George R. Allardyce - Burbage, GB Gary Hamm - Billerica MA, US Narsmoul Karaya - Dorchester MA, US
Assignee:
Rohm and Haas Electronic Material LLC - Marlborough MA
International Classification:
C25D 5/54
US Classification:
205211, 205210
Abstract:
Copper electroplating methods provide low internal stress copper deposits. Concentrations of accelerators in the copper electroplating bath vary as a function of the plating current density and the low internal stress copper deposit is observed as a matt copper deposit.