Pamela S Foster

US Patent:

58543023, Dec 29, 1998

Filed:

Apr 14, 1994

Appl. No.:

8/224203

Inventors:

Pamela S. Foster - Midland MI
Ernest L. Ecker - Midland MI
Edward W. Rutter - Midland MI
Eric S. Moyer - Midland MI

Assignee:

The Dow Chemical Company - Midland MI

International Classification:

C08F 246
C08F 1008
C08G 7720

US Classification:

522172

Abstract:

A process for forming a partially polymerized DVS resin comprising heating DVS monomer (1,3-bis(2-bicyclo�4. 2. 0!octa-1,3,5-trien-3-ylethenyl)-1,1,3,3-tetramethyl disiloxane) in a solvent at a concentration of DVS monomer in the solvent such that: (a) the DVS resin, when applied and polymerized in a thin layer on a solid substrate does not craze; and (b) the DVS resin, is rendered photocurable by the addition of at least one photosensitive agent in an amount sufficient to convert the mixture to an organic-insoluble solid upon exposing the mixture to photon radiation and the film retention upon development with a solvent is at least 50 percent. The DVS resin may be used as an interlayer dielectric to fabricate thin film multichip modules.

US Patent:

58828362, Mar 16, 1999

Filed:

Jun 5, 1995

Appl. No.:

8/465664

Inventors:

Pamela S. Foster - Midland MI
Ernest L. Ecker - Midland MI
Edward W. Rutter - Midland MI
Eric S. Moyer - Midland MI

Assignee:

The Dow Chemical Company - Midland MI

International Classification:

G03C 152
C08C 248

US Classification:

430194

Abstract:

A photocurable formulation containing a partially polymerized DVS resin formed by heating DVS monomer (1,3-bis(2-bicyclo�4. 2. 0!octa-1,3,5-trien-3-ylethenyl)-1,1,3,3-tetramethyl disiloxane) in a solvent at an initial concentration of DVS monomer in the solvent of from about 12 to about 32 weight percent. This photocurable formulation may be used as an interlayer dielectric to fabricate thin film multichip modules.