Patrick W O'Keefe

US Patent:

8349144, Jan 8, 2013

Filed:

Sep 28, 2010

Appl. No.:

12/892360

Inventors:

Russell Weldon Black - Longmont CO, US
Robert Dwayne Gossman - Aurora CO, US
Patrick Lynch O'Keefe - Loveland CO, US

Assignee:

PrimeStar Solar, Inc. - Arvada CO

International Classification:

C23C 14/34

US Classification:

20419212, 20419225, 20419226, 20429809, 20429812

Abstract:

A sputtering cathode is generally provided. The sputtering cathode can include a semiconducting target (e. g. , a cadmium sulfide target, a cadmium tin oxide target, etc. ) defining a sputtering surface and a back surface opposite to the sputtering surface. A backing plate can be positioned facing the back surface of the target and non-bonded to the back surface of the target. A non-bonding attachment mechanism can removably hold the target within the sputtering cathode such that the back surface is facing the backing plate during sputtering.

US Patent:

8460521, Jun 11, 2013

Filed:

Sep 28, 2010

Appl. No.:

12/892414

Inventors:

Robert Dwayne Gossman - Aurora CO, US
Russell Weldon Black - Longmont CO, US
Patrick Lynch O'Keefe - Loveland CO, US

Assignee:

Primestar Solar, Inc. - Arvada CO

International Classification:

C23C 14/00
C25B 11/00
C25B 13/00

US Classification:

20429812, 20429813

Abstract:

A sputtering cathode is generally provided. The sputtering cathode can include a semiconducting target (e. g. , a cadmium sulfide target, a cadmium tin oxide target, etc. ) defining a sputtering surface and a back surface opposite to the sputtering surface. A backing plate can be positioned facing the back surface of the target and non-bonded to the back surface of the target. A non-bonding attachment mechanism can removably hold the target within the sputtering cathode such that the back surface is facing the backing plate during sputtering.

US Patent:

20150077517, Mar 19, 2015

Filed:

Sep 17, 2013

Appl. No.:

14/028868

Inventors:

- San Francisco CA, US
Vikas Muppidi Reddy - Boulder CO, US
Mahmut Candemir Orsan - Superior CO, US
Forrest Francis Heller - Boulder CO, US
Patrick O'Keefe - San Francisco CA, US
YunJa Chen - Boulder CO, US

Assignee:

Occipital, Inc. - San Francisco CA

International Classification:

H04N 13/02
H04N 5/225
H04N 5/33

US Classification:

348 46

Abstract:

One variation of a real-time 3D capture system for a mobile electronic device having a camera includes an infrared projector that projects a pattern onto an imaging target; an infrared sensor that captures the pattern; a control module that controls the projector and sensor, takes data from the sensor, determines depth information from the data, and transmits the depth information to the mobile electronic device; a battery that provides power to the projector, sensor, and control module; a software module connected to the mobile electronic device that controls communication of data from the camera and depth information between the control module and the mobile electronic device; a mounting bracket that removably attaches the apparatus to the mobile electronic device such that the capture system when attached maintains alignment with the camera; and a chassis that holds the projector, sensor, control module, and battery, and attaches to the mounting bracket.

US Patent:

20140238849, Aug 28, 2014

Filed:

Feb 25, 2013

Appl. No.:

13/775613

Inventors:

- Tempe AZ, US
Stacy Ann Black - Longmont CO, US
Robert Dwayne Gossman - Aurora CO, US
Patrick Lynch O'Keefe - Loveland CO, US

Assignee:

First Solar, Inc. - Tempe AZ

International Classification:

C23C 14/34
C23C 14/56

US Classification:

20429808, 20429823, 20429811, 20429812, 20429813, 20429826, 427299

Abstract:

Sputtering chambers including one or more first sputtering targets within the sputtering chamber and one or more second sputtering targets are generally provided. Each first sputtering target comprises a source material, and each second sputtering target comprises the source material and a dopant. A conveyor system is configured to transport a plurality of substrates through the sputtering chamber to deposit a thin film onto a surface of each substrate. A power source is electrically connected to each of the first sputtering targets and the second sputtering target. A target shield can also be included within the sputtering chamber, and can be positioned between a portion of the second sputtering target and the conveyor system. The dopant can be present within the second sputtering target as a discrete insert within a cavity defined by the source material. Methods are also provided for making a sputtering target and depositing a thin film.