Patrick D Crowley

US Patent:

20220271419, Aug 25, 2022

Filed:

Sep 13, 2021

Appl. No.:

17/447555

Inventors:

- Cupertino CA, US
Junlin Mu - Fremont CA, US
Sameer Pandya - Sunnyvale CA, US
Patrick J. Crowley - San Jose CA, US
Antonio F. Herrera - Palo Alto CA, US
James G. Horiuchi - Fresno CA, US
Sherry Tang - Santa Clara CA, US
Mario Martinis - Cupertino CA, US

International Classification:

H01Q 1/27
H01Q 1/24
H01R 12/82
H01R 12/77
H01M 50/284
H01M 10/0525
H01M 10/42
H01M 50/247

Abstract:

A portable or wearable electronic device can include a device housing defining an internal volume, and an electronic component disposed in the internal volume. The electronic component can be an input component and can have a component housing. The electronic device can also include an antenna feed assembly disposed in the internal volume. The antenna feed assembly can include a conductive grounding component electrically connected to the component housing and the device housing, and an antenna feed component electrically connected to the grounding component and disposed adjacent to the component housing. The conductive grounding component can surround a first major surface and a second major surface of the component housing.

US Patent:

20230084538, Mar 16, 2023

Filed:

Dec 7, 2021

Appl. No.:

17/544262

Inventors:

- Cupertino CA, US
Annie Manuja - Sunnyvale CA, US
Christopher D. Guichet - Mountain View CA, US
Erik G. de Jong - San Francisco CA, US
Jorge L. Rivera Espinoza - San Jose CA, US
Patrick J. Crowley - San Jose CA, US
Steven C. Roach - Martinez CA, US
Venkatesh Rajendran - San Jose CA, US
William C. Lukens - San Francisco CA, US
Woojin Jung - San Mateo CA, US
Yue Chen - San Jose CA, US
Zhiwei Gu - Cupertino CA, US
Derek Iwamoto - Sunnyvale CA, US
Siddharth Nangia - San Francisco CA, US
Scott D. Morrison - Austin TX, US
Kevin A. Klenk - Sunnyvale CA, US
Neeloy Roy - San Francisco CA, US

International Classification:

H01Q 1/24
H01Q 1/22
H01Q 9/04
H01Q 1/52

Abstract:

A wireless communication system may include an electronic device having a wireless communication module. The wireless communication module may include an antenna radiating element on a first surface, a ground ring surrounding the antenna radiating element on the first surface, and a radio component mounted to a second surface. The wireless communication module may be incorporated into a system package that also includes other components. Encapsulation material may cover the wireless communication module and other components. A shielding material may cover the encapsulation material and be coupled to the ground ring. An opening in the shielding material may be aligned with the antenna radiating element. If desired, the wireless communication system may include external equipment having a wireless communication module communicatively coupled to the wireless communication module to convey firmware testing, debugging, restore, and/or other data.