Search

Murlidhar V Kulkarni

from Salt Lake City, UT

Also known as:
  • Malati M Kulkarni
  • Malu Kulkarni
  • M Kulkarni
  • Muli Kulkarni
  • Mu Li Kulkarni
  • Murlidhar J Kulkarni
  • Murli Kulkarni
Phone and address:
7987 S Mountain Oaks Dr, Salt Lake City, UT 84121
(801)9479894

Murlidhar Kulkarni Phones & Addresses

  • 7987 S Mountain Oaks Dr, Salt Lake Cty, UT 84121 • (801)9479894
  • Salt Lake City, UT
  • San Francisco, CA
  • San Jose, CA
  • 7987 Mountain Oaks Dr, Salt Lake Cty, UT 84121 • (801)9109113

Work

  • Position:
    Building and Grounds Cleaning and Maintenance Occupations

Education

  • Degree:
    High school graduate or higher

Us Patents

  • Laser Machined Slider

    view source
  • US Patent:
    55447759, Aug 13, 1996
  • Filed:
    Dec 22, 1994
  • Appl. No.:
    8/363159
  • Inventors:
    Randall T. Kerth - San Jose CA
    Douglas J. Krajnovich - San Jose CA
    Murlidhar V. Kulkarni - San Jose CA
    Wing P. Leung - Arcadia CA
    Andrew C. Tam - Saratoga CA
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    B23C 300
  • US Classification:
    216 65
  • Abstract:
    A method is provided for making a high definition, high aspect ratio amorphous carbon element, such as a slider, which carries one or more magnetic heads in a disk drive. A special gaseous environment is provided during laser etching which results in virtually no redeposition of the etched material. The result is a carbon element which has good edge definition for establishing desirable flying characteristics of a slider. In a preferred embodiment the laser etching, which is preferably implemented by an excimer laser, is performed in an gaseous environment of oxygen saturated with water vapor at a pressure above ambient. Significant improvements were also realized with nitrogen saturated with water vapor at a pressure above ambient and steam at ambient pressure. High aspect ratios were achieved, namely slope angles of 50. degree. to 60. degree.
  • Method For Reducing Oxygen Precipitation In Silicon Wafers

    view source
  • US Patent:
    44328095, Feb 21, 1984
  • Filed:
    Mar 10, 1982
  • Appl. No.:
    6/364542
  • Inventors:
    Patrick W. Chye - Mountain View CA
    Eric W. Hearn - Wappingers Falls NY
    Murlidhar V. Kulkarni - Fishkill NY
    Gary Markovits - Poughkeepsie NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H01L 21322
    H01L 21324
  • US Classification:
    148 15
  • Abstract:
    The rate of oxygen precipitation in a semiconductor wafer during heat treatment is reduced by quickly inserting the wafer into a furnace which has been preheated to the heat treatment temperature. After performing the heat treatment, the wafer is slowly cooled to prevent warpage or cracking.

Resumes

Murlidhar Kulkarni Photo 1

Murlidhar Kulkarni

view source

Youtube

People's Health: Episode-33: A talk with Dr. ...

Session expert: Dr. Murlidhar M. Kulkarni Associate professor Departme...

  • Duration:
    18m 14s

... ? | Mandar Kulkarni | Think Books

  • Duration:
    40m 20s

Rang Nako Taku by Murlidhar Kulkarni, Dholak...

  • Duration:
    34s

Googleplus

Murlidhar Kulkarni Photo 2

Murlidhar Kulkarni

Murlidhar Kulkarni Photo 3

Murlidhar Kulkarni

Murlidhar Kulkarni Photo 4

Murlidhar Kulkarni

Work:
Mahanagar Telephone Nigam Limited - Sde
Education:
Private school

Facebook

Murlidhar Kulkarni Photo 5

Murlidhar Kulkarni

view source
Murlidhar Kulkarni Photo 6

Rajendra Murlidhar Kulkarni

view source

Get Report for Murlidhar V Kulkarni from Salt Lake City, UT
Control profile