Mohammed N Ali

US Patent:

6933628, Aug 23, 2005

Filed:

Jul 24, 2003

Appl. No.:

10/627317

Inventors:

Mohammed Ershad Ali - Sunnyvale CA, US

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H01H019/58
H04L001/12
H04L012/50

US Classification:

307112, 200 11 R, 361681, 361686, 370357

Abstract:

An embodiment in accordance with the invention recites a high speed channel selector switch. The high speed channel selector switch includes a first unit that has a plurality of contacts that are operable to electrically couple to a plurality of high speed data lines of a device under test. The first unit also has an additional contact operable to electrically couple to a signal line. The high speed channel selector switch further includes a second unit that is operable to selectively electrically couple one of the plurality of contacts of the first unit to the additional contact of the first unit. The second unit also electrically couples the remaining contacts of the first unit to respective termination impedances. Thus, one of the plurality of high speed data lines is coupled to the signal line via the second unit and the remaining high speed data lines are coupled to respective termination impedances.

US Patent:

7065113, Jun 20, 2006

Filed:

Apr 30, 2002

Appl. No.:

10/136928

Inventors:

Mohammed Ershad Ali - Sunnyvale CA, US
Edwin De Groot - Saratoga CA, US
Brian Elliot Lemoff - Union City CA, US
Lisa Anne Buckman - Pacifica CA, US

International Classification:

H01S 3/04
H01S 3/00
H01S 5/00

US Classification:

372 36, 372 43, 372 44

Abstract:

A driver IC and EML array are electrically coupled to one another via a flexible PCB. Thermal isolation between the driver IC and EML array is adjusted by varying a cross-section and length of electrically-conductive traces on the PCB.

US Patent:

7223924, May 29, 2007

Filed:

Sep 23, 2003

Appl. No.:

10/669982

Inventors:

Steven Rosenau - Mountain View CA, US
Mohammed Ershad Ali - Sunnyvale CA, US
Jonathan Simon - Castro Valley CA, US
Brian Lemoff - Union City CA, US
Lisa Anne Windover - San Francisco CA, US

Assignee:

Avago Technologies General IP (Singapore) Pte. Ltd. - Singapore

International Classification:

H01R 12/04
H05K 1/11

US Classification:

174260, 174262, 439 66, 439591

Abstract:

A flexible circuit having vias disposed to minimize discontinuity in a ground plane separating opposing transmission lines. The flex circuit comprises a first transmission line coupled to a first surface, a second transmission line coupled to a second opposing surface and a ground plane separating the first transmission line and the second transmission line. The flexible circuit also includes a first type of electrical connection pads disposed on the first surface, and electrically coupled to the first transmission line. The flexible circuit also includes a second type of electrical connection pads disposed on the second surface, and electrically coupled to the second transmission line wherein the second type of electrical connection pads have a higher areal density than the first type of electrical connection pads. The flexible circuit also includes vias disposed proximate the first type of electrical connection pads and extended through the ground plane to provide for electrically coupling the first transmission line and the second transmission line, such that the vias reduce discontinuity in the ground plane and aggregate discontinuity in the flex circuit.

US Patent:

7238263, Jul 3, 2007

Filed:

Sep 24, 2004

Appl. No.:

10/955338

Inventors:

Mohammed Ali - Walnut Creek CA, US
Chris Lisson - Walnut Creek CA, US

Assignee:

California Corrosion Concepts, Inc. - Walnut Creek CA

International Classification:

C23F 13/00

US Classification:

20419603, 20419605, 20419606, 20419607, 73 86, 324 712

Abstract:

A portable, handheld, automatic protection level interpreting cathodic protection meter for testing the level of protection being afforded to metallic structures protected by either sacrificial anode or impressed current cathodic protection systems, or both. The meter is suitable over a variety of environments including salt water, freshwater, and soil. The operator can select both the type of metal to be tested as well as the type of reference electrode that is being used. The meter automatically calibrates data interpretation of the level of protection based on the operator's selections and eliminates any voltage drop error existing between a reference electrode and the structure being protected.

US Patent:

7264697, Sep 4, 2007

Filed:

Sep 24, 2004

Appl. No.:

10/950200

Inventors:

Mohammed Ali - Walnut Creek CA, US
Chris Lisson - Walnut Creek CA, US

Assignee:

California Corrosion Concepts, Inc. - Walnut Creek CA

International Classification:

C23F 13/00

US Classification:

20419611, 20419606, 20419607, 20419621, 20419622, 20419623, 20419624, 20419625, 20419626, 20419619, 20419636

Abstract:

A sacrificial marine anode with a water proof encased current tester to alert an operator of proper connectivity, current status of the cathodic protection system for an associated marine structure, and status of current tester power supply is disclosed.

US Patent:

7508823, Mar 24, 2009

Filed:

Apr 30, 2004

Appl. No.:

10/837338

Inventors:

Mohammed Ershad Ali - Sunnyvale CA, US

Assignee:

Avago Technologies General IP (Singapore) Pte. Ltd. - Singapore

International Classification:

H04L 12/50
H04J 3/02
B23K 11/24

US Classification:

370357, 370537, 307112

Abstract:

A high-speed multiple channel and line selector switch allows the simultaneous selection of the two lines of a differential channel and permits the simultaneous selection of multiple channels by introduction of the appropriate high speed pad connectivity.

US Patent:

7675465, Mar 9, 2010

Filed:

May 22, 2007

Appl. No.:

11/752083

Inventors:

Chinh Huy Doan - Santa Clara CA, US
Mohammed Ershad Ali - San Jose CA, US

Assignee:

Sibeam, Inc. - Sunnyvale CA

International Classification:

H01Q 1/38

US Classification:

343700MS

Abstract:

An integrated circuit (IC) package is disclosed. The IC package includes a substrate having top, middle and bottom layers, an array of millimeter-wave antennas embedded on the top layer of the substrate and a monolithic microwave integrated circuit (MMIC) mounted on the bottom layer of the substrate. In one embodiment, the second level interconnect for surface-mounting on a printed circuit board (PCB) is provided on the bottom layer of the substrate.

US Patent:

20050012199, Jan 20, 2005

Filed:

Jul 18, 2003

Appl. No.:

10/623304

Inventors:

Steven Rosenau - Mountain View CA, US
Mohammed Ali - Sunnyvale CA, US
Brian Lemoff - Union City CA, US
Lisa Windover - San Francisco CA, US

International Classification:

H01L023/48
H01L023/52

US Classification:

257696000, 257688000, 257692000

Abstract:

A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.