Ming Lang Li

US Patent:

6870246, Mar 22, 2005

Filed:

Aug 31, 2001

Appl. No.:

09/944545

Inventors:

Donald R. Mullen - Mountain View CA, US
Belgacem Haba - Cupertino CA, US
Ming Li - Fremont CA, US

Assignee:

Rambus Inc. - Los Altos CA

International Classification:

H01L023/02

US Classification:

257678, 257713

Abstract:

An integrated circuit cover incorporating a spring portion is described. The spring portion may include any structure that allows displacement between a plate portion of the integrated circuit cover and an attachment portion of the integrated circuit cover and that provides a substantially equalizing effect of pressure on the plate portion. The spring portion is preferably more flexible than the plate portion. The integrated circuit cover accommodates variations in the mounted height of integrated circuits over which the integrated circuit cover is installed The integrated circuit cover may be formed as a unitary structure or may be constructed as an assembly of multiple components.

US Patent:

7073952, Jul 11, 2006

Filed:

Jun 5, 2002

Appl. No.:

10/163405

Inventors:

Frank Xi Wu - Fremont CA, US
Jian Xu - Pleasanton CA, US
Ming Li - Pleasanton CA, US
Song Peng - Pleasanton CA, US

Assignee:

Avanex Corporation - Fremont CA

International Classification:

G02B 6/26
G02B 7/00

US Classification:

385 62, 385 90, 385 28, 359896, 24828831

Abstract:

An optical alignment device holds fiber collimators in place with extremely good mechanical and environmental stability. The device includes a ball with a hole traversing the ball, an upper clamping block with a first inner concave spherical surface and a lower clamping block with a second inner concave spherical surface. The hole includes a shape that can accommodate or contact an optical component whose alignment is to be controlled. The ball, together with the enclosed optical component is firmly held between the first and second inner concave surfaces of the clamping blocks, which are tightened against the ball with screws. When firmly clamped within the concave surfaces, the ball is prevented from accidental movement but can still rotate about any axis to align the optical component. Once alignment is achieved, the optical component and the ball are secured in place by epoxy, glue, solder or other suitable adhesive.

US Patent:

7218857, May 15, 2007

Filed:

Mar 28, 2003

Appl. No.:

10/402731

Inventors:

Ming Li - Los Altos CA, US

Assignee:

Avanex Corporation - Fremont CA

International Classification:

H04J 14/02

US Classification:

398 83

Abstract:

A re-configurable optical add/drop apparatus separates an optical input signal into a first signal having a plurality of channels and a second signal having a plurality of channels and includes a channel router with drop ports, a wavelength-selective channel attenuator with a controllable polarization modulator, and an optical coupler. The channel router routes the selected channels of the first signal to the drop ports. The wavelength-selective channel attenuator selectively blocks some of the channels of the second signal to produce a third signal. The optical coupler couples the third signal with a fourth signal having a plurality of add channels to produce an optical output signal.

US Patent:

7538424, May 26, 2009

Filed:

Jul 8, 2004

Appl. No.:

10/888907

Inventors:

Donald R. Mullen - Mountain View CA, US
Ming Li - Fremont CA, US

Assignee:

Rambus Inc. - Los Altos CA

International Classification:

H01L 23/34

US Classification:

257712, 257774

Abstract:

The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The semiconductor module includes multiple semiconductor devices. The semiconductor module is oriented substantially parallel to the circuit board near the first side, while the heat dissipator is disposed near the second side. The thermal via extends through the circuit board to thermally couple the semiconductor module to the heat dissipator, which may be a heat spreader, heat sink, cooling fan, or heat pipe.

US Patent:

7705445, Apr 27, 2010

Filed:

Feb 11, 2005

Appl. No.:

11/056535

Inventors:

Ming Li - Fremont CA, US
Sayeh Khalili - San Jose CA, US
Donald R. Mullen - Mountain View CA, US

Assignee:

Rambus Inc. - Los Altos CA

International Classification:

H01L 23/14

US Classification:

257700, 257774, 257E23067

Abstract:

The semiconductor package includes two electrical contacts and a semiconductor device coupled to opposing sides of a substrate. The substrate defines at least one via extending at least partially there through. The semiconductor device includes a semiconductor low-speed interface electrically coupled to one of the electrical contacts through the via, and a semiconductor high-speed interface electrically coupled to flexible tape. The flexible tape is also electrically coupled to the other one of the electrical contacts.

US Patent:

7846793, Dec 7, 2010

Filed:

Oct 3, 2007

Appl. No.:

11/866625

Inventors:

Christopher S. Olsen - Fremont CA, US
Sean Seutter - San Jose CA, US
Ming Li - Watervliet NY, US
Phillip Allan Kraus - San Jose CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H01L 21/336
H01L 21/3105
H01L 21/4757

US Classification:

438260, 438710, 438723, 438783

Abstract:

A device, such as a nonvolatile memory device, and methods for forming the device in an integrated process tool are provided. The method includes depositing a tunnel oxide layer on a substrate, exposing the tunnel oxide layer to a plasma so that the plasma alters a morphology of a surface and near surface of the tunnel oxide to form a plasma altered near surface. Nanocrystals are then deposited on the altered surface of the tunnel oxide.

US Patent:

8039952, Oct 18, 2011

Filed:

May 26, 2009

Appl. No.:

12/472340

Inventors:

Donald R. Mullen - Mountain View CA, US
Ming Li - Fremont CA, US

Assignee:

Rambus Inc. - Sunnyvale CA

International Classification:

H05K 7/20

US Classification:

257712, 257720, 257774

Abstract:

The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The semiconductor module includes multiple semiconductor devices. The semiconductor module is oriented substantially parallel to the circuit board near the first side, while the heat dissipator is disposed near the second side. The thermal via extends through the circuit board to thermally couple the semiconductor module to the heat dissipator, which may be a heat spreader, heat sink, cooling fan, or heat pipe.

US Patent:

8063481, Nov 22, 2011

Filed:

Feb 20, 2008

Appl. No.:

12/526234

Inventors:

Ming Li - Fremont CA, US

Assignee:

Rambus Inc. - Sunnyvale CA

International Classification:

H01L 21/00

US Classification:

257700, 257713, 257720, 257723, 257E23039, 257E23083

Abstract:

The semiconductor package includes a dielectric layer, a trace layer, a conductive layer, a die and an underfill layer. The dielectric layer has first side and an opposing dielectric layer second side. Multiple vias extend through the dielectric layer from the dielectric layer first side to the dielectric layer second side. Multiple solder balls are disposed at the dielectric layer second side. Each of the solder balls is electrically coupled to a different one of the vias. The die is electrically coupled to the solder balls. The conductive layer is disposed between the dielectric layer second side and the die. The conductive layer defines a window there through for allowing the solder balls to electrically couple to the vias without contacting the conductive layer, i. e. , no physical or electrical contact. The underfill layer is formed between the die and the conductive layer, while the trace layer is formed at the dielectric layer first side.