Ming Hai Li

US Patent:

59603119, Sep 28, 1999

Filed:

Aug 14, 1997

Appl. No.:

8/911291

Inventors:

Abha R. Singh - Carrollton TX
Artur P. Balasinski - Scottsdale AZ
Ming M. Li - Plano TX

Assignee:

STMicroelectronics, Inc. - Carrollton TX

International Classification:

H01L 21469

US Classification:

438623

Abstract:

A method of forming a thick interlevel dielectric layer containing sealed voids, formed in a controlled manner, over a substantially planar surface in semiconductor device structure, and the semiconductor structure formed according to such a method. The sealed voids are used to reduce interlevel capacitance. A plurality of metal signal lines are formed over a globally planarized insulator. A thick layer of first conformal interlevel dielectric is deposited over the metal signal lines and over the intermetal spacings formed between the metal signal lines. Because of the thickness, flow properties, and manner of deposition of the interlevel dielectric and the aspect ratio the intermetal spacings, voids are formed in the first conformal interlevel dielectric, in the intermetal spacings. This interlevel dielectric is then etched or polished back to the desired thickness, which exposes the voids in the wider intermetal spacings, but does not expose voids in the narrower intermetal spacings. An etchback may be chosen so that all voids are exposed.

US Patent:

58474641, Dec 8, 1998

Filed:

Sep 27, 1995

Appl. No.:

8/534669

Inventors:

Abha R. Singh - Carrollton TX
Artur P. Balasinski - Scottsdale AZ
Ming M. Li - Plano TX

Assignee:

SGS-Thomson Microelectronics, Inc. - Carrollton TX

International Classification:

H01L 2348
H01L 2352
H01L 2940

US Classification:

257752

Abstract:

A method of forming a thick interlevel dielectric layer containing sealed voids formed in a controlled manner, over a substantially planar surface in semiconductor device structure, and the semiconductor structure formed according to such a method. The sealed voids are used to reduce interlevel capacitance. A plurality of metal signal lines are formed over a globally planarized insulator. A thick layer of first conformal interlevel dielectric is deposited over the metal signal lines and over the intermetal spacings formed between the metal signal lines. Because of the thickness, flow properties, and manner of deposition of the interlevel dielectric and the aspect ratio the intermetal spacings, voids are formed in the first conformal interlevel dielectric, in the intermetal spacings. This interlevel dielectric is then etched or polished back to the desired thickness, which exposes the voids in the wider intermetal spacings, but does not expose voids in the narrower intermetal spacings. An etchback may be chosen so that all voids are exposed.

US Patent:

20180336994, Nov 22, 2018

Filed:

Nov 10, 2017

Appl. No.:

15/809750

Inventors:

- Dallas TX, US
Benjamin Michael Sutton - Dallas TX, US
Ming Li - Dallas TX, US

International Classification:

H01F 27/28
H01F 27/32
H01F 17/04
H01F 41/12
H01F 41/04
H01F 17/00
H01F 27/02
H01F 17/06

Abstract:

An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

US Patent:

20170347490, Nov 30, 2017

Filed:

May 24, 2016

Appl. No.:

15/162888

Inventors:

- Dallas TX, US
- Freising, DE
Ming Li - Plano TX, US
Yiqi Tang - Allen TX, US

International Classification:

H05K 7/20
H05K 1/02
H05K 13/00

Abstract:

A heat dissipating antenna comprised of a low-attenuating heat spreader bonded to a high frequency antenna or antenna array.An integrated circuit with a wireless integrated circuit chip, and a heat dissipating antenna coupled to the wireless integrated circuit chip. A method of forming a heat dissipating antenna.

US Patent:

20170294263, Oct 12, 2017

Filed:

Jun 27, 2017

Appl. No.:

15/634336

Inventors:

- Dallas TX, US
Benjamin Michael Sutton - Dallas TX, US
Ming Li - Dallas TX, US

International Classification:

H01F 27/28
H01F 41/12
H01F 17/06
H01F 27/32
H01F 41/04

Abstract:

An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

US Patent:

20160181003, Jun 23, 2016

Filed:

Dec 19, 2014

Appl. No.:

14/576904

Inventors:

- Dallas TX, US
Benjamin Michael Sutton - Dallas TX, US
Ming Li - Dallas TX, US

International Classification:

H01F 27/28
H01F 41/04
H01F 27/02

Abstract:

An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

US Patent:

20160181004, Jun 23, 2016

Filed:

Dec 19, 2014

Appl. No.:

14/576934

Inventors:

- Dallas TX, US
Benjamin Michael Sutton - Dallas TX, US
Ming Li - Dallas TX, US

International Classification:

H01F 27/28
H01F 41/12
H01F 41/04

Abstract:

An embodiment of coil assembly includes a laterally disposed ferrite ring having a central opening. A laterally disposed annular conductive member is positioned above the ferrite ring and has a plurality of spaced-apart circumferential segments. A plurality of bond wires are connected at opposite ends thereof to outer and inner portions of the plurality of spaced-apart circumferential segments. A layer of mold compound covers the ferrite ring and the bond wires.

US Patent:

20150251035, Sep 10, 2015

Filed:

Sep 25, 2013

Appl. No.:

14/430905

Inventors:

- Neuhausen am Rheinfall, CH
Ming Li - Mansfield TX, US

International Classification:

A62D 1/02
C08G 63/688

Abstract:

New high molecular weight fluoropolymers (fluoropolymer surfactants) are provided that are useful in compositions for use as fire extinguishing concentrates. The fluoropolymers contain C-Cperfluoroalkyl groups, and substantially lack perfluoroalkyl groups containing more than 6 fluorine-substituted carbon atoms.