Myung Ho Park from Parkland, FL, age 79

Medicine Doctors

Dr. Myung C Park - MD (Doctor of Medicine)

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Specialties:

Urology

Certifications:

Urology, 1978

Languages:

English

Education:

Medical School
Wonju Branch Of Yonsei University College Of Medicine
Graduated: 1966
Medical School
Epis Hospital
Graduated: 1966
Medical School
Hamot Hospital
Graduated: 1966
Medical School
St Elizabeth Hospital
Graduated: 1966
Medical School
Millard Fillmore Hospital
Graduated: 1966

License Records

Myung San Park

License #:

2705087295 - Expired

Category:

Contractor

Issued Date:

Jul 26, 2004

Expiration Date:

Jul 31, 2010

Type:

Class A

Name / Title

Company / Classification

Phones & Addresses

Myung Ho Park
President, Director

Boca Flasher, Inc
Whol Electronic Parts/Equipment

552 NW 77 St, Boca Raton, FL 33487
(561)9895338

Myung Sook Park

PARK & CHUNG, LLC

Myung Park

YJP HOLDINGS LLC

465 NE Spanish Trl, Boca Raton, FL 33432

Myung Park
President

B O Hyun Sa Inc
Religious Organization

7110 SW 182 Way, Fort Lauderdale, FL 33331
(954)2526033

Myung Ho Park
Director

MUN SU HUMANITARIAN SOCIETY, INC
Religious Organization · Business Services at Non-Commercial Site

231 Salem St, Wakefield, MA 01880
Pompano Beach, FL 33067

Myung Ho Park
Director

Multimedia Research Laboratory, Inc

1701 Clint Moore Rd, Boca Raton, FL 33487

Myung Ho Park
President, Director

Alta Research Corporation

1701 Clint Moore Rd, Boca Raton, FL 33487

Myung Ho Park
Director

Nexwav Technology, Inc

552 NW 77 St, Boca Raton, FL 33487

Us Patents

Direct Heat Sink Technology For Leds And Driving Circuits
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US Patent:

20130314920, Nov 28, 2013
Filed:

May 25, 2012
Appl. No.:

13/481147
Inventors:

Myung Ho Park - Boca Raton FL, US
Luis Rosado - Miramar FL, US
International Classification:

H05K 7/20
F21V 29/00
US Classification:

36224902, 174252
Abstract:

Thermally radiating heat sinks are soldered directly beneath individual LEDs and other heat generating electronic components on the opposite side of an FR circuit board and thermally coupled to the heat source through multiple micro-vias. The micro-vias are filled with solder in order to increase the thermal transmission of heat energy through the circuit board to the heat sinks The circuit board thickness is minimized to further reduce the thermal resistance of the transmission path. The method employed facilitates the heat transfer away from high-powered LEDs and other heat generating circuitry without spreading the heat energy to thermally sensitive electronic circuits and without the need for expensive substrates commonly employed to dissipate heat in electronic circuits. The method is adapted for LED lighting circuits and preferably to industry standard bulb sizes such as MR11, MR16, R20, PAR30, PAR38, and PAR56.