Randall T. Kerth - San Jose CA Douglas J. Krajnovich - San Jose CA Murlidhar V. Kulkarni - San Jose CA Wing P. Leung - Arcadia CA Andrew C. Tam - Saratoga CA
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B23C 300
US Classification:
216 65
Abstract:
A method is provided for making a high definition, high aspect ratio amorphous carbon element, such as a slider, which carries one or more magnetic heads in a disk drive. A special gaseous environment is provided during laser etching which results in virtually no redeposition of the etched material. The result is a carbon element which has good edge definition for establishing desirable flying characteristics of a slider. In a preferred embodiment the laser etching, which is preferably implemented by an excimer laser, is performed in an gaseous environment of oxygen saturated with water vapor at a pressure above ambient. Significant improvements were also realized with nitrogen saturated with water vapor at a pressure above ambient and steam at ambient pressure. High aspect ratios were achieved, namely slope angles of 50. degree. to 60. degree.
Method For Reducing Oxygen Precipitation In Silicon Wafers
Patrick W. Chye - Mountain View CA Eric W. Hearn - Wappingers Falls NY Murlidhar V. Kulkarni - Fishkill NY Gary Markovits - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 21322 H01L 21324
US Classification:
148 15
Abstract:
The rate of oxygen precipitation in a semiconductor wafer during heat treatment is reduced by quickly inserting the wafer into a furnace which has been preheated to the heat treatment temperature. After performing the heat treatment, the wafer is slowly cooled to prevent warpage or cracking.