Nancy L Gilbert

US Patent:

7913644, Mar 29, 2011

Filed:

Sep 30, 2006

Appl. No.:

11/537643

Inventors:

Ron Rulkens - Milpitas CA, US
Robert D. Tas - Aromas CA, US
Shashank Ravindra Kulkarni - Santa Clara CA, US
Artur Kolics - Dublin CA, US
Nancy E. Gilbert - Berkeley CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B05C 3/02

US Classification:

118407, 118422, 118429, 2601211

Abstract:

An electroless deposition system includes a deposition solution, and saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about twenty thousand parts per million.

US Patent:

20110135824, Jun 9, 2011

Filed:

Feb 16, 2011

Appl. No.:

13/028607

Inventors:

Ron Rulkens - Milpitas CA, US
Robert D. Tas - Aromas CA, US
Shashank Ravindra Kulkarni - Santa Clara CA, US
Artur Kolics - Dublin CA, US
Nancy E. Gilbert - Berkeley CA, US

International Classification:

B05D 1/18
B05D 5/00

US Classification:

427256, 4274431

Abstract:

An electroless deposition method includes providing a deposition solution, and saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about twenty thousand parts per million, and replenishing deionized water in the deposition solution.

US Patent:

7845308, Dec 7, 2010

Filed:

Sep 28, 2006

Appl. No.:

11/536429

Inventors:

Jason Corneille - Scotts Valley CA, US
Nancy E. Gilbert - Berkeley CA, US
Robert D. Tas - Aromas CA, US
Steven Flanders - San Jose CA, US
Timothy J. Franklin - Campbell CA, US
Jason R. Wright - Sunnyvale CA, US
Stephen C. Jones - Tracy CA, US
Joe Laia - Morgan Hill CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B05C 11/00
B05C 3/00

US Classification:

118667, 118697, 118429

Abstract:

Systems having an in-line microwave heater to heat fluids for processing a substrate are provided. An embodiment of a system includes a microelectronic processing chamber, a reservoir for storing a fluid used to process wafers within the chamber, a supply line for transporting the fluid to the chamber, and a microwave heater arranged along the supply line. The system includes processor executable program instructions for operating the microwave heater at parameters configured to heat fluid within the supply line to a temperature greater than a fluid temperature within the reservoir, such as approximately 20 C. greater than the reservoir fluid temperature. It is noted that the inclusion of an in-line microwave heater is not limited to microelectronic fabrication systems, but may be used for any system in which heated fluids are used for processing a substrate, such as but not limited to electroplating or electroless plating systems.