Myung H Lee

US Patent:

7751332, Jul 6, 2010

Filed:

Oct 25, 2007

Appl. No.:

11/923777

Inventors:

Yong Liu - San Jose CA, US
Eun Il Seo - Hwaseong-si, KR
Jin Young Yang - Seoul, KR
Myung Jong Lee - New York NY, US
Xuhui Hu - New York NY, US

Assignee:

Samsung Electronics Co., Ltd. - Suwon-si
The Research Foundation of the City University of New York - New York NY

International Classification:

H04L 12/28

US Classification:

370238, 370251, 370254, 709241

Abstract:

A data routing method and system, the data routing method including: locating a destination node using a destination locating packet; establishing a preliminary route including anchor nodes based on a route where the destination locating packet is transmitted to the destination node; determining a link cost between neighbor nodes of each of the anchor nodes, and also between the anchor nodes and the neighbor nodes of each of the anchor nodes; generating minimum cost information with respect to a route consuming a minimum cost from the destination node to a source node using the link cost; and forming a data route from the destination node to the source node using the minimum cost information.

US Patent:

20160240457, Aug 18, 2016

Filed:

Feb 18, 2015

Appl. No.:

14/625020

Inventors:

- San Jose CA, US
Myung June Lee - Cupertino CA, US

International Classification:

H01L 23/48
H01L 21/768
H01L 21/56

Abstract:

An integrated circuit package may include a first integrated circuit die attached to a front surface of a second integrated circuit die. An intermediate layer made of a molding compound is formed to surround the second integrated circuit die in a “fan-out” arrangement while leaving a surface of the second integrated circuit die exposed. Accordingly, a group of via holes is then formed in the intermediate layer and filled with a conductive material. Such a configuration forms a dual-sided stacking structure. The stacking structure may also be applicable for package-on-package packages and fan-out wafer-level chip scale packages, in which the stacking structure is formed between two heterogeneous or homogeneous integrated circuit packages.

Address:

30448 Via Victoria, Rancho Palos Verdes, CA 90275

VIN:

2HNYD28398H534259

Make:

ACURA

Model:

MDX

Year:

2008