Paul Raymond Reed

US Patent:

7225537, Jun 5, 2007

Filed:

Jan 27, 2005

Appl. No.:

11/044329

Inventors:

Paul Reed - Seattle WA, US

Assignee:

Cardxx, Inc. - Englewood CO

International Classification:

H05K 3/30

US Classification:

29841, 29827, 235488, 235492

Abstract:

Memory Cards containing Integrated Circuits and other electronic components (e. g. resistors) in a variety of form factors having high quality external surfaces of polycarbonate, synthetic paper (e. g. Teslin), or other suitable material (e. g. PVC) can be made through use of injection molded thermoplastic material or thermosetting material that becomes the core layer of said Memory Cards and similar devices. The object of the invention is to provide the following properties to Memory Cards: rapid production cycle, high volume manufacturing throughput, security, electronics protection, better tamper resistance, durability, and highly reliable complex electronics encapsulation, achieved through a process utilizing low temperature and low pressure.

US Patent:

8012809, Sep 6, 2011

Filed:

Mar 23, 2005

Appl. No.:

11/661206

Inventors:

Paul Reed - Shoreline WA, US

Assignee:

CardXX, Inc. - Englewood CO

International Classification:

H01L 21/44
H01L 21/48
H01L 21/50
H01L 21/82
H01R 43/00
H05K 3/30
H05K 13/00
G06K 19/02

US Classification:

438126, 29827, 29841, 29856, 235488, 264139, 257E21499, 257E21502, 257E21575

Abstract:

Advanced Smart Cards and similar form factors (e. g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material can be made with highly sophisticated electronic components (e. g. Integrated Circuit chips, batteries, microprocessors, Light Emitting Diodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in the bottom layer of the card structure, through use of injection molded thermosetting or thermoplastic material that becomes the core layer of said Advanced Smart Cards. A lamination finishing process can provide a high quality lower surface, and the encapsulation of the electronic components in the thermosetting or thermoplastic material provides protection from the lamination heat and pressure.

US Patent:

8324021, Dec 4, 2012

Filed:

Nov 9, 2010

Appl. No.:

12/942706

Inventors:

Paul Reed - Shoreline WA, US

International Classification:

H01L 21/44
H01L 21/48
H01L 21/50
H05K 3/30
G06K 19/077
G06K 19/02

US Classification:

438106, 29841, 235488

Abstract:

An advanced smart card with a top layer, a core layer of thermoset polymeric material, and a bottom layer comprising an integrated electronics assembly mounted on a substrate. The advanced smart card is formed by positioning a bottom layer in a bottom mold, placing a top layer in a top mold, closing the mold, injecting a thermosetting polymeric material to form a precursor advanced smart card, removing the precursor, and trimming the precursor to produce a finished smart card.

US Patent:

20140124583, May 8, 2014

Filed:

Dec 2, 2012

Appl. No.:

13/691818

Inventors:

Paul Stuart Reed - Shoreline WA, US

International Classification:

G06K 19/073

US Classification:

235488, 438127

Abstract:

An advanced smart card comprising a top layer, a core layer of thermoset polymeric material, and a bottom layer comprising an Integrated Electronics Assembly. The Integrated Electronics Assembly may comprise a battery, a processor, a display, a switch, a magnetic stripe communications device, a flexible printed circuit, a fingerprint sensor, a biometric sensor, and an acoustic speaker. The advanced smart card may be used for functions such as: access control for building entry, data display for bank cards or ATM cards, password entry for identification cards, and fingerprint verification for security-related applications.