Nicolaie A Moldovan

US Patent:

7775087, Aug 17, 2010

Filed:

Sep 5, 2006

Appl. No.:

11/516039

Inventors:

Horacio D. Espinosa - Winnetka IL, US
Nicolaie A. Moldovan - Glenview IL, US

Assignee:

Northwestern University - Evanston IL

International Classification:

G01Q 60/24

US Classification:

73105, 250306, 850 40

Abstract:

A method of forming a microchannel as well as a thin film structure including same is made by forming a first thin film on a side of a substrate, forming a fugitive second thin film on the first thin film such that the second thin film defines a precursor of the elongated microchannel and a plurality of extensions connected to and extending transversely relative to the precursor along a length thereof A third thin film is formed on the first thin film and the fugitive second thin film such that the second thin film resides between the first thin film and the third thin film. A respective access site is formed in a region of the third thin film residing on a respective extension and penetrating to the fugitive second thin film. The fugitive second thin film forming the precursor is selectively removed from between the first thin film and the third thin film using an etching medium introduced through the access sites, thereby forming the microchannel between the first thin film and the third thin film. The method preferably further includes forming a sealing layer on the third thin film in a manner to close off open access sites remaining after selective removal of the second thin film.

US Patent:

7997123, Aug 16, 2011

Filed:

Jun 19, 2007

Appl. No.:

11/820328

Inventors:

Horacio D. Espinosa - Winnetka IL, US
Nicolaie A. Moldovan - Chicago IL, US
Keun-Ho Kim - Evanston IL, US

Assignee:

Northwestern University - Evanston IL

International Classification:

B01L 3/02
G01Q 60/54

US Classification:

73105, 216 2, 850 40, 850 57, 850 60, 850 62, 850 63

Abstract:

A dispensing device has a cantilever comprising a plurality of thin films arranged relative to one another to define a microchannel in the cantilever and to define at least portions of a dispensing microtip proximate an end of the cantilever and communicated to the microchannel to receive material therefrom. The microchannel is communicated to a reservoir that supplies material to the microchannel. One or more reservoir-fed cantilevers may be formed on a semiconductor chip substrate. A sealing layer preferably is disposed on one of the first and second thin films and overlies outermost edges of the first and second thin films to seal the outermost edges against material leakage. Each cantilever includes an actuator, such as for example a piezoelectric actuator, to impart bending motion thereto. The microtip includes a pointed pyramidal or conical shaped microtip body and an annular shell spaced about the pointed microtip body to define a material-dispensing annulus thereabout. The working microtip may be used to dispense material onto a substrate, to probe a surface in scanning probe microscopy, to apply an electrical stimulus or record an electrical response on a surface in the presence of a local environment created around the tip by the material dispensed from the tip or to achieve other functions.

US Patent:

8197701, Jun 12, 2012

Filed:

Jul 11, 2008

Appl. No.:

12/172109

Inventors:

John A. Carlisle - Plainfield IL, US
Nicolaie Moldovan - Plainfield IL, US

Assignee:

Advanced Diamond Technologies, Inc. - Romeoville IL

International Classification:

B44C 1/22
C25F 3/00

US Classification:

216 11, 216 2, 216 41, 216 58, 216 83

Abstract:

Diamond SPM and AFM probes which are durable, particularly for scanning hard surfaces such as diamond surfaces. Interlayers and seeding can be used to improve diamond deposition, and the diamond can be ultrananocrystalline diamond (UNCD). Tip sharpening improves resolution.

US Patent:

8347696, Jan 8, 2013

Filed:

Jul 1, 2010

Appl. No.:

12/803664

Inventors:

Horacio D. Espinosa - Winnetka IL, US
Nicolaie A. Moldovan - Glenview IL, US

Assignee:

Northwestern University - Evanston IL

International Classification:

B01L 3/02
G01Q 60/54

US Classification:

73105, 216 2, 850 40

Abstract:

A method of forming a microchannel as well as a thin film structure including same is made by forming a first thin film on a side of a substrate, forming a fugitive second thin film on the first thin film such that the second thin film defines a precursor of the elongated microchannel and a plurality of extensions connected to and extending transversely relative to the precursor along a length thereof A third thin film is formed on the first thin film and the fugitive second thin film such that the second thin film resides between the first thin film and the third thin film. A respective access site is formed in a region of the third thin film residing on a respective extension and penetrating to the fugitive second thin film. The fugitive second thin film forming the precursor is selectively removed from between the first thin film and the third thin film using an etching medium introduced through the access sites, thereby forming the microchannel between the first thin film and the third thin film. The method preferably further includes forming a sealing layer on the third thin film in a manner to close off open access sites remaining after selective removal of the second thin film.

US Patent:

20070151989, Jul 5, 2007

Filed:

Mar 16, 2004

Appl. No.:

10/801928

Inventors:

Horacio Espinosa - Winnetka IL, US
Nicolaie Moldovan - Chicago IL, US
Keun-Ho Kim - Evanston IL, US

International Classification:

B81B 1/00

US Classification:

222462000

Abstract:

A dispensing device has a cantilever comprising a plurality of thin films arranged relative to one another to define a microchannel in the cantilever and to define at least portions of a dispensing microtip proximate an end of the cantilever and communicated to the microchannel to receive material therefrom. The microchannel is communicated to a reservoir that supplies material to the microchannel. One or more reservoir-fed cantilevers may be formed on a semiconductor chip substrate. A sealing layer preferably is disposed on one of the first and second thin films and overlies outermost edges of the first and second thin films to seal the outermost edges against material leakage. Each cantilever includes an actuator, such as for example a piezoelectric actuator, to impart bending motion thereto. The microtip includes a pointed pyramidal or conical shaped microtip body and an annular shell spaced about the pointed microtip body to define a material-dispensing annulus thereabout. The working microtip may be used to dispense material onto a substrate, to probe a surface in scanning probe microscopy, to apply an electrical stimulus or record an electrical response on a surface in the presence of a local environment created around the tip by the material dispensed from the tip or to achieve other functions.

US Patent:

20110230127, Sep 22, 2011

Filed:

Jun 10, 2009

Appl. No.:

12/997579

Inventors:

Nicolaie Moldovan - Plainfield IL, US
John Carlisle - Plaifield IL, US

International Classification:

B24B 41/00
B24D 3/00
B32B 9/00

US Classification:

451540, 51297, 51307, 51295, 428172

Abstract:

The present invention describes a microfabricated or nanofabricated structured diamond abrasive with a high surface density array of geometrical protrusions of pyramidal, truncated pyramidal or other shape, of designed shapes, sizes and placements, which provides for improved conditioning of CMP polishing pads, or other abrasive roles. Three methods of fabricating the structured diamond abrasive are described: molding of diamond into an array of grooves of various shapes and sizes etched into Si or another substrate material, with subsequent transferal onto another substrate and removal of the Si; etching of an array of geometrical protrusions into a thick diamond layer, and depositing a thick diamond layer over a substrate pre-patterned (or pre-structured) with an array of geometrical protrusions of designed sizes, shapes and placements on the surface.

US Patent:

20120027947, Feb 2, 2012

Filed:

Jul 26, 2011

Appl. No.:

13/136246

Inventors:

Horacio D. Espinosa - Winnetka IL, US
Nicolaie A. Moldovan - Chicago IL, US
Keun-Ho Kim - Evanston IL, US

International Classification:

B05D 5/00
B05D 3/00
C23C 14/48
G01R 1/02
C23C 14/04
B28B 11/08
G01Q 10/00
B05D 1/36
B05D 3/14

US Classification:

427526, 427258, 427270, 427256, 427457, 264232, 850 1, 324149

Abstract:

A dispensing device has a cantilever comprising a plurality of thin films arranged relative to one another to define a microchannel in the cantilever and to define at least portions of a dispensing microtip proximate an end of the cantilever and communicated to the microchannel to receive material therefrom. The microchannel is communicated to a reservoir that supplies material to the microchannel. One or more reservoir-fed cantilevers may be formed on a semiconductor chip substrate. A sealing layer preferably is disposed on one of the first and second thin films and overlies outermost edges of the first and second thin films to seal the outermost edges against material leakage. Each cantilever includes an actuator, such as for example a piezoelectric actuator, to impart bending motion thereto. The microtip includes a pointed pyramidal or conical shaped microtip body and an annular shell spaced about the pointed microtip body to define a material-dispensing annulus thereabout. The working microtip may be used to dispense material onto a substrate, to probe a surface in scanning probe microscopy, to apply an electrical stimulus or record an electrical response on a surface in the presence of a local environment created around the tip by the material dispensed from the tip or to achieve other functions.

US Patent:

20120288698, Nov 15, 2012

Filed:

Mar 19, 2012

Appl. No.:

13/424180

Inventors:

Nicolaie A. MOLDOVAN - Plainfield IL, US
John Arthur Carlisle - Plainfield IL, US
Hongjun Zeng - Naperville IL, US

Assignee:

Advanced Diamond Technology, Inc - Romeoville IL

International Classification:

H01L 23/373
H01L 21/50
B32B 33/00
C25D 1/00
B32B 7/12
B32B 9/04

US Classification:

428216, 428457, 428141, 428212, 205 67, 438122, 361709, 257E21499

Abstract:

A method of fabrication, a device structure and a submount comprising high thermal conductivity (HTC) diamond on a HTC metal substrate, for thermal dissipation, are disclosed. The surface roughness of the diamond layer is controlled by depositing diamond on a sacrificial substrate, such as a polished silicon wafer, having a specific surface roughness. Following deposition of the diamond layer, an adhesion layer, e.g. comprising a refractory metal, such as tantalum, and at least one layer of HTC metal is provided. The HTC metal substrate is preferably copper or silver, and may be provided by electroforming metal onto a thin sputtered base layer, and optionally bonding another metal layer. The electrically non-conductive diamond layer has a smooth exposed surface, preferably ≦10 nm RMS, suitable for patterning of contact metallization and/or bonding to a semiconductor device. Methods are also disclosed for patterning the diamond on metal substrate to facilitate dicing.