the use of conventional printed circuit board (PCB) interconnects and associated electrical connection terminals by attaching EIF filter capacitors and other components directly to power supply bus bars using a mechanical design and plastic encapsulating cover (PEC) that reduces parasitic inductances between the various EIF components while maximizing series inductance between +BUS/+CON connections and −BUS/−CON connections respectively through a permeable inductor core (PIC). The system/method may be applied to a variety of EIF applications including those associated with electric vehicles and the like.