Majid M. Hashemi - Tempe AZ Saied N. Tehrani - Scottsdale AZ Patricia A. Norton - Mesa AZ
Assignee:
Motorola - Schaumburg IL
International Classification:
H01L 21265
US Classification:
437 39
Abstract:
A method of fabricating a self-aligned FET having a semi-insulating substrate of GaAs or InP with a conductive channel formed either by doping the surface or an epitaxially grown channel by molecular beam epitaxy or metalorganic vapor phase epitaxy in the substrate adjacent the surface. Forming a high temperature stable LaB. sub. 6 /TiWN "T-shaped" Schottky gate contact on the substrate surface, which is used for source and drain ohmic region implants into the substrate adjacent to the surface and self-aligned to the "T-shaped" gate, with source and drain ohmic contacts also self-aligned with respect to the gate.
Christine Thero - Scottsdale AZ Patricia A. Norton - Mesa AZ
Assignee:
Motorola - Schaumburg IL
International Classification:
H01L 2100
US Classification:
1566431
Abstract:
A mask (12) is applied to a silicon carbide substrate (11) in order to etch the substrate (11). The material used for the mask (12) has a Mohs hardness factor greater than 4 in order to prevent sputtering material from the mask (12) onto the substrate (11). An oxygen and sulfur hexafluoride plasma is utilized to perform the etch.
Method For Protecting Extraction Electrode During Processing Of Spindt-Tip Field Emitters
Sung P. Pack - Tempe AZ Patricia A. Norton - Mesa AZ Robert F. Woodburn - Mesa AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01J 902
US Classification:
445 50
Abstract:
A method for protecting extraction electrodes (140) during processing of Spindt-tip field emitters (150, 155) includes the steps of: (i) depositing a parting layer (170) on the extraction electrodes (140) and in an interspace region (145) defined by the extraction electrodes (140), (ii) sharpening the Spindt-tip field emitters (150), (iii) depositing a layer (180) of emission-enhancing material on the sharpened field emitters (155) and on the parting layer (170), and (iv) removing the parting layer (170), thereby lifting off the emission-enhancing material from the extraction electrodes (140) and from the interspace region (145), but not from the sharpened field emitters (155).