Paul Richard Davidson

US Patent:

51607859, Nov 3, 1992

Filed:

Jul 9, 1991

Appl. No.:

7/727844

Inventors:

Paul R. Davidson - Richmond VA

Assignee:

E. R. Carpenter Company, Inc. - Richmond VA

International Classification:

B32B 326
A47C 2700
A47C 2714

US Classification:

4283166

Abstract:

A resilient padding body which comprises an intermediate base layer and upper protruberances extending upwardly off the surface of the base layer and bottom protruberances extending downwardly off a lower surface of the base layer. The padding body includes longitudinal and lateral upper recesses which are formed between the upper protruberances. The upper protruberances have side walls which slope inwardly to form an object which is in the shape of a trancated pyramid and angled recesses. The base of the upper protruberances is essentially coplanar with the base member's upper surface. The base of each upper protruberance is separated by a slit which extends into the base member for about one half of the base member's thickness. The bottom protruberances include foundation sections which have vertical side walls. The foundation sections are spaced sufficiently to form a narrow channel between adjacent foundation section walls.

US Patent:

D3295664, Sep 22, 1992

Filed:

Jun 11, 1991

Appl. No.:

7/713336

Inventors:

Paul R. Davidson - Richmond VA

Assignee:

E.R. Carpenter Company, Inc. - Richmond VA

US Classification:

D 6601

US Patent:

20200164453, May 28, 2020

Filed:

Jan 30, 2020

Appl. No.:

16/776966

Inventors:

- Cupertino CA, US
Paul Davidson - Eden Prairie MN, US
Ralph Smith - Eden Prairie MN, US

International Classification:

B23K 1/005
B23K 3/06
B23K 1/00

Abstract:

A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to and at an angle relative to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube having tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to liquefy the solder sphere until it falls from the exit orifice, waiting for a predetermined time period after the liquefied solder sphere has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.

US Patent:

20200038982, Feb 6, 2020

Filed:

Aug 1, 2018

Appl. No.:

16/051682

Inventors:

- Cupertino CA, US
Paul Davidson - Eden Prairie MN, US
Amy Jo Bergerud - Minneapolis MN, US

International Classification:

B23K 3/06

Abstract:

Implementations described and claimed herein address the foregoing problems by providing a soldering method including mixing a plurality of spheres in a bond-head hopper wherein a first number of the plurality of the spheres have a diameter that is at least fifty (50) percent larger than the rest of the plurality of spheres.

US Patent:

20180147646, May 31, 2018

Filed:

Nov 28, 2016

Appl. No.:

15/361714

Inventors:

- Cupertino CA, US
Scott Daemon Matzke - Shakopee MN, US
Paul Davidson - Eden Prairie MN, US
Christopher R. Libby - St. Paul MN, US

International Classification:

B23K 1/005
H01R 43/02

Abstract:

A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.

US Patent:

20170056995, Mar 2, 2017

Filed:

Aug 24, 2015

Appl. No.:

14/833549

Inventors:

- Cupertino CA, US
Paul Davidson - Eden Prairie MN, US
Ralph Smith - Eden Prairie MN, US

International Classification:

B23K 1/005
B23K 1/00

Abstract:

A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube comprising tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to provide a level of thermal energy to liquefy the solder sphere until it falls from the exit orifice toward the connection area between the first and second components, detecting the movement of the liquefied solder sphere after it has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.