Pamela L Patterson

US Patent:

7647688, Jan 19, 2010

Filed:

Aug 11, 2008

Appl. No.:

12/189617

Inventors:

David T. Chang - Calabasas CA, US
Randall L. Kubena - Oak Park CA, US
Frederic P. Stratton - Beverly Hills CA, US
Pamela R. Patterson - Los Angeles CA, US

Assignee:

HRL Laboratories, LLC - Malibu CA

International Classification:

H04R 31/00

US Classification:

29594, 29 2535, 296091, 181171, 181172, 310321, 310328, 310330, 310331, 310332, 381396, 381398

Abstract:

A method for fabricating a low frequency quartz resonator includes metalizing a top-side of a quartz wafer with a metal etch stop, depositing a first metal layer over the metal etch stop, patterning the first metal layer to form a top electrode, bonding the quartz wafer to a silicon handle, thinning the quartz wafer to a desired thickness, depositing on a bottom-side of the quartz wafer a hard etch mask, etching the quartz wafer to form a quartz area for the resonator and to form a via through the quartz wafer, removing the hard etch mask without removing the metal etch stop, forming on the bottom side of the quartz wafer a bottom electrode for the low frequency quartz resonator, depositing metal for a substrate bond pad onto a host substrate wafer, bonding the quartz resonator to the substrate bond pad, and removing the silicon handle.

US Patent:

7802356, Sep 28, 2010

Filed:

Feb 21, 2008

Appl. No.:

12/034852

Inventors:

David T. Chang - Calabasas CA, US
Randall L. Kubena - Oak Park CA, US
Pamela R. Patterson - Los Angeles CA, US

Assignee:

HRL Laboratories, LLC - Malibu CA

International Classification:

H04R 31/00

US Classification:

29594, 29 2535, 29 2542, 296091, 310321, 381396

Abstract:

A method for manufacturing a resonator is presented in the present application. The method includes providing a handle substrate, providing a host substrate, providing a quartz substrate comprising a first surface opposite a second surface, applying interposer film to the first surface of the quartz substrate, bonding the quartz substrate to the handle substrate wherein the interposer film is disposed between the quartz substrate and the handle substrate, thinning the second surface of the quartz substrate, removing a portion of the bonded quartz substrate to expose a portion of the interposer film, bonding the quartz substrate to the host substrate, and removing the handle substrate and the interposer film, thereby releasing the quartz substrate.

US Patent:

7851971, Dec 14, 2010

Filed:

Oct 12, 2009

Appl. No.:

12/577420

Inventors:

David T. Chang - Calabasas CA, US
Randall L. Kubena - Oak Park CA, US
Frederic P. Stratton - Beverly Hills CA, US
Pamela R. Patterson - Los Angeles CA, US

Assignee:

HRL Laboratories, LLC - Malibu CA

International Classification:

H01L 41/08

US Classification:

310320, 310321, 310322, 310324

Abstract:

A method for fabricating a low frequency quartz resonator includes metalizing a top-side of a quartz wafer with a metal etch stop, depositing a first metal layer over the metal etch stop, patterning the first metal layer to form a top electrode, bonding the quartz wafer to a silicon handle, thinning the quartz wafer to a desired thickness, depositing on a bottom-side of the quartz wafer a hard etch mask, etching the quartz wafer to form a quartz area for the resonator and to form a via through the quartz wafer, removing the hard etch mask without removing the metal etch stop, forming on the bottom side of the quartz wafer a bottom electrode for the low frequency quartz resonator, depositing metal for a substrate bond pad onto a host substrate wafer, bonding the quartz resonator to the substrate bond pad, and removing the silicon handle.

US Patent:

8503161, Aug 6, 2013

Filed:

Mar 23, 2011

Appl. No.:

13/070467

Inventors:

David T. Chang - Calabasas CA, US
Pamela R. Patterson - Los Angeles CA, US
Ping Liu - Irvine CA, US

Assignee:

HRL Laboratories, LLC - Malibu CA

International Classification:

H01G 9/00
H01G 9/08

US Classification:

361502, 361517, 361518, 361519, 361535, 361537, 977948

Abstract:

This invention provides a micro-supercapacitor with high energy density and high power density. In some variations, carbon nanostructures, such as carbon nanotubes, coated with a metal oxide, such as ruthenium oxide, are grown in a supercapacitor cavity that contains no separator. A lid is bonded to the cavity using a bonding process to form a hermetic seal. These micro-supercapacitors may be fabricated from silicon-on-insulator wafers according to the disclosed methods. An exemplary micro-supercapacitor is cubic with a length of about 50-100 μm. The absence of a separator translates to higher energy storage volume and less wasted space within the supercapacitor cell. The energy density of the micro-supercapacitor may exceed 150 J/cmand the peak output power density may be in the range of about 2-20 W/cm, in various embodiments.

US Patent:

20200088845, Mar 19, 2020

Filed:

Aug 29, 2019

Appl. No.:

16/555367

Inventors:

- Detroit MI, US
Oleg Efimov - Thousand Oaks CA, US
Michael Mulqueen - Malibu CA, US
Keyvan Sayyah - Santa Monica CA, US
Pamela R. Patterson - Los Angeles CA, US
Raymond Sarkissian - Studio City CA, US
James H. Schaffner - Chatsworth CA, US
David Hammon - Simi Valley CA, US
Biqin Huang - Torrance CA, US

International Classification:

G01S 7/481
G01S 7/491
G01S 17/32

Abstract:

A Lidar system, photonic chip and method of detecting an object is disclosed. The Lidar system includes the photonic chip. The photonic chip includes a laser and a local oscillator waveguide. The laser is integrated into the photonic chip and generates a leakage energy at a back facet of the laser for use as a local oscillator beam for the photonic chip. The local oscillator waveguide receives the leakage energy as the local oscillator beam. The laser further generates a transmitted light beam through a front facet of the photonic chip, combining the leakage energy with a reflection of the transmitted light beam form an object, and detects a combination of the reflected light beam and the leakage energy to determine a parameter of the object.

US Patent:

20200088884, Mar 19, 2020

Filed:

Aug 28, 2019

Appl. No.:

16/554090

Inventors:

- Detroit MI, US
Oleg Efimov - Thousand Oaks CA, US
Biqin Huang - Torrance CA, US
Raymond Sarkissian - Studio City CA, US
James H. Schaffner - Chatsworth CA, US
David Hammon - Simi Valley CA, US
Richard Kremer - Calabasas CA, US
Timothy J. Talty - Beverly Hills MI, US
Michael Mulqueen - Malibu CA, US
Pamela R. Patterson - Los Angeles CA, US

International Classification:

G01S 17/93
G01S 7/48
G01S 7/481
G01S 17/32

Abstract:

A vehicle, Lidar system and method of detecting an object is disclosed. The Lidar system includes a photonic chip, and a laser integrated into the photonic chip. The laser has a front facet located at a first aperture of the photonic chip to direct a transmitted light beam into free space. A reflected light beam that is a reflection of the transmitted light beam is received at the photonic chip and a parameter of the object is determined from a comparison of the transmitted light beam and the reflected light beam. A navigation system operates the vehicle with respect to the object based on a parameter of the object.

US Patent:

20190018112, Jan 17, 2019

Filed:

Jun 26, 2018

Appl. No.:

16/018730

Inventors:

- Detroit MI, US
Oleg Efimov - Thousand Oaks CA, US
Pamela Patterson - Los Angeles CA, US
Raymond Sarkissian - Studio City CA, US
James H. Schaffner - Chatsworth CA, US
Biqin Huang - Torrance CA, US
David Hammon - Simi Valley CA, US

International Classification:

G01S 7/481
H01L 31/16
H01L 31/0232
H01L 23/544
G01S 7/491
G01S 17/93

Abstract:

A chip-scale coherent lidar system includes a photonic chip that includes a light source, a transmit beam coupler to provide an output signal, and a receive beam coupler to receive a received signal based on a reflection of the output signal by a target. The system also includes a transmit beam steering device to transmit the output signal out of the system, and a receive beam steering device to obtain the received signal into the system. A transmit beam curved mirror reflects the output signal from the transmit beam coupler to the transmit beam steering device. A receive beam curved mirror reflects the received signal from the receive beam steering device to the receive beam coupler. The transmit beam curved mirror and the receive beam curved mirror are formed in a substrate that is heterogeneously integrated with the photonic chip.

US Patent:

20190018113, Jan 17, 2019

Filed:

Jun 26, 2018

Appl. No.:

16/018831

Inventors:

- Detroit MI, US
Oleg Efimov - Thousand Oaks CA, US
Pamela R. Patterson - Los Angeles CA, US
Raymond Sarkissian - Studio City CA, US
James H. Schaffner - Chatsworth CA, US
Biqin Huang - Torrance CA, US
David Hammon - Simi Valley CA, US

International Classification:

G01S 7/481
B81B 7/02
H01S 5/125
G01S 17/02
G02B 27/30

Abstract:

A LIDAR system, LIDAR chip and method of manufacturing a LIDAR chip. The LIDAR system includes a photonic chip configured to transmit a transmitted light beam and to receive a reflected light beam, a scanner for directing the transmitted light beam towards a direction in space and receiving the reflected light beam from the selected direction, and a fiber-based optical coupler. The photonic chip and the scanner are placed on a semiconductor integrated platform (SIP). The fiber-based optical coupler is placed on top of the photonic chip to optically couple to the photonic chip for directing the a transmitted light beam from the photonic chip to the scanner and for directing a reflected light beam from the scanner to the photonic chip.