Pamela L Patterson

US Patent:

7292381, Nov 6, 2007

Filed:

Sep 8, 2005

Appl. No.:

11/223872

Inventors:

Pamela Patterson - Los Angeles CA, US
Andy Hunter - Woodland Hills CA, US
Angela Shum - Arcadia CA, US
Peter David Brewer - Westlake Village CA, US

Assignee:

HRL Laboratories, LLC - Malibu CA

International Classification:

G02F 1/03
H01L 23/34

US Classification:

359248, 257723

Abstract:

Described is a method for conforming electronics to arbitrary shapes. The method comprises acts of forming a device structure to have a growth substrate, an etch stop layer affixed with the growth substrate, and a micro-electronic array. The micro-electronic array comprises a plurality of components atop the etch stop layer. The micro-electronic array is thereafter embedded into a shrinkable layer. The shrinkable layer is then mounted onto a handle wafer that includes a layer of adhering film with the shrinkable layer being pressed into the layer of adhering film. The growth substrate and the etch stop layer are thereafter removed. The adhering film is then dissolved to demount the micro-electronic array and shrinkable layer. Finally, the shrinkable layer is shrunk to conform the micro-electronic array to a three-dimensional shape, with the growth orientation flipped such that metal interconnects may be made to both the top and bottom of the chip.

US Patent:

8332053, Dec 11, 2012

Filed:

Apr 28, 2009

Appl. No.:

12/431042

Inventors:

Pamela R. Patterson - Los Angeles CA, US
Kevin S. Holabird - Los Angeles CA, US
Christopher P. Henry - Thousand Oaks CA, US

Assignee:

HRL Laboratories, LLC - Malibu CA

International Classification:

A61N 1/00

US Classification:

607152, 600393

Abstract:

In one implementation, a method of fabrication of stretchable electronic skin is provided. The method may include receiving an elastic material net. An elastic conductor mesh is formed on the elastic material net. A device is electrically bonded to the elastic conductor mesh. The implementation may further include forming a mold comprising a net pattern on a substrate and creating the elastic material net by coating the mold with an elastic material precursor, and then removing the elastic net from the substrate with the elastic conductor thereon. In one embodiment, a stretchable electronic skin including a net structure having a non-conducting elastic material with an elastic conductor mesh formed on the non-conducting elastic material, and a device electrically connected to the elastic conductor mesh.

US Patent:

20200049801, Feb 13, 2020

Filed:

Aug 9, 2018

Appl. No.:

16/059473

Inventors:

- Detroit MI, US
Pamela R. Patterson - Los Angeles CA, US
Raymond Sarkissian - Studio City CA, US
Richard Kremer - Calabasas CA, US
Oleg Efimov - Thousand Oaks CA, US

International Classification:

G01S 7/481
G02B 26/08
G01S 17/32

Abstract:

A chip-scale LIDAR (light detection and ranging) system, optical package and LIDAR platform. The system includes a photonic chip, a laser associated with the photonic chip, an optical circulator, and a MEMS scanner. The laser, the optical circulator and the MEMS scanner are collinear. The photonic chip includes an edge coupler. The optical package includes a housing having an aperture, and a platform within the housing. The platform includes the laser, an optical circulator, and MEMS scanner.

US Patent:

20190052047, Feb 14, 2019

Filed:

Jun 26, 2018

Appl. No.:

16/018852

Inventors:

- Detroit MI, US
Pamela R. Patterson - Los Angeles CA, US
Biqin Huang - Torrance CA, US

International Classification:

H01S 5/028
H01S 5/022

Abstract:

A method of manufacturing a LIDAR chip and applying an anti-reflection (AR) coating to a coupling structure of the LIDAR chip. The coupling structure if formed on a wafer. A pocket is formed in the wafer adjacent the coupling structure. The AR material is deposited on top of the wafer and coupling structure. The AR material is etched to form the AR coating on the coupling structure.

US Patent:

20150378012, Dec 31, 2015

Filed:

Jun 27, 2014

Appl. No.:

14/317695

Inventors:

- Malibu CA, US
Pamela R. Patterson - Los Angeles CA, US
Oleg M. Efimov - Thousand Oaks CA, US

International Classification:

G01S 7/481
G01S 17/02
H01S 5/12
H01S 5/026
H01S 5/02

Abstract:

A chip-scale scanning lidar includes a two dimensional (2D) scanning micromirror for a transmit beam and a 2D scanning micromirror for a receive beam, a laser diode and a photodetector, a first waveguide and first grating outcoupler coupled to a front facet of the laser diode, a second waveguide and a second grating outcoupler coupled to a rear facet of the laser diode on a substrate. A first fixed micromirror, a second micromirror, a third micromirror, and a focusing component are in a dielectric layer bonded to the substrate over the laser diode and photodetector. The photodetector is optically coupled to the second fixed micromirror and the third fixed micromirror for coherent detection.